WINSTON-SALEM, N.C. – June 16, 2020 – TE Connectivity (TE) has added Read More → "TE Connectivity adds XRC, SRC and ML-XT connectors and XRC terminals to portfolio"
SANTA ROSA, Calif., June 16, 2020
Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, today announced it is expanding the company’s RP7900 Series with two new bidirectional, regenerative DC power supplies providing integrated safety features that protect people and devices under test (DUT). The … Read More → "Keysight’s New Regenerative Power Supplies Reduce Cooling and Electricity Costs with an Eco-friendly Design"
San Diego, CA, 16 June 2020 * * * congatec – a leading vendor of embedded computing technology – presents its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation in vision applications. One VM runs a vision based AI application on the basis of Intel OpenVino software for situational awareness, the second VM is real-time capable and runs deterministic control software, … Read More → "congatec presents Intel IoT RFP Kit for workload consolidation in vision based situational awareness applications"
Cambridge, UK, 16 June 2020:
Agile Analog, a leading provider of semiconductor analog IP, today announced that they have worked with EnSilica, a leading fabless design house focused on custom ASIC design and supply services, to both fabricate and test their latest analog IP … Read More → "Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips"
June 16, 2020
TDK Corporation (TSE: 6762) introduces the InvenSense T3902, the world’s lowest power Pulse Density Modulation (PDM) microphone for mobile, IoT and other consumer devices. The T3902 is an … Read More → "TDK announces world’s lowest-power PDM microphone, T3902"
San Jose, California, June 15, 2020 – Lynx Software Technologies, an innovator in modern platform software technologies, today announced LYNX MOSA.ic™ based bundles that bring the flexibility, scalability, and intelligent functionalities of edge computing to mission critical use cases. Lynx refers to this as the Mission Critical Edge, which it estimates to be a $16B software opportunity.
Lynx is initially rolling out three new MOSA.ic bundles. LYNX Read More → "Lynx moves to strengthen Mission Critical Edge Computing with LYNX MOSA.ic™ bundles"
Uppsala, Sweden—June 15, 2020—IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces an update of its static code analysis tool C-STAT®, an add-on product completely integrated in the complete C/C++ compiler and debugger toolchain IAR Embedded Workbench®. The latest version of C-STAT adds coverage for MISRA C:2012 Amendment 1.
C-STAT performs advanced code analysis to find potential issues. The analysis provides code alignment with industry standards like MISRA C:2012, MISRA C++:2008 and MISRA C:2004, and also detects defects, bugs, and security vulnerabilities as defined by … Read More → "IAR Systems enables secure code with updated MISRA C compliance in leading development tools"
GRENOBLE, France – June 15, 2020 – CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.
Institute researchers fabricated GAA nanosheet transistors with seven levels of stacked silicon channels, more than twice as many as state-of-the-art today, with widths ranging from 15nm to 85nm. The results were summarized in the paper, “7-Levels-Stacked Nanosheet GAA Transistors for High Performance Computing”, presented virtually during the 2020 Symposia on VLSI Technology & … Read More → "CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process"
OTTAWA, Ontario, Canada, June 15, 2019 – GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished Read More → "GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition"
SAN JOSE, Calif., June 15, 2020 (GLOBE NEWSWIRE) — Posifa Technologies today announced its new Read More → "Posifa Technologies Introduces Next-Generation Air Flow Sensors for Respiratory Care and Other Medical Applications"
