Sarcina Technology advances photonic package design to address key data center challenges
June 5, 2025
Palo Alto, CA – 4 June 2025. Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves. Sarcina’s pioneering work in photonic package design is enabling a new era of high data rate, high bandwidth and low power interconnects.
Traditional copper interconnects can no longer meet the performance, power and density demands of next generation data center systems. Copper interconnects become … Read More → "Sarcina Technology advances photonic package design to address key data center challenges"
