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Keysight’s New Network Analyzers with High Performance Signal Generators Simplify and Speed Complex Measurements

Enables customers to take accurate measurements with less phase noise interference
June 25, 2020

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, has enhanced the company’s performance network analyzers (PNA and Read More → "Keysight’s New Network Analyzers with High Performance Signal Generators Simplify and Speed Complex Measurements"

Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages

Up to 90% space saving over current SMD devices; AOI-capable
June 25, 2020

Nijmegen, June 23 2020: Nexperia, the expert in essential semiconductors, today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

Automotive qualified … Read More → "Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages"

TE Connectivity extends capabilities for commercial vehicles with SUPERSEAL pro connectors

Reliable and cost-effective solution for commercial-vehicle applications
June 25, 2020

WINSTON-SALEM, N.C. – June 23, 2020 – The commercial vehicle market is requiring manufacturers to extend the capabilities of commercial vehicle solutions to include greater efficiency and performance, especially in the area of sealed inline connectors for lower vibration chassis applications.  In response to this trend, TE Connectivity (TE), a world leader in connectivity and sensors, has launched its next-generation inline connector for commercial vehicles: Read More → "TE Connectivity extends capabilities for commercial vehicles with SUPERSEAL pro connectors"

EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s

COSMICC Project Breakthroughs ‘Will Answer Tremendous Market Needs with a Target Cost per Bit that Traditional Wavelength-Division Multiplexing Transceivers Cannot Meet’
June 25, 2020

GRENOBLE, France – June 23, 2020 – CEA-Leti today announced the demonstration of a fully packaged CWDM optical transceiver module with data transfer of 100 Gb/s per fiber with a low-power-consumption electronic chip co-integrated on the photonic chip. This silicon-photonics-based transceiver multiplexes two wavelengths at 50 Gb/s and is designed to meet the ever-increasing data-communication demands and energy use of data centers and supercomputers.

The EU H2020 project,  … Read More → "EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s"

IAR Systems delivers advanced trace for RISC-V based applications

Enhanced support for the SiFive Insight solution in IAR Embedded Workbench brings leading debug and trace capabilities to the RISC-V community
June 24, 2020

Uppsala, Sweden—June 24, 2020—IAR Systems®, the future-proof supplier of software tools and services for embedded development, has extended the complete development toolchain IAR Embedded Workbench® for RISC-V with support for trace as implemented by SiFive Insight, the industry’s first combined pre-integrated trace and debug solution for the freely-available, open-specification RISC-V ISA.

In addition to simplifying debugging … Read More → "IAR Systems delivers advanced trace for RISC-V based applications"

Siemens acquires UltraSoC to drive design for silicon lifecycle management

June 24, 2020
  • Acquisition expands Xcelerator portfolio and creates data-driven product lifecycle management solutions for system-on-chip (SoC)
  • Integration of cybersecurity, functional safety, and the management of complexity can enhance product quality, safety, and time-to-revenue across industries ranging from automotive and factory automation to high-performance computing

Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC). Siemens plans to integrate UltraSoC’s technology into the </ … Read More → "Siemens acquires UltraSoC to drive design for silicon lifecycle management"

Renesas Ushers in New Era of Industrial Motor Commutation with High-Accuracy Inductive Position Sensing

IPS2200 Delivers Total Stray-Field Immunity, Lower Weight, and Cost-Effective Design in a Thin Profile for Industrial Motors
June 24, 2020

TOKYO, Japan, June 24, 2020 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the magnet-free IPS2200 inductive position sensor. Featuring high accuracy and speed, total stray field immunity, and efficient motor integration in a thin and lightweight form factor, the IPS2200 is ideal for use as an absolute position sensor in a wide range of industrial, medical, and robot applications. The sensor allows customers to cost effectively tailor sensor design for their applications and maximize the performance of the sensor’s accuracy.

“Inductive position sensing is changing the game for industrial … Read More → "Renesas Ushers in New Era of Industrial Motor Commutation with High-Accuracy Inductive Position Sensing"

RS Components introduces RX23E-A analogue front-end microcontrollers from Renesas for precision sensing and measurement applications

Advanced single-chip solutions integrate analogue circuitry and microcontroller to deliver better than 0.1% precision for a wide range of sensing and measurement equipment for manufacturing and test applications
June 24, 2020

LONDON, UK, 23 June 2020 – RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers and suppliers, has introduced a new series of single-chip devices from Renesas, the RX23E-A microcontrollers (MCUs) which combine an analogue front end (AFE) and an MCU core for use in equipment that delivers high-precision measurements of analogue signals, such as temperature, pressure, weight, or flow.

Designed for manufacturing and test and measurement equipment, such as sensing or force measuring devices or temperature controllers, the RX23E-A group of MCUs offer better than 0.1% precision without … Read More → "RS Components introduces RX23E-A analogue front-end microcontrollers from Renesas for precision sensing and measurement applications"

NTC thermistors — Robust temperature sensor for e-mobility

June 24, 2020

une 23, 2020

TDK Corporation presents the new B58703M1103A* temperature sensor − specifically developed for demanding e-mobility applications, which call for significant long-term stability. The NTC sensor is designed for a temperature range of -40°C to +150°C, whereby a temporary load of up to 200°C is permitted. At 25°C, the rated resistance is 10 kΩ with a B25/100 value of 3625 K and a tolerance of ±1 percent.

The sensor has been subjected to climatic, chemical and mechanical testing according to the service life tests of LV 124, and in doing so, has achieved electrical resistance class H3 according … Read More → "NTC thermistors — Robust temperature sensor for e-mobility"

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