News – Page 835 – EEJournal

Magnetic Sensors – TDK brings redundancy to its TMR angle sensor portfolio and aligns with ASIL D safety standard

July 1, 2020

TAD4140 is a new, fully redundant TMR angle sensor with digital output in a
TSSOP16 package for automotive and industrial applications
The new sensor is able to simultaneously measure speed, direction, and motor position
High-angular accuracy, high-diagnostic coverage, and advanced compensation algorithms make sensor suitable for BLDC motor commutation applications
Full-signal redundancy with two electrically-isolated outputs that supports ASIL D system requirements
June 30, 2020

TDK Corporation (TSE:6762) has announced the expansion of its tunnel-magnetoresistance (TMR) angle sensor portfolio with the new digital TAD4140 sensor. Designed for demanding automotive … Read More → "Magnetic Sensors – TDK brings redundancy to its TMR angle sensor portfolio and aligns with ASIL D safety standard"

Telit Launches Low-Cost, High-Security, Low-Power IoT Module with Fully Integrated 802.11n and Bluetooth Low Energy

July 1, 2020

Unique combination of affordability, WPA3 security and long battery life meets demand in booming verticals such as smart homes and industrial automation
WE310F5 module enables high-speed wireless connectivity to embedded microcontrollers over UART, SPI and SDIO interfaces, with over-the-air firmware upgradeability

London, July 1, 2020 – Telit, a global enabler of the Internet of Things (IoT), today announced the WE310F5, a fully integrated, single-band Wi-Fi and Bluetooth Low Energy (BLE5) module that provides high-speed wireless connectivity to an embedded microcontroller over UART, SPI and SDIO interfaces. The new … Read More → "Telit Launches Low-Cost, High-Security, Low-Power IoT Module with Fully Integrated 802.11n and Bluetooth Low Energy"

New silicon carbide power module for electric vehicles

July 1, 2020

Munich, Germany – 30 June 2020 – Silicon carbide in electric vehicles stands for more efficiency, higher power density and performance. Particularly with an 800 V battery system and a large battery capacity, silicon carbide leads to a higher efficiency in inverters and thus enables longer ranges or lower battery costs. At its virtual PCIM booth (July 1-3), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will present the EasyPACK™ module with CoolSiC™ … Read More → "New silicon carbide power module for electric vehicles"

VadaTech Announces a new 3U VPX, Dual ADC 12-bit @ 6.4 GSPS or Quad ADC @ 3.2 GSPS with Virtex UltraScale+

July 1, 2020

Henderson, NV – June 29, 2020 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX572. The VPX572 provides a dual ADC with sampling rates of up to 6.4 GSPS at 12-bit resolution (ADC12DJ3200). The ADCs are capable of being configured to run as quad channel each running at 3.2 GSPS. The XCVU13P FPGA has large 360 Mb on-chip UltraRAM which is excellent for applications such as radar simulation and smart jamming. The FPGA interfaces directly to rear I/O via SERDES and LVDS, supporting PCIe, SRIO, GbE/10GbE/40GbE or Aurora backplane connections. … Read More → "VadaTech Announces a new 3U VPX, Dual ADC 12-bit @ 6.4 GSPS or Quad ADC @ 3.2 GSPS with Virtex UltraScale+"

Performance gains in new digital X-ray readout IC from ams achieve clearer images at lower radiation doses

July 1, 2020

New AS5850A is a 256-channel digital readout IC for medical flat panel detectors
As a leading provider of image sensors for medical applications, ams’ innovations in chip design and fabrication underpin best-in-class low power, high speed and low noise characteristics
Supporting safer X-ray operation for patients, the new AS5850A advances the ams mission to create “Technology for a better lifestyle”

Premstaetten, Austria (June 30, 2020) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduces a new readout integrated circuit (IC) for digital X-ray flat panel detectors ( … Read More → "Performance gains in new digital X-ray readout IC from ams achieve clearer images at lower radiation doses"

Low Voltage Automotive Buck Converter from Diodes Incorporated with Programmable PFM/PWM for Enhanced Efficiency

July 1, 2020

Plano, Texas – June 30, 2020 – Diodes Incorporated (NASDAQ: DIOD) today announced the AP61100Q, a 5.5V, 1A continuous output current, automotive-compliant, synchronous buck converter for point of load (POL) applications. With a fully integrated 110mΩ high-side power MOSFET and 80mΩ low-side power MOSFET, it provides high-efficiency step-down DC-DC conversion from 5V and 3.3V input rails. The converter has been … Read More → "Low Voltage Automotive Buck Converter from Diodes Incorporated with Programmable PFM/PWM for Enhanced Efficiency"

Silicon Labs Strengthens Commitment to Wi-SUN as Scalable, Open LPWAN Standard for Smart City, Smart Utility and Industrial IoT

Joins Wi-SUN Alliance Board of Directors to Advance Widely Used Mesh Networking Standard

July 1, 2020

AUSTIN, Texas – June 30, 2020 – Read More → "Silicon Labs Strengthens Commitment to Wi-SUN as Scalable, Open LPWAN Standard for Smart City, Smart Utility and Industrial IoT"

Himax Launches WiseEye WE-I Plus HX6537-A to Support AI Deep Learning with Google’s TensorFlow Lite for Microcontrollers

July 1, 2020

TAINAN, Taiwan, June 30, 2020 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the launch of WiseEye WE-I Plus HX6537-A solution that supports Google’s TensorFlow Lite for Microcontrollers. In this collaboration, Himax is providing the HX6537-A processor with NN (neural network) based SDK (Software Development Kit) for developers to generate deep learning inferences running on TensorFlow Lite for Microcontrollers kernel to boost overall system AI performance.

The Himax WiseEye solution is composed of the Himax HX6537-A processor and … Read More → "Himax Launches WiseEye WE-I Plus HX6537-A to Support AI Deep Learning with Google’s TensorFlow Lite for Microcontrollers"

SLX FPGA 2020.2 Delivers Significant Usability Improvements

New project importer and faster analysis times enable faster time-to-market

June 30, 2020

San Jose, CA – Jun 30, 2020 – Silexica (silexica.com) has announced the release of SLX FPGA 2020.2 which includes several usability improvements for new and advanced HLS users. The new Vivado/Vitis HLS project importer quickly and easily enables engineers to import an existing Xilinx HLS project to evaluate and get started with SLX FPGA. Further optimizations in the SLX FPGA analysis engine, combining both static and dynamic analysis, result in 7x faster, … Read More → "SLX FPGA 2020.2 Delivers Significant Usability Improvements"

Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production

Built on a proven platform with a robust production ecosystem, 12LP+ offers AI application designers an efficient development experience and fast time-to-market

June 30, 2020

Santa Clara, Calif., June 30, 2020 – GLOBALFOUNDRIES^® (GF^®), the world’s leading specialty foundry, today announced its most advanced FinFET solution, 12LP+, has completed technology qualification and is ready for production.

GF’s differentiated 12LP+ solution is optimized for artificial intelligence (AI) training and inference applications. Built on a proven platform with a robust production ecosystem, 12LP+ offers chip designers an efficient development experience and a fast time-to-market.

Contributing to its best-in-class combination of performance, power and area, 12LP+ introduces new features including an updated standard cell library, an interposer for 2.5D packaging, … Read More → "Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production"