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New automotive TrEOS ESD protection from Nexperia combines high signal integrity, low clamping voltage and high surge robustness

Nijmegen, September 15, 2020: Nexperia, the expert in essential semiconductors, has introduced four new TrEOS ESD protection devices that are AEC-Q101- qualified for automotive use and high temperature capable up to 175°C. In common with all TrEOS components, the new parts combine extremely low capacitance ensuring high signal integrity, extremely low clamping and high robustness for modern automotive interfaces. Specific automotive applications include infotainment, multimedia and ADAS systems featuring … Read More → "New automotive TrEOS ESD protection from Nexperia combines high signal integrity, low clamping voltage and high surge robustness"

DSM Partners with Nexa3D to Deliver New Class of Sustainable Laser Sintering Materials for Ultrafast Additive Series Production

  • Partnership underscores both companies’ commitment to increase the adoption of additive manufacturing through collaborations that deliver orders of magnitude productivity improvements and sustainable production
  • DSM’s Arnite® T AM1210 (P) is the first-ever polybutylene terephthalate (PBT) powder commercially available for series production of industrial and automotive electronics
  • Nexa3D to include DSM’s PBT laser sintering material in its Quantum Laser Sintering QLS™ 350 starter kit beginning Q1 2021

Geleen, Netherlands and Ventura, California, September 15, 2020 – Read More → "DSM Partners with Nexa3D to Deliver New Class of Sustainable Laser Sintering Materials for Ultrafast Additive Series Production"

ACEINNA Launches OpenIMU ROS Driver for Development of Robotic Navigation Systems

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Andover, Massachusetts- Sept 15, 2020

ACEINNA, one of the world’s leading developers of inertial based guidance and navigation systems for autonomous vehicles and devices, today announced the availability of their new ACEINNA OpenIMU ROS Driver for developers of robots and robotic applications.

“This new ROS driver makes it simple to integrate a wide variety of ACEINNA IMUs (Inertial Measurement Unit sensors) into almost any robotics applications (warehouse robotics, autonomous vehicles, last mile deliver robotics, etc.), which uses ROS,” says James … Read More → "ACEINNA Launches OpenIMU ROS Driver for Development of Robotic Navigation Systems"

Microchip Partners with Machine-Learning (ML) Software Leaders to Simplify AI-at-the-Edge Design Using its 32-Bit Microcontrollers (MCUs)

CHANDLER, Ariz., September 15, 2020 – Microchip Technology (Nasdaq: MCHP) today announced it has partnered with Cartesiam, Edge Impulse and Motion Gestures to simplify ML implementation at the edge using the company’s ARM Cortex based 32-bit micro-controllers and microprocessors in its MPLAB X Integrated Development Environment (IDE). Bringing the interface to these partners’ software and solutions into its design environment uniquely positions Microchip to support customers through all phases of their AI/ML projects including data gathering, training the models and inference implementation.

“Adoption of our 32-bit MCUs in AI-at-the-edge applications is growing rapidly and … Read More → "Microchip Partners with Machine-Learning (ML) Software Leaders to Simplify AI-at-the-Edge Design Using its 32-Bit Microcontrollers (MCUs)"

Synopsys Publishes BSIMM11 Study Highlighting Fundamental Shifts in Software Security Initiatives in Response to DevOps and Digital Transformation

GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series

Santa Clara, Calif., September 14, 2020 – GLOBALFOUNDRIES® (GF®) today announced it will launch its Global Technology Conferences (GTC) 2020 series virtually with their first event, GTC North America on September 24. The one-day conference, themed ‘Accelerating the Digital Future’, is an opportunity for hundreds of customers and industry experts to engage and gain insight into how GF is helping to shape the digital transformation with the latest approaches and solutions for AI, IoT and 5G.

“Semiconductors play a vital role in our lives now more than ever, presenting both opportunities and challenges for our industry,” said Juan Read More → "GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series"

Pixus Announces Versatile Development Enclosures Supporting SOSA & OpenVPX

Waterloo, Ontario  —  Sept 9, 2020 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers versatile backplane/chassis configurations geared for 3U and 6U OpenVPX and SOSA development. 

The versatile development enclosures start with a line of 1-slot power and ground backplanes in various 3U and 6U configurations.  This includes VITA 65 (standard VPX), VITA 66.4 (VPX with optical), and VITA 67.3 types (VPX with RF).  The backplanes can be incorporated along with other designs, including a 3U version with 4 VITA 65 slots and 4 VITA 67.3 slots.  It features the radial clocking required … Read More → "Pixus Announces Versatile Development Enclosures Supporting SOSA & OpenVPX"

Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation IP Solution

HILLSBORO, OR – September 9, 2020 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced a Single Wire Aggregation (SWA) IP solution for reducing overall system size and BOM cost in industrial, consumer, and computing applications. The solution is a quick, easy, and innovative way for developers to use low power, small form factor Lattice FPGAs to dramatically reduce the number of board-to-board … Read More → "Lattice Shrinks Design Footprint and Cost, Boosts Reliability in Embedded Systems with Single Wire Aggregation IP Solution"

VOLANSYS launches “IoTPAD” – a “Zero Cost” IoT Product Launchpad to Drive IoT at Scale

SANTA CLARA, CA. SEPTEMBER 9, 2020

VOLANSYS, a one-stop IoT Solutions Provider is excited to announce the launch of a new program called IoTPAD. As part of IoTPAD, qualifying participants will be eligible to leverage VOLANSYS Gateway & Cloud platforms at Zero Cost during the pre-launch period.

IoT solution developers face multiple challenges in the form of identifying the right ready-to-use yet customizable platform, resources to convert this platform into an end product and up-front investment to maneuver through development & pilot phases. To help ecosystem partners develop cost-effective solutions, VOLANSYS  brings an IoTPAD program for OEMs, … Read More → "VOLANSYS launches “IoTPAD” – a “Zero Cost” IoT Product Launchpad to Drive IoT at Scale"

ventureLAB and Silicon Catalyst partner to expand hardware and silicon ecosystem in Canada

MARKHAM, Ontario, SILICON VALLEY, California – September 14, 2020 — ventureLAB announced today that it has partnered with Silicon Catalyst to expand its reach for the Hardware Catalyst Initiative (HCI), Canada’s first hardware and silicon lab and incubator. Silicon Catalyst is the world’s only incubator focused exclusively on accelerating solutions in silicon, offering a coalition of in-kind and strategic partners to dramatically reduce the cost and complexity of development.

With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization. The incubator/accelerator supplies startups … Read More → "ventureLAB and Silicon Catalyst partner to expand hardware and silicon ecosystem in Canada"

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