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TE Connectivity’s AMPSEAL 16 high temperature connectors now available

WINSTON – SALEM, N.C. – January 21, 2020 – As an extension of the well-proven and widely known AMPSEAL 16 series, TE Connectivity’s (TE), a world leader in connectivity and sensors, Read More → "TE Connectivity’s AMPSEAL 16 high temperature connectors now available"

DVCon U.S. 2021 Provides Outstanding Technical Program on Virtual Platform

Gainesville, FL —January 21, 2021 —The 2021 Design and Verification Conference and Exhibition (DVCon) U.S. will be held on a virtual platform with a combination of recorded and live Q&A. The information-packed technical program runs four days and includes 42 papers, four tutorials, 14 posters, two panels, 18 short workshops and a keynote focused on computational logistics for system and software verification. Sponsored by Accellera Systems Initiative, DVCon U. … Read More → "DVCon U.S. 2021 Provides Outstanding Technical Program on Virtual Platform"

Integrated Impedance-Matching and Protection IC from STMicroelectronics Simplifies Portable GNSS Receivers

Geneva, January 21, 2021 – STMicroelectronics’ BPF8089-01SC6 RF front-end for Global Navigation Satellite System (GNSS) receivers simplifies design and saves real-estate by integrating the impedance-matching and electrostatic-discharge (ESD) protection circuitry typically implemented using discrete components.

The BPF8089-01SC6 provides a 50Ω matched … Read More → "Integrated Impedance-Matching and Protection IC from STMicroelectronics Simplifies Portable GNSS Receivers"

Abaco Systems Announces the MAGIC1A, a High Performance Embedded Computer with a Modular, Scalable Approach to System Design and Architecture

HUNTSVILLE, Ala.— January 21, 2021 Abaco Systems, Inc. announces the MAGIC1A, a high performance embedded computer (HPEC) with a modular, scalable approach to system design and architecture; based on 3U-VPX technology. The MAGIC1A improves on a legacy design and delivers the latest in graphics and computer processing in a rugged SWaP-C3 display computer, which ensures seamless integration and showcases Abaco’s commitment to an extensive technology roadmap. This small factor system provides cutting edge processing and graphics, which meets rugged computer needs for industrial and military customers.

The MAGIC1A … Read More → "Abaco Systems Announces the MAGIC1A, a High Performance Embedded Computer with a Modular, Scalable Approach to System Design and Architecture"

Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to Popular Application Solutions

TOKYO, Japan, January 21 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its new “Lab on the Cloud” environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that customers can access and test online. The Lab on the Cloud is accessible at www.renesas.com/labonthecloud.

The Lab on the Cloud provides users with quick … Read More → "Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to Popular Application Solutions"

ROHM Completes Construction of a New Environmentally Friendly Building at its Apollo Chikugo Plant to Expand Production Capacity of SiC Power Devices

Santa Clara, CA and Kyoto, Japan, Jan. 21, 2021 (GLOBE NEWSWIRE) — ROHM recently held an opening ceremony announcing the completion of a new building at their Apollo Chikugo plant, started in February 2019, to enhance the production capacity of Read More → "ROHM Completes Construction of a New Environmentally Friendly Building at its Apollo Chikugo Plant to Expand Production Capacity of SiC Power Devices"

ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces

Summary:
● ADLINK’s new PXES-2314T is a 4-slot Thunderbolt™ 3 PXI Express chassis that accommodates a wide range of test and measurement applications
● Compact system configuration enhances portability and enables mobile test applications without sacrificing system bandwidth
● Maintains the performance and flexibility advantages of PXI Express but in a more affordable and convenient form factor

Taipei, Taiwan – January 21, 2021

ADLINK Technology Inc., a global leader in edge computing, has introduced the PXES-2314T, a new generation PXI Express chassis with versatile, high bandwidth Thunderbolt™ 3 interfaces. Unlike traditional PXI Express systems, which are usually … Read More → "ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces"

Avnet Integrated, Schneider Electric and Iceotope Deliver the Industry’s First Commercially Available HPC Micro Data Center Solution Cooled by Integrated Chassis-Level Immersion

PHOENIX – Jan. 21, 2021 – Avnet (Nasdaq: AVT), Schneider Electric and Iceotope have been joined by Lenovo to deploy its Lenovo ThinkSystem SR670 servers in a highly scalable, GPU-rich< … Read More → "Avnet Integrated, Schneider Electric and Iceotope Deliver the Industry’s First Commercially Available HPC Micro Data Center Solution Cooled by Integrated Chassis-Level Immersion"

CellBounce, a Division of ADT, Uses SiTime MEMS Timing in Cellular Bridge Solution for Home Security

SANTA CLARA, Calif., January 21, 2021 – SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced that CellBounce, a division of ADT, has chosen the SiTime Elite Platform® Super-TCXO® for its 3G-to-4G conversion solution that is certified for use on the AT&T 4G cellular network.

“Our proprietary 3G-to-4G bridge solution requires very stable timing over its operating life,” said Jay … Read More → "CellBounce, a Division of ADT, Uses SiTime MEMS Timing in Cellular Bridge Solution for Home Security"

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