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Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance

TAICHUNG, Taiwan and Mountain View, CA– January 26, 2021 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex LogixÒ for demanding Artificial Intelligence (AI) applications such as object recognition.

The Winbond LPDDR4X chip is being paired with Flex Logix’s InferX™ X1 edge inference accelerator chip, which is based on an innovative architecture that features arrays of reconfigurable Tensor Processors. This provides higher throughput and lower latency at lower cost than existing … Read More → "Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance"

Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop

Sunnyvale, CA. — January 27, 2020 — Mirabilis Design announces VisualSim VPS, a platform that combines VisualSim hardware model with Gem5 Instruction Set. This integration brings together the software execution capabilities of Gem5 with the validated semiconductor /embedded /network libraries in VisualSim.  VisualSim VPS supports 32-bit and 64-bit architectures, multi-core, and out-of-order processors. Instruction sets available are ARMv7, ARM v8, ARM SVE, RISC-V, x86, Power and CUDA GPU. All Instruction Sets in VPS come pre-loaded with Linux and a graphical debugger.
“Our customers can now map the software task graph onto a hardware platform, get the scheduled optimized and … Read More → "Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop"

Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained Applications

Düsseldorf, January 27, 2021  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with 48 new RA2E1 Group MCUs. Based on the 48-MHz Arm® Cortex®-M23 core, the RA2E1 MCUs are entry-line, single-chip devices with up to 128-KB code flash and 16-KB … Read More → "Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained Applications"

GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability

SAN JOSE, Calif. and GUANGZHOU, China, Jan. 27, 2021 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce the release of its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain.

AEC-Q100 has been in place for over 20 years defining the reliability qualification requirements for Automotive integrated circuits. To get a certificate meeting the AEC-Q100 Grade 2 requirements, a manufacturer is required to submit a product to extreme environmental challenges. GOWIN has submitted and passed all the requirements for their … Read More → "GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability"

Ansys 2021 R1 Unlocks Unlimited Possibilities for Engineering Teams

Key Highlights

  • With the newly launched Ansys 2021 R1, engineers harness advances in simulation technology together with ever-increasing computing power to drive new levels of product innovation
  • Ansys 2021 R1 equips engineers to design the next generation of products that are safe, reliable and deliver breakthrough performance

PITTSBURGH, PA, January 26, 2021 – Recently launched Ansys 2021 R1 products deliver improvements in simulation technology along with the immense compute power of high-performance computing to reimagine what is now possible for global engineering teams. Read More → "Ansys 2021 R1 Unlocks Unlimited Possibilities for Engineering Teams"

Synopsys Delivers Industry’s First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications

MOUNTAIN VIEW, Calif., Jan. 27, 2021 /PRNewswire/ —

Highlights

Pasternack Launches New Line of Economical Rubber Duck Antennas

IRVINE, Calif. – Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has just released a new line of rubber duck antennas that are designed to address WLAN, IoT, Utilities, SCADA, LoRA, cellular and inventory tracking applications.

Pasternack’s 12 new Read More → "Pasternack Launches New Line of Economical Rubber Duck Antennas"

Wind River Studio Powers Mission-Critical Intelligent Systems

News Highlights

New Vishay Intertechnology SMD MLCCs Offer Lead (Pb) Bearing Termination Finishes

MALVERN, Pa. — Jan. 27, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable for low Earth orbit (LEO) satellites and other space, military, and avionics applications requiring tin whisker mitigation. Operating temperatures can be as high as +150 °C.

The Vishay Vitramon VJ….32 Lead-Bearing Finish series offers a termination finish with a minimum lead (Pb) content of 4 %. Previously, the option for lead (Pb)-bearing termination finishes was reserved for more expensive Hi-Rel devices. The MLCCs released today provide designers with a cost-effective alternative … Read More → "New Vishay Intertechnology SMD MLCCs Offer Lead (Pb) Bearing Termination Finishes"

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