Synopsys Unleashes PrimeSim Continuum Solution to Accelerate the Design of Hyper-Convergent ICs for Memory, AI, Automotive and 5G Applications
MOUNTAIN VIEW, Calif., April 20, 2021 /PRNewswire/ —
Highlights in this Announcement:
- PrimeSim Continuum provides a unified workflow of best-in-class SPICE and FastSPICE technologies, speeding the creation of analog, RF, mixed-signal, custom digital and memory designs
- Innovative SPICE and FastSPICE architectures and data models deliver 10X faster simulation while maintaining signoff accuracy
- PrimeWave, a newly architected design … Read More → "Synopsys Unleashes PrimeSim Continuum Solution to Accelerate the Design of Hyper-Convergent ICs for Memory, AI, Automotive and 5G Applications"

