News – Page 710 – EEJournal

Infineon’s XDPS2201 hybrid flyback controller delivers ultra-high-power density and outstanding efficiency for USB PD charger and adapter applications

May 3, 2021

Munich, Germany – 3 May 2021 – Rapid technology and market developments in the fast charger and adapter market continuously challenge designers of power supply systems. To meet the increasing demand for higher power density and energy efficiency, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its XDP™ family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology. Available in a DSO-14 SMD package, the XDPS2201 is a highly integrated, multi-mode, digital and configurable hybrid flyback controller targeting … Read More → "Infineon’s XDPS2201 hybrid flyback controller delivers ultra-high-power density and outstanding efficiency for USB PD charger and adapter applications"

e-con Systems™ Launches 4K SONY STARVIS™ Ultra-low Light USB 2 Camera

SONY STARVIS IMX415 Sensor | USB 2 | 4K Ultra-HD Resolution | UVC Compliant Plug and Play

May 3, 2021

San Jose and Chennai (Apr 27, 2021) – After the huge success of our recently launched product e CAM80_CUNX – a MIPI CSI 2 ultra-low light camera based on Sony IMX415 sensor -, e-con Systems™ Inc., a leading embedded camera solutions company brings its UVC compliant USB variant e-CAM82_USB to the market. e-CAM82_USB is a 4K ultra low light USB 2 camera based on the SONY STARVIS™ IMX415 image sensor with the capability to produce … Read More → "e-con Systems™ Launches 4K SONY STARVIS™ Ultra-low Light USB 2 Camera"

Ignion rebrand marks new era for IoT technology with its Virtual Antenna™

Customer support alongside IoT acceleration continues to be at the forefront of company values following revolutionary rebrand

April 30, 2021

BARCELONA, SPAIN, 29 April 2021 – Inspired by wide adoption of its Virtual Antenna™ for IoT devices, Fractus Antennas has rebranded as Ignion, a change that marks a new era of expansion and growth. With over 25 million devices deployed in only the last five years, the benefits of Virtual Antenna™ are making themselves felt across the IoT industry.

Designed to make it easy to deploy an antenna for any IoT device, Virtual Antenna™ slashes development time from months to weeks, ensuring manufacturers can compete effectively. Ignion’s ‘antenna booster on a chip’ technology … Read More → "Ignion rebrand marks new era for IoT technology with its Virtual Antenna™"

Astera Labs and Avery Design Partner on CXLTM 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications

April 30, 2021

Astera Labs Aries Smart Retimers resolve signal integrity issues for high-performance server, storage, cloud and workload optimized systems
Avery PCIe and CXL Verification IP enabled Astera Labs to get to market faster

Tewksbury, MA., April 28, 2021 — Avery Design Systems, a leader in functional verification solutions, today announced that Astera Labs, … Read More → "Astera Labs and Avery Design Partner on CXLTM 2.0 Verification for Smart Retimer Portfolio to Improve Performance in Data-Centric Applications"

Imec and AIXTRON Demonstrate 200 mm GaN Epitaxy on AIX G5+ C for 1200V Applications with Breakdown in Excess of 1800V

This breakthrough result paves the way for GaN to enter into the SiC high voltage domain

April 30, 2021

LEUVEN (Belgium), APRIL 29, 2021 — Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and AIXTRON, the leading provider of deposition equipment for compound semiconductor materials, have demonstrated epitaxial growth of gallium-nitride (GaN) buffer layers qualified for 1200V applications on 200mm QST® substrates, with a hard breakdown exceeding 1800V. The manufacturability of 1200V-qualified buffer layers opens doors to highest voltage GaN-based power applications such as electric cars, previously only with feasible silicon-carbide (SiC)-based technology. The result comes after the successful … Read More → "Imec and AIXTRON Demonstrate 200 mm GaN Epitaxy on AIX G5+ C for 1200V Applications with Breakdown in Excess of 1800V"

VadaTech Announces a QorIQ P5040 Processor AMC with PCIe interface

April 30, 2021

Henderson, NV – April 29, 2021 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC704. The AMC704 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the NXP P5040 (quad core) processors. The unit provides dual x4 … Read More → "VadaTech Announces a QorIQ P5040 Processor AMC with PCIe interface"

Curtiss-Wright Adds NVIDIA® GPGPU Processor Module to its Growing Roster of OpenVPX™ Solutions Developed in Alignment with the SOSA™ Technical Standard

New SOSA aligned GPGPU modules expand Curtiss-Wright’s family of high-performance size, weight, and power (SWaP)-optimized embedded computing (HPEC) processors for AI/ML applications

April 30, 2021

ASHBURN, Va. – April 29, 2021 – Curtiss-Wright’s Defense Solutions division, a trusted leading supplier of rugged ISR and EW processing modules and systems, today introduced its first 3U OpenVPX GPGPU processor module designed in compliance with the U.S. Army CCDC C5ISR Center’s C4ISR/EW Modular Open Suite of Standards (CMOSS) and aligned with standards currently being defined by The Open Group Sensor Open Systems Architecture™ (SOSA) Consortium. Developed to support compute-intensive ISR and EW systems, this fully rugged SOSA aligned variant of the VPX3-4935, an NVIDIA Quadro® Turing™ based GPGPU processor card module, is the latest … Read More → "Curtiss-Wright Adds NVIDIA® GPGPU Processor Module to its Growing Roster of OpenVPX™ Solutions Developed in Alignment with the SOSA™ Technical Standard"

Boréas Piezo Haptic Engine Brings HD Haptics in Tiny Footprint to Fitness Trackers, Smartwatches

Boréas leverages piezoelectric chip platform to advance touch experiences in wearables

April 29, 2021

BROMONT, Québec—April 27, 2021 — Boréas Technologies today unveiled the Boréas Piezo Haptic Engine (Boréas PHE), the first module to harness the high performance of piezo actuators to solve wearable devices’ most significant challenge— … Read More → "Boréas Piezo Haptic Engine Brings HD Haptics in Tiny Footprint to Fitness Trackers, Smartwatches"

New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic enable increased power density and more compact designs

April 29, 2021

Munich, Germany – 29 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL™ CoolSiC™ MOSFET modules with a new aluminum nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (R _DS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for high-power density applications including solar systems, … Read More → "New EasyDUAL™ CoolSiC™ MOSFET power modules with high-performance ceramic enable increased power density and more compact designs"

Renesas DDR5 I3C Bus Extension and SPD Hub Devices Qualified for AMI Firmware

Expanded I3C Ecosystem Now Includes Firmware, Software, and Hardware, Accelerating Product Qualification and Adoption for DDR5 Solutions

April 29, 2021

Düsseldorf, April 29, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that AMI, a firmware and software solutions partner, has qualified the Renesas I3C bus extension products for its MegaRAC® SP-X Remote Management Firmware. Having the I3C devices on AMI’s … Read More →