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Unilumin and STMicroelectronics Jointly Develop LED Display Using ST’s 60GHz Contactless Connectivity Chip for Advanced Video Solutions

China, July 21, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Unilumin, a leader in LED displays based in China, today announced that they have worked together to develop a new Unilumin display using the ST60A2, ST’s 60GHz RF transceiver for advanced high-data-rate contactless-transfer solutions.</ … Read More → "Unilumin and STMicroelectronics Jointly Develop LED Display Using ST’s 60GHz Contactless Connectivity Chip for Advanced Video Solutions"

Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution

Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gbit.

As the world’s first x8 Octal interface NAND Flash, Winbond’ … Read More → "Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution"

STMicroelectronics Joins Startup Autobahn as Anchor Partner to Meet Tomorrow’s Automotive Innovators

  • Startup Autobahn program connects new companies with major brands for investment and development
  • ST is first semiconductor manufacturer to become Anchor Partner 

Geneva, Switzerland, July 21, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has become an Anchor Partner of Startup Autobahn, which is powering innovation in the automotive sector by introducing selected dynamic new companies to established technology corporations.

Startup Autobahn is created and managed by Plug and Play, the accomplished Silicon Valley accelerator and investor … Read More → "STMicroelectronics Joins Startup Autobahn as Anchor Partner to Meet Tomorrow’s Automotive Innovators"

Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters

CHANDLER, Ariz., July 21, 2021 (GLOBE NEWSWIRE) — Cloud service providers and server original equipment manufacturers (OEMs) designing storage platforms demand exceptional performance, flexibility and security for the next generation of data centers. Read More → "Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters"

Smart Eye and OmniVision Announce End-to-End Interior Sensing Solution

GOTHENBURG, Sweden–(BUSINESS WIRE)–Smart Eye AB, a global leader in interior sensing AI, and OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, jointly announce today a full Interior Sensing solution for automotive OEMs that enables complete driver and cabin monitoring with videoconferencing applications from a single RGB-IR sensor.

The solution is the first integrated video processing chain, which combines innovative features based on the OmniVision OV2312 RGB-IR sensor, supporting exceptional day and night performance.

“Interior Sensing AI is crucial for … Read More → "Smart Eye and OmniVision Announce End-to-End Interior Sensing Solution"

Vecow Launches EAC-2000 Series NVIDIA Jetson Xavier Fanless Embedded System

New Taipei City, Taiwan, July 20, 2021 – Vecow Co., Ltd., a team of global embedded experts, announced the latest Fanless Embedded System EAC-2000 Series. Powered by NVIDIA Jetson Xavier NX module, Vecow EAC-2000 Series delivers great power efficiency in a small form factor. With support for operating temperature from -25°C to 70°C, 9V to 50V wide range DC-in, along with GMSL technology linked with Fakra-Z connectors, EAC-2000 Series brings small size and easy deployment of AI vision and industrial applications including Traffic Vision, Intelligent Surveillance, Auto Optical Inspection, Smart Factory, AMR/AGV, and any AIoT/Industry 4.0 applications.

< … Read More → "Vecow Launches EAC-2000 Series NVIDIA Jetson Xavier Fanless Embedded System"

CrossBar Announces New ReRAM Application for Hardware Security and Secure Computing

Santa Clara, CA – July 20, 2021 – CrossBar Inc., the leading ReRAM technology leader, today announced a new application of its Resistive RAM (ReRAM) technology for use as a physical unclonable function (PUF) in order to generate cryptographic keys in secure computing applications.

While historically utilized as non-volatile semiconductor memory, CrossBar’s ReRAM technology in now being introduced for use in hardware security applications utilizing its … Read More → "CrossBar Announces New ReRAM Application for Hardware Security and Secure Computing"

GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution

SAN JOSE, Calif. and GUANGZHOU, China, July 20, 2021 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, introduces their ISP (Image Signal Processor) IP portfolio and reference design for GOWIN FPGAs. The GOWIN ISP IP core portfolio takes the pixel data from an image sensor and adjusts it through CFA (Color Filter Array/Debayer), CCM (Color Correction Array), Gamma correction, and AE (Auto Exposure) and AWB (Auto White Balance) to provide a clear image balanced in color and brightness.

The GOWIN ISP IP core portfolio is designed to offer camera and device manufacturers the ability … Read More → "GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution"

New HES Board is Ideal for Prototyping and Emulating Medium to Large ASIC & SoC Designs

Henderson, NV, USA – July 19, 2021 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the HES-VU19PD-ZU7EV, an ASIC/SoC physical prototyping and hardware emulation board that can accommodate designs of about 83M ASIC gates in size.

Compared to boards of a similar capacity, the HES-VU19PD-ZU7EV uses just two FPGAs for the provision of logic. This simplifies FPGA partitioning and reduces project bring-up time for designs targeting a medium-sized ASIC or SoC. For larger designs, four boards can be connected via … Read More → "New HES Board is Ideal for Prototyping and Emulating Medium to Large ASIC & SoC Designs"

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