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Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

September 10, 2021

Geneva, September 9, 2021 – STMicroelectronics has announced the first multi-zone FlightSense™ time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

The VL53L5CX sensor provides up to 64 sensing zones with multi-target detection, … Read More → "Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications"

MicroAI™ and Silicon Labs to Deploy Edge-Native AI

Personalized AI on Edge Endpoints Now Possible With Mass Customization and Contextualization of Data
September 10, 2021

DALLAS, TEXAS (September 9, 2021) – MicroAI, the pioneer in edge-native artificial intelligence (AI) and machine learning (ML) products, announced today that it has joined Silicon Labs’ (NASDAQ: SLAB) Technology Partner Program and begun to collaborate to deliver the benefits of edge-native AI for Silicon Labs’ customers.

Silicon Labs is a leader in secure, intelligent wireless technology for a more connected world. MicroAI is the pioneer in … Read More → "MicroAI™ and Silicon Labs to Deploy Edge-Native AI"

TDK offers new stray-field compensated 3D HAL® sensors with redundancy function and digital output interfaces

September 10, 2021

September 9, 2021 — TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*. The products enable stray-field compensated position detection in automotive and industrial applications while addressing the need for ISO 26262 compliant developments. Samples are available on request. The start of production begins in the second quarter of 2022.

According to ISO 26262, the sensors are SEooC and ASIL B ready, enabling ASIL D developments on system level. They feature 3D magnetic-field measurement capability, 2D stray-field robust position detection; HAR 3930 has PWM and SENT (SAE J2716 rev. 4) output, additional switch output and HAR 3900 offers measurement … Read More → "TDK offers new stray-field compensated 3D HAL® sensors with redundancy function and digital output interfaces"

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI

META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates
September 9, 2021

CHANDLER, Ariz., Sept. 8, 2021 — Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic driven by 5G, cloud services and Artificial Intelligence (AI) and Machine Learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition to the 112G (gigabits per second) PAM4 Serializer/Deserializer (SerDes) connectivity that is needed to support the latest pluggable optics, system backplanes and packet processors. These challenges can now be overcome with the industry’s most compact, 1.6 … Read More → "Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI"

Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon

Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications
September 9, 2021

SAN JOSE, Calif., September 8, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm. The Mixed-Signal OpenAccess-ready PDK allows mutual customers to speed their time to market by ensuring that the qualified Cadence® custom and digital design tools seamlessly interoperate on various Samsung process technologies. The Mixed-Signal OpenAccess-ready PDK improves productivity for mixed-signal designs used in data centers, networking, 5G, mobile, industrial and automotive applications.

The Cadence … Read More → "Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon"

Cybellum and the Automotive Security Research Group (ASRG) Survey finds that the automotive industry isn’t ready for upcoming cybersecurity regulations

Top 50 Global OEMs and Tier-1-2 automotive suppliers were surveyed to assess their preparedness against vulnerabilities and threats
September 9, 2021

TEL AVIV, Israel, Sept. 8, 2021 /PRNewswire/ — Cybellum, a leader in product security lifecycle management and Read More → "Cybellum and the Automotive Security Research Group (ASRG) Survey finds that the automotive industry isn’t ready for upcoming cybersecurity regulations"

QuickLogic Announces Australis™ eFPGA IP Generator

September 8, 2021
  • Built on the OpenFPGA open-source framework that enables rapid prototyping of customizable FPGA architectures
  • Integrates QuickLogic’s best practices for performance, power, and area optimizations, ensuring low risk and low cost for eFPGA IP licensees 
  • Automation capability enables custom-parameterized eFPGA IP within days in some cases

SAN JOSE, Calif. – September 8, 2021 – QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low … Read More → "QuickLogic Announces Australis™ eFPGA IP Generator"

Vishay Intertechnology High Voltage Thick Film Chip Resistors Save Board Space While Lowering Component Counts and Placement Costs

Replacing Standard Resistor Chains, AEC-Q200 Qualified Devices Offer Operating Voltages Up to 3 kV in 2010 and 2512 Case Sizes
September 8, 2021

MALVERN, Pa., Sept. 08, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified thick film chip resistors with operating voltages up to 3 kV in the 2010 and 2512 case sizes.

With their high operating voltages, devices in the Vishay Draloric Read More → "Vishay Intertechnology High Voltage Thick Film Chip Resistors Save Board Space While Lowering Component Counts and Placement Costs"

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