News – Page 655 – EEJournal

Synopsys Accelerates Most Stringent Functional Safety Certification of NSITEXE RISC-V Parallel Processor IP

First ISO 26262 ASIL D Certified RISC-V Processor with Vector Extension Tapped into Speed and Capacity of Synopsys Z01X Fault Simulation Solution

September 14, 2021

MOUNTAIN VIEW, Calif., Sept. 14, 2021 /PRNewswire/ —

Highlights from this announcement:

With Z01X functional safety verification solution plus Synopsys support, NSITEXE achieved ISO 26262 ASIL D certification two months ahead of schedule
Z01X fault simulation delivers exhaustive functional safety verification and the most complete fault model set available, complementing Synopsys unified functional safety verification solution

Accelerating its … Read More → "Synopsys Accelerates Most Stringent Functional Safety Certification of NSITEXE RISC-V Parallel Processor IP"

SiTime Launches Learning Hub to Educate the World on Timing

Online, Always Available Platform Offers Comprehensive Content

September 14, 2021

SANTA CLARA, Calif., September 14, 2021 – SiTime Corporation (NASDAQ: SITM), a market leader in MEMS timing, today unveiled their Timing Essentials Learning Hub to power customer engagement and deliver comprehensive content on electronics timing. The Learning Hub enables engineers … Read More → "SiTime Launches Learning Hub to Educate the World on Timing"

New Line of Push Button Switches Targets Space-Constrained Applications

September 14, 2021

LAKE OSWEGO, Ore. — September 14, 2021 — CUI Devices’ Switches Group today announced the addition of push button switches to its product portfolio. Available in … Read More → "New Line of Push Button Switches Targets Space-Constrained Applications"

SPARK Microsystems Advances UWB Adoption with Industry Standards Organizations

Participating in the UWB Alliance and FiRa Consortium will help push mass UWB adoption

September 14, 2021

Montreal, Canada, Sep. 14, 2021 – Read More → "SPARK Microsystems Advances UWB Adoption with Industry Standards Organizations"

SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions

Supports Wide Range of Memory Types Including DDR, LPDDR, GDDR, Flash, HBM, ONFI, TCAM, Non-Volatile

September 14, 2021

SAN JOSE, Calif., Sept. 14, 2021 (GLOBE NEWSWIRE) — SmartDV™ Technologies, the leader in Design and Verification Intellectual Property (IP), today unveiled its broad portfolio of memory … Read More → "SmartDV Provides Broad Portfolio of Memory Modeling, Design and Verification Solutions"

Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications

Foundry-Certified, Full-Lifecycle Reliability Signoff Prevents Over-Design and Costly Late-Stage ECOs for Automotive, Aerospace and Defense, Medical and 5G Designs

September 13, 2021

MOUNTAIN VIEW, Calif., Sept. 13, 2021 /PRNewswire/ —

Highlights for this Announcement:

Unified workflow of proven technologies provides high-performance reliability analysis across the product lifecycle compliant with standards such as ISO 26262
Integration with PrimeSim™ Continuum solution enables seamless use of industry-leading simulators for electromigration/IR drop analysis, MOS aging, high-sigma Monte Carlo, analog fault and other reliability analyses</ … Read More → "Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications"

Vishay Intertechnology Automotive Grade IHLP® Inductor Offers High Temperature Operation to +155 °C in 7575 Case Size

19 mm by 19 mm by 7 mm Inductor Delivers Improved Performance Over 6767 Devices, at a Lower Cost Than Inductors in the 8787

September 13, 2021

MALVERN, Pa., Sept. 13, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the industry’s first Automotive Grade IHLP^® low profile, high current inductor in the 19 mm by 19 mm by 7 mm 7575 case size. Offering high temperature operation to +155 °C for under the hood automotive applications, the Vishay Dale Read More → "Vishay Intertechnology Automotive Grade IHLP® Inductor Offers High Temperature Operation to +155 °C in 7575 Case Size"

Elma to Hold Functional Demos at U.S. Army FACE™ Technical Interchange Meeting (TIM)

Partner collaboration and system interoperability at heart of open standards-based development platforms

September 13, 2021

FREMONT, Calif., September 2021 – Read More →

Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

New Tensilica AI engine boosts performance and AI accelerators provide a turnkey solution for consumer, mobile, automotive and industrial AI SoC designs

September 13, 2021

Highlights:

• Domain-specific, extensible and configurable AI platform built upon mature, volume production-proven Tensilica architecture
• Industry-leading performance and energy efficiency for on-device AI applications
• Comprehensive, common AI software addresses all target markets
• Low-, mid- and high-end AI product families for the full spectrum of PPA and cost points
• Scalable from 8 GOPS to 32 TOPS currently and 100s of TOPS for future AI requirements

SAN JOSE, Calif., September 13, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its Tensilica® AI Platform for accelerating AI SoC development, including three supporting product families optimized for … Read More → "Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform"

LDRA tool suite Selected to Keep Railway System Safety on Track

G.G.Tronics chose the LDRA tool suite to demonstrate compliance with SIL4 as defined by the EN5012X family of standards

September 10, 2021

Wirral, UK—September 9, 2021—Read More → "LDRA tool suite Selected to Keep Railway System Safety on Track"