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Toshiba Releases New M4N Group of ARM® Cortex®-M4 Microcontrollers in the TXZ+™ Family Advanced Class

Dedicated for industrial equipment requiring Ethernet and CAN controller
October 19, 2021

Düsseldorf, Germany, 19th October 2021 – Toshiba Electronics Europe GmbH (“Toshiba”) has announced the availability of 20 new devices in the M4N group of ARM® Cortex®-M4 microcontrollers manufactured in a 40nm process. These devices further extend and enhance the TXZ+™ family advanced class and include an ARM Cortex-M4 core with floating point unit (FPU), running at speeds up to 200MHz, integrated 2MB code flash and 32kB data flash memory with 100k write cycle endurance. These new microcontrollers also offer a range of interfacing and communication options such as Ethernet, CAN and USB 2.0 FS OTG with integrated PHY.

… Read More → "Toshiba Releases New M4N Group of ARM® Cortex®-M4 Microcontrollers in the TXZ+™ Family Advanced Class"

Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs

October 19, 2021

Highlights:

• The Cadence Safety Solution includes the new unified Midas Safety Platform driving analog and digital full flows for FMEDA-based functional safety design and verification
• The safety flows provide automotive, industrial and aerospace customers with integrated safety analysis, fault campaign management and execution capabilities
• The new solution features enhanced Cadence verification engines that allow for complete ISO 26262 and IEC 61508 verification

SAN JOSE, Calif., October 19, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence® Safety Solution, a new offering targeting safety-critical applications and featuring integrated analog and digital safety flows and … Read More → "Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs"

IAR Systems and Secure Thingz announce secure development and volume production platform to accelerate Microsoft Azure IoT migration

Enhanced solution from IAR Systems and Secure Thingz enables high-volume secure device development and production, supporting automatic onboarding of devices and integration into Microsoft Azure cloud services
October 19, 2021

Cambridge, United Kingdom / Uppsala, Sweden—October 19, 2021—IAR Systems®, the future-proof supplier of software tools and services for embedded development, and Secure Thingz, an IAR Systems Group company, today presented a complete “development to deployment” solution for Microsoft Azure IoT and RTOS platforms. The solution enables rapid development and simplified deployment of devices ensuring out-of-the-box connectivity.

With applications rapidly transitioning from traditional embedded devices to cloud-orientated edge compute nodes, there is a growing need to integrate cloud connectivity into both the development and manufacturing processes, creating a seamless secure supply chain. The solution announced today will benefit from … Read More → "IAR Systems and Secure Thingz announce secure development and volume production platform to accelerate Microsoft Azure IoT migration"

Nordic is key contributor to new ETSI DECT-2020 New Radio (NR) standard that will allow enterprise IoT customers to build their own low cost private mesh networks

The standard is said to offer very high indoor and neighborhood area device coverage, density, and reliability, plus low latency. The ITU (International Telecommunication Union) recognizes its potential and has included this as part of the 5G standard in its IMT-2020 technology recommendation
October 19, 2021
Oslo, Norway – October 19, 2021 – Nordic Semiconductor today announces that it has been and will continue to be a key contributor in the development of a brand new 5G wireless standard that’s optimized for decentralized deployments. Currently called DECT-2020 NR, the standard targets the specific needs of enterprise IoT applications.
And Nordic has partnered with massive IoT solution software specialist Wirepas to help speed development of an nRF91 Series solution.
The DECT-2020 NR standard will allow enterprises to easily set up, manage, and own a private 5G wireless IoT network and connect … Read More → "Nordic is key contributor to new ETSI DECT-2020 New Radio (NR) standard that will allow enterprise IoT customers to build their own low cost private mesh networks"

Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2

October 19, 2021

Siemens Digital Industries Software announced today that Arm, a global leader in semiconductor intellectual property (IP), used Siemens’ machine learning (ML)-powered Solido™ Variation Designer software to improve IP validation runtime by 1,000X compared to traditional brute force statistical methods*, while achieving greater accuracy and coverage. This dramatic acceleration enabled Arm to verify its standard cell IP to Six Sigma, while significantly improving validation runtime.

“Improving compute cost and time-to-market is a constant priority for Arm, and we continue to meet and exceed high-quality and reliable operation requirements, enabling higher chip yield, performance, power, and area (PPA) … Read More → "Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2"

Kerlink Launches New Indoor LoRaWAN Gateway Featuring ‘Brand-New Operational Approach Critical for Massive IoT’

iZeptoCell Offers Zero-Touch Provisioning And Cuts Up to 25 Percent of Estimated Operational
October 19, 2021

Thorigné-Fouillard, France – Oct. 19, 2021, 6:00 p.m. CET – Kerlink (AKLK – FR0013156007), a specialist in solutions dedicated to the Internet of Things (IoT), today announced its new LoRaWAN® indoor gateway designed to help smart cities, factories, warehouses, and building owners and operators easily support the booming number of connected sensors and devices of massive IoT.

Kerlink’s Read More → "Kerlink Launches New Indoor LoRaWAN Gateway Featuring ‘Brand-New Operational Approach Critical for Massive IoT’"

Actility and Helium Network Announce Roaming Integration to Scale IoT Coverage and Drive Large Scale Enterprise Adoption Globally

The partnership will bring mass adoption and usage to the Helium Network, unlocking coverage for millions of IoT devices.
October 18, 2021

San Francisco, California & Paris, France – October 15, 2021  — Actility, the leader in IoT connectivity solutions and LPWA technology, and Read More → "Actility and Helium Network Announce Roaming Integration to Scale IoT Coverage and Drive Large Scale Enterprise Adoption Globally"

Imperas Models for Arm Processors now available in TESSY by Razorcat

Imperas simulation technology and reference models now available within the TESSY environment for the automation of embedded software testing and regression management
October 18, 2021

Oxford, United Kingdom, October 18th, 2021 – Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced Razorcat Developments, a leading provider of software testing tools for the embedded systems market, has integrated the Imperas fast processor reference models into the popular TESSY environment for embedded software testing. Embedded software development requires rigorous testing not just during the initial development phase but over … Read More → "Imperas Models for Arm Processors now available in TESSY by Razorcat"

Vishay Intertechnology High Voltage Chip Divider in Molded Package Reduces Component Counts, Improves TC Tracking Performance

For Automotive and Industrial Equipment, Device Offers Maximum Working Voltage of 1500 V in 4527 Case Size
October 18, 2021

MALVERN, Pa. — Oct. 18, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the industry’s first high voltage chip divider to be offered in a ribbed molded package with compliant surface-mount leads. Designed to reduce component counts and improve TC tracking performance and ratio stability in automotive and industrial equipment, the Vishay Techno CDMM delivers a maximum working voltage of 1500 V in the 4527 case size.

Consisting of two resistors integrated into one molded package, the chip divider released today provides a single-component replacement for multiple discrete resistors used in voltage divider applications. The space-saving, AEC-Q200 qualified device is optimized … Read More → "Vishay Intertechnology High Voltage Chip Divider in Molded Package Reduces Component Counts, Improves TC Tracking Performance"

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