SANTA CLARA, Calif. – November 9, 2021 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32C, a 32 megapixel (MP) image sensor in a compact 1/3.2-inch optical format (OF)―the ideal performance/size ratio for next-generation front-facing mobile phone “selfie” cameras. RGBC technology is built into the sensor to provide the highest quality images in challenging lighting conditions. The OV32C’ … Read More → "OmniVision Announces Its First RGBC Sensor with Always-on Capability for Front Facing Mobile Phone Cameras"
November 9, 2021 — TDK Corporation (TSE:6762) extends its MiniCell® range to include pressure transmitters in robust stainless-steel casing to measure differential pressure in industrial applications. The B58622M32* series comprises five models that measure between 0 to 500 mbar and 0 to 10 bar. Its compensated temperature range extends from -20 °C to +140 °C and the dimensions are 57 x 34 x 39 mm, including the connections.
MiniCell offers media resistance with high-alloy AISI 316L steel membrane on both pressure ports that transmit the pressure to the sensor die via oil-filled, media-separated sensor cells. The medium, which enables pressure measurement of aggressive liquids and gases, does … Read More → "TDK offers robust differential pressure transmitters for industrial applications"
Tel Aviv, Israel, November 08, 2021 – Variscite, a leading global provider of trusted Systems on Module (SoM) solutions for the embedded market, today announced its partnership with leading AI (Artificial Intelligence) chipmaker Hailo to launch a ready-to-use reference platform enabling high-performance and scalable AI capabilities at the edge.
The joint, complete edge AI solution will combine Variscite’s i.MX 8 … Read More → "Variscite and Hailo Partner to Provide Out-of-the-Box, Full-Scale, Edge AI Solutions"
What’s new: NXP® Semiconductors has announced the new BTS6302U/6201U pre-drivers and BTS7203/5 dual-channel receive (RX) front end modules (FEM) for 5G massive multi-input multi-output (MIMO) infrastructure. These new devices offer low current consumption, reducing carrier operating costs. Developed using NXP’s silicon germanium (SiGe) process and in-house test and assembly, the new devices offer high levels of integration, reducing system costs for OEMs. These devices are currently being deployed by major OEMs.
Why it matters: While traditional base stations provide four to eight transmit and receive channels, 5G massive MIMO infrastructure designs typically call … Read More → "NXP Accelerates 5G Infrastructure with Low Power Dual-Channel Receive Front End Modules and Pre-Drivers"
TOKYO, Nov. 08, 2021 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has launched its new Link Scale™ family of digital channel cards for the V93000 platform, enabling software-based functional testing and USB / PCI Express (PCIe) SCAN testing of advanced semiconductors. The new cards address testing challenges that require these interfaces to run in full protocol mode, adding system-like test™ capabilities to the V93000.
Many of today’s complex system-on-chip (SoC) devices, microprocessors, graphics processors and AI accelerators incorporate high-speed digital interfaces such as USB … Read More → "Advantest Launches New Channel Cards, Adding Software-Based Functional Test and HSIO SCAN Test to the V93000 Platform"
Nijmegen, November 8th, 2021: Nexperia, the expert in essential semiconductors today announced its entry into the high-power Silicon Carbide (SiC) diodes market with the introduction of 650 V, 10 A SiC Schottky diodes. This is a strategic move for Nexperia, already a trusted supplier of efficient power Gallium Nitride (GaN) FETs, to expand its high-voltage wide bandgap semiconductor device offering.
Nexperia’s first SiC Schottky diode is an … Read More → "Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes"
Silicon Valley, CA, Nov 8, 2021 – The eSync™ Alliance and the Autoware Foundation have formed a joint work group to explore how over-the-air (OTA) updates and data gathering can be optimally integrated into the software stack for the next generation of autonomous vehicles, based on … Read More → "eSync™ Alliance and Autoware Foundation join forces to accelerate autonomous vehicle software deployment"
Geneva, November 8, 2021 – The STMicroelectronics TCPP03-M20 USB Type-C port-protection IC is tailored for Dual-Role Power (DRP) applications, simplifying the design of products that can act as a power source for connected devices as well as accepting power from other … Read More → "STMicroelectronics’ Port-Protection IC for STM32 MCUs Tailored to USB-C Dual-Role Power"
PORTLAND, Ore. – November 4, 2021 – SensiML™ Corporation, a leading developer of AI tools for building intelligent Internet of Things (IoT) endpoints, today … Read More → "SensiML and onsemi enable industrial edge AI sensing applications Inbox"
