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Sensata Technologies Launches STEV Series High‑Voltage Contactors for Battery Electric and Plug-in Hybrid Vehicles

January 14, 2026
  • Sensata’s STEV series contactors support the shift to cleaner, more efficient transportation for electric and hybrid vehicles, from passenger cars to heavy-duty trucks.
  • Customizable switching technology enables OEMs to standardize high-voltage solutions across multiple vehicle lines, simplifying development and reducing costs.
  • Engineered for reliability, safety, and efficiency, STEV contactors deliver low resistance, reduced heat generation, and high short-circuit protection.

SWINDON, United Kingdom, January 14, 2026– Read More → "Sensata Technologies Launches STEV Series High‑Voltage Contactors for Battery Electric and Plug-in Hybrid Vehicles"

ALINT-PRO™ Adds New Mixed-Language Design Rules for More Predictable Cross-Language Integration

January 14, 2026

Henderson, NV – January 14, 2026 – Aldec, Inc., a pioneer in mixed HDL language simulation and verification solutions for FPGA and ASIC designs, today announced the availability of ALINT-PRO™ 2025.12, delivering a new set of design rules and guidance for mixed-language projects. The update helps engineering teams improve correctness, maintainability, and IP interoperability when combining VHDL and Verilog/SystemVerilog within a single project.

 

As mixed-language development becomes increasingly common for IP reuse, third-party integration, and long-life product maintenance, design teams face challenges caused by ambiguous mapping, inconsistent parameter passing, and configuration … Read More → "ALINT-PRO™ Adds New Mixed-Language Design Rules for More Predictable Cross-Language Integration"

Vishay Intertechnology Extends 193 PUR-SI Series of Snap-in Power Aluminum Capacitors With Voltage Ratings of 550 V and

Space- and Cost-Saving Devices Offer Ripple Current to 3.27 A and Useful Life of 5000 Hours at +105 °C
January 14, 2026

MALVERN, Pa. — Jan. 14, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company has extended its 193 PUR-SI series of miniature snap-in power aluminum electrolytic capacitors with new voltage ratings of 550 V and 600 V. The Vishay BC components devices deliver up to 30 % higher ripple current than standard solutions in similar case sizes and offer a longer useful life.

Traditionally, designers have used three 400 V to 450 V capacitors in series, with voltage balancing resistors across each device, to handle DC bus voltages up to 1100 V — an approach that adds design complexity and potential failure points. With their higher voltage … Read More → "Vishay Intertechnology Extends 193 PUR-SI Series of Snap-in Power Aluminum Capacitors With Voltage Ratings of 550 V and"

Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles

January 14, 2026

Munich, Germany – 8 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and HL Klemove have signed a Memorandum of Understanding (MoU) to strengthen their strategic collaboration in automotive technologies. The partnership aims to combine Infineon’s semiconductor expertise and system understanding with HL Klemove’s capabilities in advanced autonomous driving systems to accelerate innovation in vehicle electronic architecture for the Software-Defined Vehicle (SDV) era and advance autonomous driving technologies.

Under the MoU, the two companies will cooperate in … Read More → "Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles"

Innodisk Unveils the New “AI on Dragonwing” Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
January 14, 2026

Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc . The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI performance while maintaining low power consumption and wide-temperature reliability from -40°C to 85°C. The Qualcomm Dragonwing™ SoCs also offers longevity support through 2038, ensuring supply stability for long-term industrial deployments. As the first product line within Innodisk’s AI on ARM portfolio, the series opens a new chapter for customers seeking sustainable and scalable ARM-based Edge AI solutions.

The AI … Read More → "Innodisk Unveils the New “AI on Dragonwing” Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC"

Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers

Solution delivers secure boot, power management and system control for complex computing
January 14, 2026
CHANDLER, Ariz., January 8, 2026 — Microchip Technology (Nasdaq: MCHP) has announced the release of custom-designed firmware for its MEC1723 Embedded Controller (EC), specifically tailored to support NVIDIA DGX Spark personal AI supercomputers. The software is designed to optimize the MEC1723 EC’s … Read More → "Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers"

From Space to Earth: LYNRED launches an eSWIR sensor to better measure critical resources and climate signals

Presented at SPIE Photonics West 2026 (20–22 January, booth 1866), Sirocco SW brings Space-grade spectroscopy to mining, agriculture and environmental monitoring.
January 13, 2026

Grenoble, France, January 12, 2026 — As pressure mounts on access to critical raw materials, food security and climate data, the ability to accurately analyze soils, materials and gases has become a strategic challenge. LYNRED, a global leader in infrared imaging technologies, today announces the launch of Sirocco SW, a new extended-SWIR (eSWIR) detector designed for high-impact industrial and environmental applications, taking benefit of its Space-proven technology.

Capable of detecting wavelengths up to 2.5 microns in VGA resolution (640 × 512), Sirocco SW extends spectral analysis well beyond the limits of conventional SWIR sensors. This range is essential for identifying chemical species, differentiating … Read More → "From Space to Earth: LYNRED launches an eSWIR sensor to better measure critical resources and climate signals"

SGET Shakes Up FPGA Market with World Premiere of oHFM: The Open Harmonized FPGA Module Standard

January 13, 2026

Munich, Germany – January 8, 2026 – The Standardization Group for Embedded Technologies e.V. (SGET) today announced a paradigm shift in embedded design with the official release of the Open Harmonized FPGA Module (oHFM) specification. As the world’s first open and vendor-independent FPGA module standard, oHFM brings the proven success of Computer-on-Module (COM) principles to the FPGA ecosystem, offering a new level of flexibility for developers and silicon partners alike.

Enhancing Design Flexibility

Traditionally, FPGA-based designs required highly specialized carrier board layouts, often tailored to a specific silicon architecture. The oHFM standard introduces a harmonized pinout and … Read More → "SGET Shakes Up FPGA Market with World Premiere of oHFM: The Open Harmonized FPGA Module Standard"

Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions

January 13, 2026

The certification validates Innodisk’s secure development lifecycle across its full product portfolio, aligning its edge AI and industrial solutions with international cybersecurity and regulatory requirements.

Innodisk, a global leader in edge AI and industrial-grade storage solutions, today announced that it has officially obtained IEC 62443-4-1 certification for its security development lifecycle (SDL).This achievement reinforces Innodisk’s capability to deliver comprehensive security assurance across its product portfolio and product lifecycles, meeting the cybersecurity expectations of global supply chain partners and proactively aligning with upcoming international regulatory requirements such as the EU Cyber Resilience Act (CRA).</ … Read More → "Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions"

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