News – Page 593 – EEJournal

DVCon U.S. 2022 To Offer Interactive Virtual Program

Addition of Gather.Town designed to enhance networking experience for all participants

February 8, 2022

Gainesville, FL – February 8, 2022 – The full program for 2022 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative is now available. The 34^th annual conference and exhibition will be held on a virtual platform February 28-March 3, 2022.

The technical program includes 42 paper presentations, 14 poster presentations, two panels, five tutorials and 10 workshops throughout the four-day program.

The keynote for the 2022 program, “Unleashing AI/ML for Faster Verification Closure,” will be presented by Manish Pandey, Vice President of Engineering, Synopsys. The keynote will explore how … Read More → "DVCon U.S. 2022 To Offer Interactive Virtual Program"

Melexis gives robots a sense of touch

A fully integrated sensor prototype enriches robot hand capabilities

February 8, 2022

Tessenderlo, Belgium, 8th February 2022 – Melexis has made a major innovation to improve robots’ ability to interact with fragile or diverse objects. The company has unveiled Tactaxis, a fully integrated tactile sensor that is compact, soft and provides the 3D force vector acting on its surface. This improves robots’ hands and grippers, making delicate operations such as fruit picking possible. The technology is successfully implemented in a functioning prototype.

The ground-breaking prototype features multiple 3D magnetometer pixels, using Melexis’ industry-proven Triaxis® technology. The sensor is accompanied by a magnet which is embedded into an elastomer material. This presents … Read More → "Melexis gives robots a sense of touch"

HEIDENHAIN Strain Sensor Can Help Prevent Structural Disasters

ESR digital sensor available for integration to provide predictive monitoring on bridges and buildings

February 8, 2022

Schaumburg, IL, Feb. 08, 2022 (GLOBE NEWSWIRE) — Developed to help prevent civil disasters and save lives, HEIDENHAIN’s ESR digital strain … Read More → "HEIDENHAIN Strain Sensor Can Help Prevent Structural Disasters"

Low Standby Power, Non-Isolated Offline Switcher from Diodes Incorporated Significantly Reduces BOM Costs

February 8, 2022

Plano, Texas – February 8, 2022 – Diodes Incorporated (DIODES™) (Nasdaq: DIOD) has introduced a universal AC high-voltage input non-isolated offline switcher IC to further strengthen its power products portfolio. The AP3928 addresses the challenges associated with using a bias power supply. It delivers safe and reliable power, while simultaneously maintaining elevated performance figures and enabling significant cost savings. This switcher IC is optimized for … Read More → "Low Standby Power, Non-Isolated Offline Switcher from Diodes Incorporated Significantly Reduces BOM Costs"

Matterport To Showcase Impact of Digital Twins for Architecture, Engineering, and Construction Industry at its Popular Space Jam Competition

Virtual event offers inside look at solutions from Matterport Platform Partners for Architecture, Engineering, and Construction customers

February 8, 2022

SUNNYVALE, Calif., Feb. 07, 2022 (GLOBE NEWSWIRE) — Matterport, Inc. (Nasdaq: MTTR), the leading spatial data company driving the digital transformation of the built world, today announced it will host the next installment of the Matterport Space Jam virtual event series, featuring four of its platform partners that are building software solutions on top of Matterport’s digital twins for the Architecture, Engineering and Construction (AEC) industry. The virtual event will take place on February 24 at 8:30 am PT, offering attendees an opportunity to learn how four Matterport Platform Partners build solutions for the AEC industry on top of Matterport digital … Read More → "Matterport To Showcase Impact of Digital Twins for Architecture, Engineering, and Construction Industry at its Popular Space Jam Competition"

Synopsys Joins New Intel Foundry Services Ecosystem Alliance to Propel Development of Next-Generation Semiconductor Designs

Mutual Customers Gain Access to Synopsys' Leading EDA and IP Solutions for Intel Technologies to Minimize Design Risk and Accelerate Time-to-Market

February 8, 2022

MOUNTAIN VIEW, Calif., Feb. 7, 2022 /PRNewswire/ — To help chip designers address increasingly aggressive product development goals, Read More → "Synopsys Joins New Intel Foundry Services Ecosystem Alliance to Propel Development of Next-Generation Semiconductor Designs"

Silicon Catalyst Welcomes 6 Newly Admitted Companies to Semiconductor Industry Incubator

February 8, 2022

Silicon Valley, CA., February 7, 2022 – Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions, announces the admission of six companies into the semiconductor industry’s highly acclaimed incubation program.

The newly admitted companies include:

ApLife Biotech – Argentina “Becoming World Leaders in Discovery for Biosensors”
Lemurian Labs – Canada “Building a next-gen AI Accelerator to enable deep learning on the edge”
NanoHydro Chem – USA “Energy Storage Solutions”
RAAAM – Israel “Providing the highest-density embedded memory in any standard CMOS technology”
Siloxit – Singapore “ … Read More → "Silicon Catalyst Welcomes 6 Newly Admitted Companies to Semiconductor Industry Incubator"

Dual High-Side Switches from STMicroelectronics Add Extra Flexibility for Driving Capacitive Loads

February 7, 2022

Geneva, February 7, 2022 – STMicroelectronics’ latest high-side switches, the IPS2050H and the Read More → "Dual High-Side Switches from STMicroelectronics Add Extra Flexibility for Driving Capacitive Loads"

Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem

New fund will strengthen Intel’s foundry business and drive adoption of disruptive technologies.

February 7, 2022

SANTA CLARA, Calif.–(BUSINESS WIRE)– What’s New: Intel today announced a new $1 billion fund to support early-stage startups and established companies building disruptive technologies for the foundry ecosystem. A collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritize investments in capabilities that accelerate foundry customers’ time to market – spanning intellectual property (IP), software tools, innovative chip architectures and advanced packaging technologies. Intel also … Read More → "Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem"

Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation

Cadence state-of-the-art EDA solutions and IP optimized for Intel process and packaging technologiess

February 7, 2022

SAN JOSE, Calif., February 7, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has joined the new Intel Foundry Services (IFS) Ecosystem Alliance to support mutual customers with the development and delivery of innovative system-on-chip (SoC) designs. As a member of the alliance, Cadence is advancing adoption of Intel process and packaging technologies and Cadence® state-of-the-art digital, custom/analog, verification and advanced IC packaging EDA solutions, along with Cadence Design, Verification and Tensilica® IP. Using Intel and Cadence technologies, customers can accelerate time to market while reducing design barriers, risk and costs.

There are several benefits to … Read More → "Cadence Joins Intel Foundry Services Ecosystem Alliance to Advance Chip Design Innovation"