News – Page 562 – EEJournal

Cadence Ushers in New Era of Performance and Accuracy for Multiphysics System Simulation with Fidelity CFD

April 19, 2022

Highlights:

• Unified workflow tightly integrates new technology breakthroughs with NUMECA and Pointwise technologies, significantly enhancing designer productivity
• Next-generation, high-order flow solver delivers up to 10X the accuracy of standard flow solvers
• New, massively parallel architecture reduces turnaround time from weeks to a day or less for complex aerospace, automotive, defense, marine and turbomachinery CFD analyses
• Fidelity CFD also provides up to a 3X meshing speedup for the industry-leading Pointwise solution used in aerospace applications

SAN JOSE, Calif., April 19, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today ushered in a new era of performance … Read More → "Cadence Ushers in New Era of Performance and Accuracy for Multiphysics System Simulation with Fidelity CFD"

CDM Electronics Now Offers High Performance Fiber Optic Interconnect Solutions

Fiber Optic Cable Assemblies and Harnesses Engineered for Mission-Critical Indoor, Outdoor and Indoor-Outdoor Applications

April 19, 2022

Turnersville, NJ, April 18, 2022…CDM Electronics, a premier authorized distributor of electronic connectors and cables, today announced the availability of Commercial Off-The-Shelf (COTS) and custom fiber optic MIL-Spec, harsh environment, mode conditioning and reference grade jumper cables. These multimode and single-mode fiber optic cable assembly solutions target the broadest spectrum of industrial, military, plus avionics applications. Three-dimensional computer aided design, manufacturing, and engineering (CAD/CAM/CAE) software … Read More → "CDM Electronics Now Offers High Performance Fiber Optic Interconnect Solutions"

Renesas Announces 10 New Winning Combinations Integrating Celeno and Renesas Products

Comprehensive Solutions Feature Celeno’s Industry-Leading Wi-Fi 6 and 6E Chipsets Combined with Renesas Embedded Processing, Power, Timing and Analog Offerings

April 15, 2022

TOKYO, Japan ― April 6, 2022 ― Renesas Electronics Corporation (TSE: 6723 today announced 10 new Winning Combinations that combine Wi-Fi 6 and 6E chipsets from recently acquired Celeno Communications with a broad range of solutions from Renesas including embedded processing, analog, power, timing and connectivity. The new Winning Combos include solutions for IoT, Industrial, Infrastructure and other applications.

Renesas’ Winning Combinations are engineering-vetted designs that allow customers to take advantage of an elevated platform for their design ideas, accelerating product development cycles and lowering overall risk in bringing designs to market. Renesas now offers more than 300 Winning Combinations for … Read More → "Renesas Announces 10 New Winning Combinations Integrating Celeno and Renesas Products"

Renesas Introduces Industry’s First PCIe Gen6 Clock Buffers and Multiplexers

New Devices from the Timing Leader Offer High Output Count, Small Packages, and Design Margin for Future Requirements; Complete Industry’s First PCIe Gen6 Timing Solution

April 15, 2022

TOKYO, Japan, April 14, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. Renesas, the industry’s undisputed leader in timing solutions, is offering 11 new clock buffers and 4 new multiplexers. The new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas’ low-jitter 9SQ440, 9FGV1002 and 9FGV1006 Read More → "Renesas Introduces Industry’s First PCIe Gen6 Clock Buffers and Multiplexers"

Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments

April 15, 2022

Munich, Germany – 14 April 2022 – Infineon Technologies LLC, part of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), today announced the availability of the space industry’s first radiation-hardened (rad hard), serial interface Ferroelectric RAM (F-RAM) for extreme environments. The new devices deliver unsurpassed reliability and data retention and are more energy efficient than non-volatile EEPROM and serial NOR Flash devices for space applications.

The addition of a QML-V qualified F-RAM to Infineon’s memory portfolio makes the benefits of nearly infinite endurance, instant non-volatile write technology, and over 100-year data retention available to space applications. … Read More → "Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments"

Renesas Launches Virtual Development Environment for Fast Automotive Application Software Development and Evaluation

New Environment Allows Customers to Bring Leading-Edge Software to Market Quickly

April 14, 2022

Düsseldorf, April 12, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of a virtual development environment that enables advance development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). The environment includes a Virtual Turnkey Platform, which allows engineers to develop application software before devices or evaluation boards are available. Additionally, the new environment offers a Multicore Debug and Trace Tool, which enables users to analyze and evaluate the operation of their software as if it were running on an actual chip. … Read More → "Renesas Launches Virtual Development Environment for Fast Automotive Application Software Development and Evaluation"

POLYN Technology Delivers NASP Test Chip for Tiny AI

April 14, 2022

April 13, 2022, Caesarea, Israel – POLYN Technology announced today that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology’s brain-mimicking architecture. It is the first Tiny AI true analog design to be used next to sensors.

POLYN Technology is an innovative provider of ultra-low-power-performance NASP technology and a producer of unique Tiny AI chips and their associated IP.

“This achievement validates the intensive work of our multinational team,” said Aleksandr Timofeev, CEO and founder of POLYN Technology. “Our chip represents the most … Read More → "POLYN Technology Delivers NASP Test Chip for Tiny AI"

Pulsonix PCB Design Adds 3D Collision Detection for Multi-board and Board Folding in Version 12.0

April 14, 2022

Tewkesbury, UK (April 13, 2022) – Pulsonix™ (www.pulsonix.com), the Electronic Design Automation (EDA) company delivering technology-leading PCB design solutions, today announced the release of Pulsonix version 12.0, which adds new capabilities, significant speed improvements, and highly requested usability enhancements.

“Version 12.0 offers a significant step up for our users in the areas of the PCB design process that they say … Read More → "Pulsonix PCB Design Adds 3D Collision Detection for Multi-board and Board Folding in Version 12.0"

When safety is key (not only in automotive)

April 14, 2022

DCD-SEMI, leading IP Core provider and SoC design house from Poland mastered unique CAN ALL IP Core with Functional Safety for GuardKnox, an Israeli based company with subsidiary locations in Munich, Germany, and Detroit, Michigan –integrated DCD’s CAN IP Core as part of their CommEngine product- a holistic solution for communication routing and switching capabilities.

Bytom, Poland April the 14th, 2022. DCD’s CAN IP Core’s been developed as ISO26262-10 Safety Element out of Context. – It can optionally be improved by necessary safety mechanisms and provide detailed … Read More → "When safety is key (not only in automotive)"

Renesas Introduces Industry’s First PCIe Gen6 Clock Buffers and Multiplexers

New Devices from the Timing Leader Offer High Output Count, Small Packages, and Design Margin for Future Requirements; Complete Industry’s First PCIe Gen6 Timing Solution

April 14, 2022

Düsseldorf, April 14, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. Renesas, the industry’s undisputed leader in timing solutions, is offering 11 new clock buffers and 4 new multiplexers. The new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas’ low-jitter 9SQ440, 9FGV1002 and 9FGV1006 clock generators to offer customers a complete PCIe Gen6 timing solution for data center/cloud computing, networking and high-speed industrial applications.

The PCIe Gen6 standard supports extremely high data rates of 64 … Read More → "Renesas Introduces Industry’s First PCIe Gen6 Clock Buffers and Multiplexers"

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