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Minimal Footprint 50 Watt AC/DC Power Supplies

San Jose, Calif. – April 15, 2022: TRACO POWER announces their new TPI 50-AJ series of 50W high-density AC/DC power supplies available in 3.00 x 1.50 x 1.20” open frame packages for a wide-range of industrial & ITE applications where reliability is critical and space is limited.

Features include:

• 50 watt open frame measuring only 3.00″ x 1.50 x 1.20″
• Compact and cost-efficient design
• Peak power function up to 70 Watts (5 secs)
• I/O reinforced isolation 3000 VAC
• -40°C to +60°C full-load operation (natural convection)
• Operating temperature range: -40°C to +85°C< … Read More → "Minimal Footprint 50 Watt AC/DC Power Supplies"

SD-WAN Market: Top trends boosting the industry expansion through 2025

According to a recent study from market research firm Graphical Research, the global SD-WAN market size is set to register a significant growth during the forecast timeframe. A notable surge in the adoption of cloud computing platforms has propelled the global software-defined wide area network (SD-WAN) market share. Stakeholders are infusing funds to expedite R&D investments and workload migration for the growth of 5G networks. SD-WAN solutions have bolstered the trend to monitor and manage diverse enterprise networks in a secure way.

The trend for the SD-WAN technology … Read More → "SD-WAN Market: Top trends boosting the industry expansion through 2025"

Infineon introduces the new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility

Munich, Germany – 22 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to the CIPOS™ Tiny Intelligent Power Module (IPM) family: the CIPOS Tiny IM323-L6G 600 V 15 A. The new IPM is based on TRENCHSTOP™ IGBT RC-D2 switches and state-of-the-art SOI gate driver technology to realize maximum efficiency and improved reliability, along with minimized system size and cost. The integration of discrete power semiconductors and drivers in one package allows designers to reduce the … Read More → "Infineon introduces the new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility"

SEGGER makes cutting-edge C++ library available for licensing

Monheim am Rhein, Germany – April 22nd, 2022

SEGGER’s emRun++ is a groundbreaking C++ library, fully compatible with the modern 2017 standard. It is used and proven in SEGGER’s multi-platform Embedded Studio IDE for RISC-V and Arm and is now available for licensing to toolchain vendors.

emRun++ guarantees fast heap operations with a low instruction count limit, enabling even hard real-time applications to be written in C++.

emRun++ is based on SEGGER’s efficient emRun and emFloat runtime and floating-point libraries. It includes a complete C++17 Standard Library with generic container templates (such as … Read More → "SEGGER makes cutting-edge C++ library available for licensing"

ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production

FREMONT, Calif., April 21, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that its 18 chamber, 300mm Ultra … Read More → "ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production"

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors

  • Applied extends 2D EUV logic scaling with Stensar™ CVD alternative to spin-on patterning films
  • Previews broadest portfolio of technologies for 3D Gate-All-Around transistors including two new IMS™ systems

SANTA CLARA, Calif., April 21, 2022 (GLOBE NEWSWIRE) — Applied Materials, Inc. today introduced innovations that help customers continue 2D scaling with EUV and detailed the industry’s broadest portfolio of technologies for manufacturing next-generation 3D Gate-All-Around transistors.

Chipmakers are pursuing two complementary paths to increase transistor density in the years ahead. One is classic Moore’s Law 2D scaling, creating smaller features using … Read More → "Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors"

Gwangju Institute of Science and Technology Researchers Detect Coronavirus Particles with “Slow Light”

Existing methods for detecting and diagnosing COVID-19 are either expensive and complex or inaccurate. Now, scientists from the Gwangju Institute of Science and Technology have developed a novel biosensing platform to detect and quantify viral particles using a simple optical microscope and antibody proteins. Their versatile approach, based on slowing down light, could pave the way to new diagnostic tools and next-generation detection platforms that are fast, accurate, and low-cost.
 
Despite all the bad news the COVID-19 pandemic brought upon the world, it has helped us gain a better perspective of our readiness … Read More → "Gwangju Institute of Science and Technology Researchers Detect Coronavirus Particles with “Slow Light”"

Keysight Enables Engineers to Verify, Debug CAN XL and Other Automotive Protocols

SANTA ROSA, Calif. April 21, 2022  — Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, has released the industry’s first oscilloscope-based automotive protocol trigger/decode solution (D9010AUTP) covering CAN XL (Controller Area Network eXtra … Read More → "Keysight Enables Engineers to Verify, Debug CAN XL and Other Automotive Protocols"

Winbond Keeps Expanding DDR3 SDRAM Production

TAICHUNG, Taiwan– 2022-04-20 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced key enhancements to its DDR3 product on the ultra-high-speed performance.

Winbond’s 1.35V DDR3 products support 2133Mbps data rate in both x8 and x16 configurations and are 100% compatible to 1.5V DDR3. Winbond’s DRAM roadmap now supports 1Gb-4Gb DDR3, 128Mb-2Gb DDR2, 512Mb-2Gb LP-DDR2, as well as LP-DDR4x, LP-DDR3, LP-DDR, SDRAM interfaces for applications which require 4Gb or below densities DRAM products, such as AI accelerator, IoT, Automotive, Industrial, Tele-communication, WiFi-6, WiFi-6e, … Read More → "Winbond Keeps Expanding DDR3 SDRAM Production"

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