News – Page 48 – EEJournal

Digital Twin Consortium Welcomes AMD to Accelerate AI-Powered Digital Twin Innovation at the Edge

Leading semiconductor company brings AMD Ryzen ™ AI technology and Minions framework expertise to advance intelligent digital twin systems

September 18, 2025

BOSTON, MA and SANTA CLARA, CA – SEPTEMBER 17, 2025 – Digital Twin Consortium® (DTC) today announced that Advanced Micro Devices, Inc. (AMD) has joined as a member. AMD will bring its cutting-edge AI processing capabilities and innovative edge computing solutions to accelerate AI-powered digital twin systems development and deployment across industries.

The addition of AMD is pivotal as the digital twin market rapidly evolves toward intelligent, autonomous systems powered by artificial intelligence. The company’s recent breakthrough innovations include AMD Ryzen™ AI … Read More → "Digital Twin Consortium Welcomes AMD to Accelerate AI-Powered Digital Twin Innovation at the Edge"

Value-optimized power-management IC for automotive applications

September 18, 2025

The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameters and qualified to AEC-Q100, the SPSA068 supports ISO 26262 functional safety (FuSa) approval up to ASIL-B.

Designed for use with microcontrollers (MCUs) that operate from a single-supply voltage, the SPSA068 implements all the features required in a turnkey solution for MCU power management. It integrates a 1A battery-compatible buck voltage regulator, a precise (1%) voltage … Read More → "Value-optimized power-management IC for automotive applications"

NEXCOM’s Rugged Edge AI Computer, ATC 3561-NA4C, for Smart Agriculture

Robust NVIDIA Jetson AI Power To Support Autonomous Operations in Harsh Environments

September 18, 2025

New Taipei City, Taiwan – September 18th, 2025 – NEXCOM is pleased to announce a new, powerful and rugged Edge AI Computer, ideal for smart agriculture applications: the ATC 3561-NA4C. This complete computer system delivers up to 67 TOPS of AI inference performance (for the 8GB version in Super Mode), and has a wide range of high-performance wired and wireless communications options, making it ideal for agricultural applications such as autonomous vehicles for planting, weeding, crop care, harvesting and more. The ATC 3561-NA4C is built around the high-performance NVIDIA® Jetson Orin Nano™ SOM (System on Module).

Other applications for … Read More → "NEXCOM’s Rugged Edge AI Computer, ATC 3561-NA4C, for Smart Agriculture"

CEA-Leti to Present Breakthrough Toward Ultra-Compact, High-Resolution AR/VR Displays at MicroLED Connect Conference

Published in ‘Nature Communications Materials’, Paper Details Creation of Record-Setting Red Emission from InGaN Quantum Wells

September 17, 2025

GRENOBLE, France – Sept. 16, 2025 – CEA-Leti and the Centre for Research on Heteroepitaxy and its Applications (CRHEA) today announced R&D results that have cleared a path toward full-color microdisplays based on a single material system, a long-standing goal for augmented and virtual reality (AR/VR) technologies.

The project, presented in a paper published in Read More → "CEA-Leti to Present Breakthrough Toward Ultra-Compact, High-Resolution AR/VR Displays at MicroLED Connect Conference"

Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation

September 17, 2025

Siemens Digital Industries Software today introduced Tessent™ AnalogTest software – an innovative solution that reduces pattern generation time for analog circuit tests from months to days. The solution enables testing of analog circuitry in integrated circuits (ICs) up to 100 times faster than traditional manual methods.

Analog circuit testing has traditionally been a labor-intensive endeavor, requiring prolonged test coding and expensive mixed-signal test equipment. Working in tandem with Siemens’ market-proven Tessent DefectSim technology, the new Tessent AnalogTest software helps to dramatically shorten test coding time for analog circuitry in ICs … Read More → "Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation"

TDK adds SmartMotion® for Smart Glasses to its custom sensing solutions for AI glasses and augmented reality

September 17, 2025

TDK’s advanced motion tracking IMU with an embedded machine learning solution enables responsive, motion context-aware smart eyewear for augmented reality and seamless AI accessibility in wearables
New custom IMU with BalancedGyroTM and on-chip sensor fusion offers high precision head orientation tracking, optical/electronic image stabilization, and intuitive UI control at ultra-low power
TDK’s suite of sensing solutions for smart glasses, AR glasses, and extended reality also includes MEMS microphones, TMR-based magnetometers, and ultrasonic time-of-flight solutions

September 16, 2025

TDK Corporation (TSE:6762) announces a new custom sensing solution for intelligent … Read More → "TDK adds SmartMotion® for Smart Glasses to its custom sensing solutions for AI glasses and augmented reality"

Ethernet and AI Converge in Ethernet Alliance’s ECOC 2025 Demo

Ethernet Alliance’s multivendor demo shows how Ethernet’s scalability, interoperability, and energy efficiency are powering AI, HPC, and next-gen networks

September 17, 2025

BEAVERTON, OR, Sept. 16, 2025 (GLOBE NEWSWIRE) — The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today announced it will be showcasing … Read More → "Ethernet and AI Converge in Ethernet Alliance’s ECOC 2025 Demo"

Infineon expands XENSIV™ MEMS microphone lineup delivering best-in-class audio and power performance

September 17, 2025

Munich, Germany – 16 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its XENSIV™ MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

The IM72D128V is … Read More → "Infineon expands XENSIV™ MEMS microphone lineup delivering best-in-class audio and power performance"

Tektronix redefines automated test with the MP5000 Series modular precision test system

First-of-its-kind system brings unmatched flexibility, density, and automation to validation and production environments

September 17, 2025

Beaverton, Oregon – Tektronix today unveiled the MP5000 Series modular precision test system, a transformative solution that sets the pace for the future of automated test. Built on the principle of modularity, it allows engineers to combine precision source measure units (SMUs) and programmable power supply units (PSUs) within a compact 1U mainframe—delivering the adaptability and scalability modern validation and production workflows demand.

At launch, the system includes a 60-volt dual-channel SMU, a dual-channel 50-watt bipolar power supply, and the MP5103 mainframe. Engineers can configure up … Read More → "Tektronix redefines automated test with the MP5000 Series modular precision test system"

Latent AI and Wind River Collaborate to Advance Edge AI for Mission-Critical Systems

Combination of Latent AI and Wind River Platforms Will Accelerate Delivery of Real-Time, Secure, and Adaptive Decision-Making in the Most Demanding Environments

September 16, 2025

PRINCETON, NJ and ALAMEDA, CA – Sep. 11, 2025 –Latent AI, a leader in edge AI solutions, and Wind River, an Aptiv company and global leader in delivering software for the intelligent edge, today announced a strategic … Read More → "Latent AI and Wind River Collaborate to Advance Edge AI for Mission-Critical Systems"

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