News – Page 24 – EEJournal

Arkisys announces the return of NASA’s Astrobee

January 22, 2026

LOS ALAMITOS, Calif. (January 21, 2026) – Arkisys™, a provider of on-orbit services on long-duration platforms for post launch applications, announces the return of Astrobee, NASA’s bee-inspired free-flying robotic system, as the technology has officially activated operational status.

Astrobee, known for its unique cube-shaped design, has played a vital role in supporting research and technology demonstrations aboard the International Space Station (ISS). Under … Read More → "Arkisys announces the return of NASA’s Astrobee"

Clever-Click module carrier frames for HEAVYCON connectors

Simple and tool-free assembly for heavy-duty connectors

January 22, 2026

Middletown, PA – Phoenix Contact’s new HEAVYCON Clever-Click modular insert carrier frame simplifies the assembly and installation of heavy-duty connectors. The tool-free, click-in latching system enables the modular insert assembly to be mounted inside HEAVYCON housings quickly and reliably – without any screws.

An audible and tactile click signals the correct position, ensuring maximum process reliability while minimizing time expenditure. The ground conductor uses proven Push-in Technology for easy connection. As a bonus, the ground conductor contact can also be fitted while the frame is installed in a panel mounting base, … Read More → "Clever-Click module carrier frames for HEAVYCON connectors"

Vishay Intertechnology 100 V Gen 2 TMBS® Rectifier Modules Deliver Forward Voltage Drop Down to 0.83 V in SOT-227 Package

Devices Offer Drop-in Replacements to Reduce Conduction Losses and Increase Efficiency in Industrial Applications

January 22, 2026

MALVERN, Pa. — Jan. 21, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new 100 V Gen 2 Trench MOS Barrier Schottky (TMBS®) rectifier modules in the compact, fully insulated SOT-227 package. Optimized for power conversion in industrial applications, the devices offer best-in-class forward voltage drop down to 0.83 V to reduce conduction losses.

The Vishay Semiconductors rectifier modules released today consist of the dual-diode 100 A VS-QA100FA10, 200 A VS-QA200FA10, and 400 A VS-QA400FA10 in parallel configurations, and the 150 A single phase bridge VS-QA150BA10. With their industry-standard SOT-227 package, the devices can be used as drop-in replacements for competing solutions … Read More → "Vishay Intertechnology 100 V Gen 2 TMBS® Rectifier Modules Deliver Forward Voltage Drop Down to 0.83 V in SOT-227 Package"

Computer-on-Modules for an efficient entry into rugged embedded edge AI applications

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series

January 22, 2026

San Diego, CA, January 21, 2026 * * * Read More → "Computer-on-Modules for an efficient entry into rugged embedded edge AI applications"

PX5 NET Earns TÜV Functional Safety Certification, Completing the Company’s Certified Embedded Software Stack

Certification of PX5 RTOS, file systems and networking stack with industry-standard APIs facilitates faster, lower-risk development of safety-critical embedded systems

January 22, 2026

SAN DIEGO—January 21, 2026—PX5, a global leader in high-performance real-time operating systems (RTOS) and middleware, today announced off-the-shelf functional safety certification of the PX5 NET embedded TCP/IP stack. This milestone means that all three PX5 core products — PX5 RTOS, PX5 FILE and PX5 NET — are now SGS-TÜV Saar certified, making PX5 the only RTOS provider delivering an end-to-end functional safety-certified software foundation for enabling faster, lower-risk development of mission-critical embedded systems across automotive, industrial, medical and rail industries.

PX5 NET is an embedded TCP/IP stack for deeply embedded IoT applications, delivering advanced real-time TCP/ … Read More → "PX5 NET Earns TÜV Functional Safety Certification, Completing the Company’s Certified Embedded Software Stack"

ASRock Industrial Launches AiSafeguard to Reinforce Device Security with Honeypot Sandbox and Zero Trust

January 21, 2026

Taipei, Taiwan (Jan 20, 2026) – As industries accelerate toward digital and connected operations, cybersecurity has become critical to maintaining trust and reliability at the edge. ASRock Industrial, the trusted pioneer in Secure Edge AI Platforms, today announced the launch of AiSafeguard, an intelligent device isolation solution designed to strengthen endpoint protection and ensure continuous, secure operations in industrial and enterprise environments. Build on ASRock Industrial’s security vision of Secure Device, Secure Deployment, and Secure Operation, AiSafeguard leverages Honeypot Sandbox technology and a zero-trust architecture to seamlessly integrate with ASRock Industrial Robust Edge AIoT Platforms. The solution automatically detects, … Read More → "ASRock Industrial Launches AiSafeguard to Reinforce Device Security with Honeypot Sandbox and Zero Trust"

Centimeter-Accurate Navigation with Syslogic Embedded Systems

January 20, 2026

Baden-Daettwil, January 20, 2026

Embedded systems specialist Syslogic launches a new all-band GNSS expansion board for its industrial computers. The board delivers extremely precise and reliable positioning worldwide – ideal for autonomous machines and vehicles.

Syslogic introduces a new GNSS expansion board for its rugged embedded computers. Based on u-blox GNSS technology, the board provides centimeter-level positioning, opening up new applications across industries – such as autonomous field management, operation of construction machinery in remote areas, or navigation of AGVs (Automated Guided Vehicles) and AMRs (Autonomous Mobile Robots).

All-Band, Multi-Frequency Reception, and HAS-Ready

Zuken and LogicSwap Launch Free Cadence OrCAD to eCADSTAR Data Migration Software

Free module helps Cadence OrCAD users migrate PCB designs, schematics, and libraries into Zuken’s internet-connected eCADSTAR platform.

January 20, 2026

Yokohama, Japan and Westford, Mass., USA, January 20, 2026 – Zuken, a global provider of software and consulting services for electrical and electronic engineering, today announced the release of a free migration module created together with LogicSwap Solutions, a leading provider of data migration tools in the Electronic Design Automation (EDA) industry. The new module enables users of Cadence OrCAD® to transfer existing PCB designs, schematics, and libraries into eCADSTAR®, Zuken’s modern, internet-connected PCB design platform.

The software provides a direct and automated path for converting legacy OrCAD data into eCADSTAR-compatible formats, minimizing the effort and risk typically associated … Read More → "Zuken and LogicSwap Launch Free Cadence OrCAD to eCADSTAR Data Migration Software"