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Quantica Infrastructure Joins Forces with Nomad Futurist Foundation as an Inspiration Sponsor to Empower the Next Generation of Digital Infrastructure Leaders

November 19, 2025 — The Nomad Futurist Foundation, a 501(c)(3) nonprofit committed to educating and empowering the next generation of digital infrastructure leaders, is proud to welcome Read More → "Quantica Infrastructure Joins Forces with Nomad Futurist Foundation as an Inspiration Sponsor to Empower the Next Generation of Digital Infrastructure Leaders"

Vishay Intertechnology AEC-Q200 Qualified, 30 W Thick Film Power Resistor Offers High Reliability for Automotive Applications

MALVERN, Pa. — Nov. 19, 2025 — To meet the growing demand for high performance electronic components in next-generation automotive applications, Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified, 30 W thick film power resistor in a compact TO-220 package for direct mounting on a heatsink.

Engineered to ensure exceptional reliability and durability in even the most extreme automotive environments, the Vishay Sfernice LTA 30 withstands high humidity conditions and temperatures to
+125 °C, while providing a high tolerance against vibration and electrical stress. In addition, the resistor combines a high 500 V operating voltage with a strong overload capability (1.5x … Read More → "Vishay Intertechnology AEC-Q200 Qualified, 30 W Thick Film Power Resistor Offers High Reliability for Automotive Applications"

Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability

MUNICH, Nov. 13, 2025 (GLOBE NEWSWIRE) — Automotive Computing Conference — Micron Technology, Inc. (Nasdaq: MU), today announced shipping of qualification samples of its automotive universal flash storage (UFS) 4.1 solution to customers worldwide, enabling rapid data access, robust reliability and enhanced safety and security for next-generation vehicles. Delivering bandwidth of 4.2 gigabytes per second (GB/s) — double that of its predecessor — Micron’s automotive UFS 4.1 accelerates data access for AI models, enriching the in-cabin experience by powering features such as voice assistants, personalized infotainment and advanced safety alerts. This bandwidth in advanced driver assistance systems (ADAS) and autonomous vehicles also enables rich data capture … Read More → "Micron Ships Automotive UFS 4.1, Designed to Unlock Intelligent Mobility With Speed, Safety and Reliability"

Q.ANT Unveils its Second-Generation Photonic Processor to Power the Next Wave of AI and HPC

Stuttgart / St. Louis – November 18, 2025 – Q.ANT today announced the availability of its next-generation Native Processing Unit: The Q.ANT NPU 2, with enhanced nonlinear processing capabilities to deliver orders-of-magnitude gains in energy efficiency and performance for AI and high-performance workloads. By performing nonlinear mathematics natively in light, the Q.ANT NPU 2 enables entirely new classes of AI and scientific applications including physical AI and advanced robotics, next-generation computer vision and industrial intelligence and physics-based simulation and scientific discovery. Q.ANT is offering its NPUs directly as a 19” Server Solution including x86 host processor and Linux operating system.

“Q. … Read More → "Q.ANT Unveils its Second-Generation Photonic Processor to Power the Next Wave of AI and HPC"

SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology

  • SAICEC creating digital twins of its automotive systems with Siemens’ PAVE360 to enable certified system-to-chip level verification and accelerate software defined vehicle (SDV) development in Asia
  • The collaboration helps OEMs address Advanced Driver Assistance Systems (ADAS) and In-Vehicle Infotainment (IVI) development challenges by enabling early validation and reducing costly redesigns
  • PAVE360 provides a scalable digital environment that supports faster innovation, improved safety and reduced development timelines

Today, Siemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of … Read More → "SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology"

IAR and Quintauris join forces to advance Functional Safety software for RISC-V Automotive real-time applications

Munich, Germany – November 17, 2025 – IAR, a leading provider of software solutions for embedded systems development, today announced a partnership with Quintauris, a global provider of RISC-V based solutions.

The collaboration enables the IAR embedded development platform to be part of Quintauris’ RT-Europa Reference Architecture offering, leveraging IAR’s certified compiler and enabling future integration of the automated build tools, advanced debugging, and testing technologies for RISC-V automotive real-time applications.

By combining IAR’s trusted toolchain with Quintauris’ RISC-V reference architecture, developers gain access to a powerful, production-ready environment that accelerates software development while ensuring compliance … Read More → "IAR and Quintauris join forces to advance Functional Safety software for RISC-V Automotive real-time applications"

MicroEJ and Boon Logic Partner to Simplify Edge AI with Unsupervised Learning for All Embedded Devices

BOSTON, Nov. 17, 2025 (GLOBE NEWSWIRE) — MicroEJ, a global leader in embedded software, in partnership with Boon Logic, provider of the world’s fastest AI-based anomaly detection solutions, today announced PicoAI, a new software component designed … Read More → "MicroEJ and Boon Logic Partner to Simplify Edge AI with Unsupervised Learning for All Embedded Devices"

EMASS Brings Edge AI to Life with ECS-DoT at CES 2026

LOS ANGELES (Nov. 18, 2025) – EMASS, a Nanoveu subsidiary with next-generation semiconductor technology, today announced its participation in CES 2026, taking place January 6–9, 2026 in Las Vegas, Nevada. EMASS will demonstrate its ECS-DoT system-on-chip (SoC) — a milliwatt-class, on-device AI platform engineered to deliver always-on intelligence with ultra-low latency and dramatically reduced power consumption — in the Venetian Suites. EMASS’ participation in CES 2026 comes off the heels of new collaborations, continued development and increased distribution networks, deepening EMASS’ position as an edge … Read More → "EMASS Brings Edge AI to Life with ECS-DoT at CES 2026"

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