News – Page 2223 – EEJournal

Renesas Electronics America Expands Its Hardware-Assisted Capacitive Touch Microcontroller Lineup

May 3, 2011

SANTA CLARA, Calif., May 2, 2011-Renesas Electronics America Inc. today announced the addition of two new product groups within the R8C microcontroller (MCU) family, which incorporates Renesas Electronics’ innovative touch-sensor control unit (TSCU). The R8C/36T-A and R8C/38T-A product groups expand the number of touch channels to 28 and 36 respectively, and offer up to 128 kilobytes (KB) of program memory suitable for single-chip embedded designs.

The 18 new devices add a number of enhancements to the TSCU hardware block especially designed for touch-key sensing applications. The block supports up to 36 independently connected electrodes … Read More → "Renesas Electronics America Expands Its Hardware-Assisted Capacitive Touch Microcontroller Lineup"

Rohde & Schwarz’s R&S®RTO scope series enhances performance of embedded systems

May 3, 2011

ESC Silicon Valley, May 3, 2011 — Rohde & Schwarz, a leading manufacturer of test & measurement, communications and broadcasting equipment, has developed the industry’s only digital oscilloscope that employs a real-time digital trigger. Designated the R&S®RTO Series, the advanced scope significantly enhances productivity and product performance when debugging embedded systems.

The real-time digital trigger in the R&S®RTO Scope Series uses a common signal path for both the trigger and acquired data. This eliminates time and amplitude offset between the trigger and signal, enabling signals to be displayed with the least … Read More → "Rohde & Schwarz’s R&S®RTO scope series enhances performance of embedded systems"

InPA Systems and the Dini Group Partner to Provide Rapid Prototyping Solutions

May 3, 2011

San Jose, California – May 2, 2011 – InPA Systems, Inc., an innovator in FPGA-based rapid prototyping bring up and debug, and the Dini Group, a leading provider of FPGA Cluster Computing, High Performance Computing (HPC) and ASIC prototyping boards, announced today that they have partnered for the development and testing of an integrated solution for high-speed, multi-FPGA debug. This technology is still in beta, but it is expected to be released in Q3 2011. InPA will demonstrate their integrated … Read More → "InPA Systems and the Dini Group Partner to Provide Rapid Prototyping Solutions"

Tanner EDA and Dongbu HiTek Announce Availability of Foundry-certified 0.18-micron Analog CMOS PDK

May 3, 2011

MONROVIA, California – May 3, 2011 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal (A/MS) integrated circuits (ICs) and Dongbu HiTek, the world leader in specialty foundry, have jointly developed a foundry-certified process design kit (PDK) that is seamlessly integrated into Tanner EDA’s cohesive, integrated tool flow. Dongbu HiTek’s AN180 (0.18-micron analog CMOS) is optimized for performance and density. It offers dense 1.8V logic and 5V CMOS, and moderate levels of … Read More → "Tanner EDA and Dongbu HiTek Announce Availability of Foundry-certified 0.18-micron Analog CMOS PDK"

New Ramtron F-RAM Processor Companion with TCXO Targets High-Volume Consumer, Industrial, and Computing Markets

May 3, 2011

Colorado Springs, CO and San Jose, CA – May 3, 2011 – Ramtron International Corporation (Nasdaq: RMTR), the leading supplier of nonvolatile ferroelectric memory products, today announced at the Embedded Systems Conference upgrades to the company’s family of Processor Companion products targeted at the high-volume, processor-based electronics system market. Ramtron’s new Processor Companion integrates a precise Real-Time Clock (RTC) with a temperature compensation crystal oscillator (TCXO), 256-kilobits (Kb) of nonvolatile ferroelectric random access memory (F-RAM), and a suite of peripheral functions. The highly integrated Processor Companion with TCXO offers competitive advantages for leading-edge electronics … Read More → "New Ramtron F-RAM Processor Companion with TCXO Targets High-Volume Consumer, Industrial, and Computing Markets"

Industry’s first ultra-low-power FRAM microcontroller from TI enables developers to make the world smarter

May 3, 2011

DALLAS, TX (May 3, 2011) – Ushering in a new era of reliable data logging and RF communication capabilities, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the industry’s first ultra-low-power ferroelectric random access memory (FRAM) 16-bit microcontrollers. Further demonstrating TI’s embedded processing leadership, the new MSP430FR57xx FRAM series ensures data can be written more than 100 times faster and uses as little as 250 times less power than flash- and EEPROM-based microcontrollers. Additionally, the on-chip FRAM allows data retention in all power modes, supports more than 100 trillion write cycles, and delivers a new dimension of flexibility by … Read More → "Industry’s first ultra-low-power FRAM microcontroller from TI enables developers to make the world smarter"

NetLogic Microsystems Introduces the Industry’s Most Powerful Multi-Core Control-Plane Processor for LTE Communications Infrastructure

May 3, 2011

Santa Clara, Calif. – May 2, 2011 –NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced the introduction of the newest member of its XLP^® processor family, the XLP316 processor which features a best-in-class quad-core, 16-issue, 16-threaded, superscalar processor architecture at up to 2.0GHz with out-of-order execution and superior L3 cache to address the most demanding control-plane processing requirements in communications, networking, storage and security applications.

Control-plane processing requirements in 3G/4G LTE mobile infrastructure are increasing exponentially due to the significant growth … Read More → "NetLogic Microsystems Introduces the Industry’s Most Powerful Multi-Core Control-Plane Processor for LTE Communications Infrastructure"

Cadence Announces Breakthrough in System Development to Meet Demands of ‘App-Driven’ Electronics

May 3, 2011

SAN JOSE, CA–(Marketwire – May 3, 2011) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced a breakthrough in electronic design with a new suite of products that promises to cut system integration time by up to half for next-generation designs. Bringing hardware and software development closer together than ever before, the suite features four connected platforms that enable hardware-software co-design from architectural-level development through to prototyping. While some companies focus on a portion of the development cycle, no … Read More → "Cadence Announces Breakthrough in System Development to Meet Demands of ‘App-Driven’ Electronics"

IAR Systems Delivers Advancements in Power Debugging Technology

May 3, 2011

Embedded Systems Conference, San Jose, CA—May 3, 2011—IAR Systems® today announced new advancements in its innovative award-winning Power Debugging technology. Enhancements include the possibility to define power thresholds for filtering power data and to set power breakpoints, functionality that greatly simplify the process to accurately locate source code triggering unexpected levels of power consumption. Higher sampling rates of up to 10kHz also allows higher resolution in the correlation between power samples and source code.

Because the integrated power debug technology offered in IAR Embedded Workbench® requires no extra tools, software … Read More → "IAR Systems Delivers Advancements in Power Debugging Technology"

Atmel Launches AVR Xplained Kits to Accelerate System Development Times for MCU Applications

May 3, 2011

ESC Silicon Valley 2011, San Jose, CA, May 3, 2011 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, today announced it is expanding the Atmel AVR® Xplained evaluation kits to support applications in the industrial, consumer, automotive and computing markets. Supporting all Atmel AVR devices including the megaAVR®, AVR XMEGA® and AVR UC3 families, the new Xplained kits create a great platform for developers to easily evaluate Atmel AVR devices early in the design cycle. A range of extension boards are also being released as accessory devices to offer customers the ability to easily evaluate … Read More → "Atmel Launches AVR Xplained Kits to Accelerate System Development Times for MCU Applications"

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