News – Page 22 – EEJournal

Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics

First-Of-Its-Kind Solution For Barium Titanate Epitaxy on Silicon to Accelerate Datacom and Quantum Computing Applications

January 28, 2026

Plainview, N.Y. (U.S.A) and Leuven (Belgium), January 28, 2026 – Veeco
Instruments Inc. (Nasdaq: VECO) and imec announced today that they have
collaboratively developed a 300mm high volume manufacturing compatible
process that enables the integration of barium titanate (BaTiO3 or BTO)
on a silicon photonics platform. BTO is a promising material with unique
electro-optical properties that can be used for high-speed and low-power
light modulation in emerging applications such as high-speed optical
transceivers, quantum computing, light detection and ranging (LiDAR),
and AR/VR applications. Historically, approaches to integrate BTO have
… Read More → "Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics"

NEXCOM Unveils NDiS B340, a Cost-efficient and Expandable Edge Computing Platform

Optional PCIe expansion enables scalable SD-Edge deployment

January 28, 2026

Taipei, Taiwan – January 28^th, 2026 – Edge computing today faces competing demands, for computers which are affordable and power efficient, but also for computers which can take on more demanding roles when required. Now, NEXCOM’s new NDiS B340 Duro Edge Computer serves this large but challenging market in a single product, with a versatile base unit that can be upgraded at any time with a dockable PCIe expansion module (DockInfinity-E4X1).

This provides the best of both worlds: a compact and affordable base computer with a huge array of connectivity options, which can be extended on … Read More → "NEXCOM Unveils NDiS B340, a Cost-efficient and Expandable Edge Computing Platform"

Concurrent Unveils Industry-Leading 32-Core 3U VPX using Intel Xeon 6 Soc Designed by Pioneering Engineer Rachael Peterson

January 28, 2026

-For immediate release- Concurrent, a leader in embedded computing solutions, is launching an enhanced version of its flagship rugged computing product, Kratos.

The new Kratos 32-core increases available performance from the original 20-core version and so becomes the highest-core-count Intel® Xeon® 3U VPX computing board available. Built around a 32-core Intel® Xeon® processor in a SOSA® aligned 3U VPX form factor, this latest version sets a new industry standard for computing power in compact, mission-ready hardware.

While the earlier released Kratos (20-core) combines 20 CPU cores with a vRAN accelerator, making it … Read More →

SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability

Policy Priorities Focus on Trade, Workforce, Investment Certainty, CHIPS Act Implementation, and Supply Chain Resilience

January 28, 2026

MILPITAS, Calif. — January 28, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced its Read More → "SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability"

Partsol Announces Next Generation AI Stem Cells, A New Foundation for Truth Based Cognitive Intelligence

Revolutionary technology redefines how AI is designed, grown, and trusted, promising to transform high stakes industries from cancer research to national security

January 28, 2026

TAMPA, Fla., Jan. 28, 2026 /PRNewswire/ — Partsol today announced the release of their enhanced AI Stem Cells, a groundbreaking scientific breakthrough that redefines how artificial intelligence is designed, grown, and trusted. Revealed through a newly released video, these next generation AI Stem Cells represent a new approach to cognitive intelligence rooted in absolute truth rather than probabilistic guesswork. Watch the full video here: Read More → "Partsol Announces Next Generation AI Stem Cells, A New Foundation for Truth Based Cognitive Intelligence"

Microchip Technology’s PIC32WM-BZ6 Multiprotocol Module, Now at Mouser, Delivers Connectivity and Scalability in IoT Devices

January 28, 2026

January 28, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the Read More → "Microchip Technology’s PIC32WM-BZ6 Multiprotocol Module, Now at Mouser, Delivers Connectivity and Scalability in IoT Devices"

Vishay Intertechnology 1200 V SiC MOSFET Power Modules in Industry-Standard SOT-227 Package Increase Power Efficiency

Devices Offer Drop-in Replacements for Competing Solutions in Medium to High Frequency Applications

January 28, 2026

MALVERN, Pa. — Jan. 28, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems. The Vishay Semiconductors VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 feature Vishay’s latest generation silicon carbide (SiC) MOSFETs in the industry-standard SOT-227 package.

Offered in single switch and low side chopper configurations, each power module released today features a SiC MOSFET integrated with a soft body diode offering low reverse recovery. The result is reduced switching losses and … Read More → "Vishay Intertechnology 1200 V SiC MOSFET Power Modules in Industry-Standard SOT-227 Package Increase Power Efficiency"

Samtec Generate® High-Speed, 0.80 mm Pitch Edge Card Sockets Available for Immediate Delivery

January 27, 2026

New Albany, IN: Samtec’s Generate 0.80 mm pitch edge card sockets (HSEC8 series) feature Edge Rate^® contacts optimized for signal integrity performance. Part of the Samtec Reserve^® program, these high-performance edge card sockets are available for next-day volume delivery and are also part of Samtec’s free sample program. They are used in many applications and industries, including computers and peripherals, telecommunications, datacom, industrial equipment, medical, test and measurement, instrumentation, and military and aerospace.

The Generate 0.80 mm pitch edge card sockets feature Samtec’s proprietary Edge Rate contact system, specifically designed for high-speed, … Read More → "Samtec Generate® High-Speed, 0.80 mm Pitch Edge Card Sockets Available for Immediate Delivery"

Panasonic Industry launches its first flat lens, high-performing PIR sensor

Aesthetics meets breakthrough performance with next-generation PaPIRs+ detection technology

January 27, 2026

MUNICH, January 2026

Panasonic Industry announces the launch of its latest innovation in PIR motion sensors: the Flat Wide Detection Type (12 lens), being the first product incorporating the new PaPIRs+ technology.

Engineered for modern building automation, professional lighting control, and smart home markets, the Flat Wide Detection Type features a sleek, discreet flat lens that seamlessly integrates into any aesthetically demanding application. Its wide field of view of 136.4° × 135.4° maximizes coverage, reducing the number of sensors needed and simplifying installation.

By redesigning the pyroelectric elements, PaPIRs+ delivers twice the sensitivity compared … Read More → "Panasonic Industry launches its first flat lens, high-performing PIR sensor"

Chiplet Summit Announces Pre-Conference Day Schedule

Tutorials that bring chiplet practitioners at all experience levels up to speed

January 27, 2026

SANTA CLARA, Calif., January 26, 2026 – Read More → "Chiplet Summit Announces Pre-Conference Day Schedule"