News – Page 2191 – EEJournal

Cadence Accelerates Adoption of Emerging Mobile Standards With Expanded Verification IP Portfolio

September 26, 2011

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced new protocol and memory model verification IP (VIP) that will accelerate the adoption of the latest mobile standards. Through close collaboration with leading system and semiconductor companies, and standards bodies, Cadence is delivering VIP at a very early … Read More → "Cadence Accelerates Adoption of Emerging Mobile Standards With Expanded Verification IP Portfolio"

NXP Delivers Industry’s Lowest Power Ku-Band Downconverters for Satellite TV Receivers

September 23, 2011

Eindhoven, Netherlands, September 22, 2011 – NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the TFF101xHN, a family of integrated downconverters for use in Low Noise Block (LNB) 10.7-GHz to 12.75-GHz Ku band satellite receiver systems. Designed for downlink signal reception for TV satellite dishes, NXP’s new family of DVB-S compliant downconverters consume 50-percent less current (52 mA) than other integrated solutions, significantly increasing the lifetime of the LNB and improving its reliability. The new downconverters are … Read More → "NXP Delivers Industry’s Lowest Power Ku-Band Downconverters for Satellite TV Receivers"

ADLINK releases multi-function USB DAQ modules

September 23, 2011

Baltimore, MD – AUTOTESTCON – September 14, 2011 – ADLINK Technology, Inc., a leading global provider of trusted testing and measurement products, announces the release of its USB-1900 Series and USB-2401 USB DAQ modules. Equipped with built-in signal conditioning, the USB-powered Plug and Play USB DAQ modules deliver easy connection and accurate results for both portable measurement and machine automation applications. Featuring built-in signal conditioning, ADLINK USB DAQ modules enable direct measurement of … Read More → "ADLINK releases multi-function USB DAQ modules"

Spime Announces Launch of SUPL 2.0 Client for Location Positioning with a Tier One Chipset Maker

September 23, 2011

September 19, 2011 (MMD Newswire) – – Spime Inc., the leading provider of LBS technology, today announces the launch of its SUPL 2.0 client with a US based, Tier One chipset manufacturer. Spime’s SUPL is a middleware for smart phones and Tablets that implements a SUPL client enabling SET (SUPL Enabled Terminal) based or SET assisted position determination.

Spime’s SUPL client is a complete implementation of the Secure User Plane Location protocol V2.0 that enables wireless service providers to provide a new generation of location based services (LBS). The SUPL 2.0 client implements the Open Mobile Alliance (OMA) standards based bearer … Read More → "Spime Announces Launch of SUPL 2.0 Client for Location Positioning with a Tier One Chipset Maker"

Microchip Technology Delivers 10 Billionth PIC® Microcontroller to Samsung Electronics Co.

September 23, 2011

CHANDLER, Ariz., Sept. 19, 2011 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced the shipment of its 10 billionth PIC^® microcontroller (MCU) to Samsung Electronics Co., Ltd. Microchip delivered this 10 billionth microcontroller, the 32-bit PIC32MX340F256(http://www.microchip.com/get/N46K), approximately 10 months after delivering its nine billionth.

Vector Fabrics Demonstrates Parallelization Tool for Multicore NVIDIA Tegra Mobile Chips at ESC Boston

September 23, 2011

Eindhoven, The Netherlands, September 23, 2011: Vector Fabrics has announced today they will showcase their vfEmbedded software development tool parallelizing code for NVIDIA’s multicore mobile Tegra chip at ESC Boston. The vfEmbedded parallelization tool will be showcased at booth #424 at the Embedded Systems Conference.

vfEmbedded already supports the dual-core ARM Cortex-A9 configuration found in the current NVIDIA® Tegra™ 2 mobile chip, and will also support the quad-core ARM processor in NVIDIA’s next-generation Tegra chip, Project Kal-El, designed for tablet and smartphone devices.

“We’re excited to see NVIDIA push the … Read More → "Vector Fabrics Demonstrates Parallelization Tool for Multicore NVIDIA Tegra Mobile Chips at ESC Boston"

XP Power launch low cost “green” external power supplies aimed at high volume applications

September 22, 2011

XP Power announced today the launch of the VEH series of low cost “green” single output external AC-DC power supplies. Extending XP Power’s V-Brand product range aimed at high volume cost sensitive applications, the series consists of 5 power levels providing 20, 40, 60, 90 or 120 Watt output, and catering for the popular nominal output voltages from +12 to +48 VDC.

The VEH series are Energy Efficiency Level V rated and are highly efficient, up to 89%. They meet the stringent requirements of global energy efficiency standards such as EISA2007, CEC2008 and the European ErP Directive for a no-load power consumption of less than 0.5 … Read More → "XP Power launch low cost “green” external power supplies aimed at high volume applications"

NetLogic Microsystems Unleashes Groundbreaking XLP® II, the World’s Most Powerful Multi-Core Communications Processors with Unparalleled Scalability to 640 NXCPUs™

September 22, 2011

Santa Clara, Calif. – September 7, 2011 –NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced the innovative XLP® II family of multi-core processors, the industry’s most advanced and highest performance communications multi-core processors for next-generation LTE mobile infrastructure, data center, enterprise networking, storage and security applications.

As an aggressive early adopter of the state-of-the-art 28nm process technology, the XLP II processor family features groundbreaking innovations that deliver a dramatic 5-7x performance enhancement over the existing generation of XLP processors, which already offer … Read More → "NetLogic Microsystems Unleashes Groundbreaking XLP® II, the World’s Most Powerful Multi-Core Communications Processors with Unparalleled Scalability to 640 NXCPUs™"

TI introduces 36-volt op amp for the automotive market

September 22, 2011

DALLAS (September 21, 2011) – Texas Instruments Incorporated (TI) (NYSE:TXN) today introduced an automotive-qualified 36-V, single-supply, low-noise op amp (operational amplifier) that can operate on supplies ranging from +2.7 V to +36 V. The OPA171-Q1 offers high-precision performance in a cost-effective, low-power device. In addition to industry-standard packaging, the device is available for automotive qualification in the SOT-553 micro package, which is 50-percent smaller than comparable devices available today, and can reduce board space for automotive applications including HEV/EV, tracking amplifiers in power modules, and transducer amplifiers. For more information and to order samples, visit Read More → "TI introduces 36-volt op amp for the automotive market"

New Economical 5/50MHz Signal Generators From Saelig

September 22, 2011

Pittsford, NY, USA: Saelig Company, Inc. (www.saelig.com) has introduced two new, budget-priced, dual-channel Function / Arbitrary Waveform Generators, SDG1005 and SDG1050, which feature DDS (Direct Digital Synthesis) technology, providing stable, high-precision, low distortion signals. In addition to sinewaves, they also provide square waves with fast rising and falling edges, pulse and ramp waveforms, white noise, and arbitrary waveforms. The SDG Series has a clear, simple front panel, with a user-friendly layout and built-in help menu to simplify operation and adjustment. Also featured is built-in AM, FM, PM, PWM, … Read More → "New Economical 5/50MHz Signal Generators From Saelig"