Microsemi Announces Availability of Space-saving SmartFusion® cSoC Devices
ALISO VIEJO, Calif.—Oct. 4, 2011—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customisable system-on-chip (cSoC) family is now available in a “CS288” 288-ball chip scale package (CSP) package. The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.
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