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Zeo chooses Energy Micro for smartphone sleep manager

Oslo, Norway, October 18, 2011 – Energy Micro, the energy friendly micro controller and radio company has announced that Zeo, Inc., the sleep management company, is using the EFM32 Gecko MCU in its revolutionary Zeo® Sleep Manager(TM) Mobile.  Able to very accurately track both sleep quantity and sleep quality, the product helps people to take control of and improve their sleep patterns using a smartphone.

Sleep Manager Mobile is the very first of its type to offer scientifically-proven measurement of light, deep and REM sleep to provide a complete and accurate picture of the user’s sleep. & … Read More → "Zeo chooses Energy Micro for smartphone sleep manager"

Teseq’s New Power Amplifier Delivers Reliability and Consistency

Teseq, a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, has expanded its broadband amplifier line to include a new Class A model that operates from 10 kHz to 400 MHz with a saturated power level of 110 W.  The CBA 400M-110 uses gallium arsenide (GaAs) integrated circuit technology to provide markedly better compression characteristics and increased efficiency than comparable silicon-based power amplifiers. 

The new power amplifier is designed for demanding EMC testing environments with non-ideal load conditions due to mismatch caused by the coupling device or equipment under test (EUT) in … Read More → "Teseq’s New Power Amplifier Delivers Reliability and Consistency"

Renesas Electronics and Renesas Mobile Announce R-Car H1 Series of Systems-on-Chip Offering a Complete Scalable Lineup for the Car Infotainment Market

Dusseldorf, October 18, 2011 – Renesas Electronics and its subsidiary, Renesas Mobile Corporation, today announced a new member of the R-Car series of automotive systems-on-chip (SoCs), the R-Car H1, capable of delivering up to 11,650 Dhrystone MIPS (DMIPS) and ideal for the high-end car navigation market. The R-Car H1 SoC offers an innovative architecture where the application domain is powered by an ARM® Cortex™A-9 quad-core configuration running at 1 gigahertz (GHz). The real-time domain is powered by a dedicated multimedia engine (MME) based on Renesas’ SH4A core. The R-Car’s architecture allows customers to implement features such … Read More → "Renesas Electronics and Renesas Mobile Announce R-Car H1 Series of Systems-on-Chip Offering a Complete Scalable Lineup for the Car Infotainment Market"

SolarSpec™ Smart Junction Box From Molex is Optimized with SolarEdge* Technology Showcased at Solar Power International

LISLE, Ill. October 18, 2011 –  Molex Incorporated has introduced the SolarSpec™ Smart Junction Box making it easy for manufacturers of solar photovoltaic (PV) panels to provide their products with module-embedded safety and monitoring functions, as well as convenient, safe and dependable connection facilities.  The system, which will be showcased at the Read More → "SolarSpec™ Smart Junction Box From Molex is Optimized with SolarEdge* Technology Showcased at Solar Power International"

MoSys Participates at TSMC Open Innovation Platform

SANTA CLARA, Calif., October 18, 2011 –

Who:         MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is exhibiting at TSMC Open Innovation Platform®.

What:       TSMC Open Innovation Platform is a … Read More → "MoSys Participates at TSMC Open Innovation Platform"

Synopsys Low Power Solution Accelerates Time to Market for 3G Mobile IC

MOUNTAIN VIEW, Calif., Oct. 18, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced that Chongqing Chongyou Information Technologies Company, Ltd. (CYIT), a primary supplier of mobile terminal technology and product solutions for China’s 3G mobile networks, taped out its first 65 nanometer, dual-mode baseband, low-power device within five months – significantly ahead of the original schedule – using the Synopsys Galaxy™ Implementation Platform. To meet the stringent low-power requirements of the GSM/TD-SCDMA market, CYIT implemented advanced low-power techniques including multiple … Read More → "Synopsys Low Power Solution Accelerates Time to Market for 3G Mobile IC"

ARM and Cadence Achieve Industry Milestone With Tape Out of 20nm ARM Cortex-A15 MPCore Processor

SAN JOSE, CA and CAMBRIDGE, UNITED KINGDOM–(Marketwire – October 18, 2011) – “The Cortex-A15 is our most advanced ARM processor to date. The test chip is an important milestone in ARM’s preparations to enable partners using Cadence design flows and targeting TSMC’s advanced process nodes,” said Mike Inglis, Executive Vice President and General Manager, Processor Division, ARM. “The joint development and 20nm process node requirements necessitated a deep collaboration between the three companies. We look forward to evolving our relationship with Cadence to develop and deploy Cortex-A15 and several other ARM processors.”ARM and Cadence Design Systems, Inc. (NASDAQ:& … Read More → "ARM and Cadence Achieve Industry Milestone With Tape Out of 20nm ARM Cortex-A15 MPCore Processor"

KEMET Introduces First-to-Market Tantalum Stack Polymer Capacitors

KEMET has introduced its new Tantalum Stack Polymer (TSP) Series capacitors. The TSP Series is the first stack solution in the market that utilises organic conductive polymer as the cathode plate of the capacitor. The TSP Series is targeted at applications requiring high capacitance and very low ESR, but with limited board space in the consumer/gaming, computer, medical, military/aerospace, telecommunications, and transportation markets.

“Our new TSP Series surface mountable devices can be specified with a variety of capacitance and performance characteristics by stacking two, three, four, or six … Read More → "KEMET Introduces First-to-Market Tantalum Stack Polymer Capacitors"

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