News – Page 2150 – EEJournal

Meggitt Sensing Systems Adds Three-Channel Endevco® DC Differential Voltage Amplifier to Guaranteed InStock™ Program

November 22, 2011

November 21, 2011, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has announced the expansion of its worldwide Guaranteed InStock™ program to include the immediate availability of the Endevco® model 136 three-channel voltage amplifier, designed for use with bridge-type or differential output accelerometers and pressure transducers, in support of general purpose laboratory testing applications.

Featuring an industry standard bench mount configuration and four selectable excitation voltage levels, the Endevco® model 136 offers a standard RS-232 serial communications interface with either manual or computer programmable configuration. Using the supplied PC software setup, the … Read More → "Meggitt Sensing Systems Adds Three-Channel Endevco® DC Differential Voltage Amplifier to Guaranteed InStock™ Program"

COM Express Type 6 module from congatec with Intel® Quad-Core processor

November 22, 2011

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * * congatec AG has unveiled the conga-TM67, a new high-performance module for future designs. The Type 6 Pin-out and digital display interfaces ensure improved display options and increase bandwidth with additional PCI Express Lanes availability.

The new module features the second generation of Intel® Core™ processors – such as the Intel® Core™ i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core™ i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte high-speed dual-channel DDR3 memory (1333 MHz). Type 6 Pin-out is the ideal solution … Read More → "COM Express Type 6 module from congatec with Intel® Quad-Core processor"

KEMET Offers HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors for Radio Frequency and Microwave Applications

November 22, 2011

KEMET has introduced its new HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors (MLCCs) in C0G dielectric. The HiQ-CBR Series features a robust and exceptionally stable copper base metal electrode dielectric system that provides excellent low loss performance (high Q).

These devices are suitable for many circuit applications including radio frequency (RF) power amplifiers, mixers, oscillators, low noise amplifiers, filter networks, antenna tuning, timing circuits, delay lines, and magnetic resonance imaging (MRI) coils.

Typical applications include critical timing, tuning, bypass, coupling, feedback, filtering, impedance matching, … Read More → "KEMET Offers HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors for Radio Frequency and Microwave Applications"

Lattice Releases Sercos III Real-Time Industrial Ethernet Solution

November 22, 2011

HILLSBORO, OR – NOVEMBER 22, 2011 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a Sercos III real-time Ethernet solution. The low cost, low power LatticeECP3™ FPGA-enabled Sercos III solution provides a low cost and flexible design alternative for real-time industrial networking applications. Sercos III is supported by Sercos International e.V., the worldwide user organization for Sercos technology. Sercos International is showcasing the LatticeECP3-based Sercos III networking platform at this week’ … Read More → "Lattice Releases Sercos III Real-Time Industrial Ethernet Solution"

congatec unveils Qseven mini carrier baseboard for accelerated design-in

November 22, 2011

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * * congatec AG, a leading manufacturer of embedded computer modules,presents the conga-QMCB, a new mini carrier baseboard for space-critical applications based on the Qseven standard. The baseboard is ideal for fast prototype design and compact, mobile applications. Measuring just 145×95 mm, the easy-to-integrate mini carrier board is packed with a wide range of state-of-the-art interfaces and is designed to accelerate the evaluation process in the design-in phase, thereby facilitating faster time-to-market. DisplayPort, HDMI and LVDS 18/24 Bit graphics interfaces have been implemented, together with six USB interfaces and an Ethernet connection. The … Read More → "congatec unveils Qseven mini carrier baseboard for accelerated design-in"

Renesas Electronics Europe and Hilscher GmbH Cooperate on Development of a New 40-nm High-End ARM™-Based System-on-Chip (SoC) for Industrial Automation Systems

November 22, 2011

Dusseldorf, Hattersheim, Germany, November 22, 2011 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and Hilscher GmbH, a leading supplier of industrial communication systems and devices, today announced their cooperation on the development of a new system-on-chip (SoC) for future high-end motion controls and automation control products. The SoC that will be jointly developed by Hilscher and Renesas is planned to be launched as a new member of Hilscher’s next-generation, high-end communication controller … Read More → "Renesas Electronics Europe and Hilscher GmbH Cooperate on Development of a New 40-nm High-End ARM™-Based System-on-Chip (SoC) for Industrial Automation Systems"

TI Sitara™ AM335x ARM® Cortex™-A8 microprocessors: First single-chip solutions offering integrated industrial communication protocols to accelerate industrial designs

November 22, 2011

Multiple, on-chip, production-ready, industrial Ethernet and fieldbus communication protocols eliminate the need for an external ASIC/FPGA and save 30 percent on BOM costs
One scalable, low-power ARM Cortex-A8 processor platform (275 MHz to 720 MHz) for many different industrial automation applications, enabling extensive reuse
Two new industrial hardware development tools, comprehensive software and analog signal chain solution for faster, easier time to market

NUREMBURG (Nov. 22, 2011) — Developers looking to ease and accelerate their industrial automation designs can now benefit from the industry’s first ARM^®& … Read More → "TI Sitara™ AM335x ARM® Cortex™-A8 microprocessors: First single-chip solutions offering integrated industrial communication protocols to accelerate industrial designs"

DiSTI Unveils New GL Studio Package with Limited Time Offer

November 22, 2011

Orlando, FL (November 21, 2011) – The DiSTI Corporation, a leading provider of advanced graphical interface technology, launched a new package of its award-winning GL Studio software toolkit that streamlines the creation of interfaces for enhanced embedded applications. Without compromising performance or fidelity, GL Studio ES (Embedded Systems) enables a seamless transition from prototyping, to testing and to the deployment of graphical interfaces on embedded systems. Current GL Studio users now have the option to extend their existing interface designs into the embedded domain with a single unified code base.

GL Studio ES features are packaged to simplify the … Read More → "DiSTI Unveils New GL Studio Package with Limited Time Offer"

Renesas Electronics Europe and Technologie Management Gruppe GmbH Announce Availability of a Remote-IO Toolbox for IO-Link, PROFINET and Ethernet/IP

November 22, 2011

Düsseldorf, Karlsruhe, Germany, November 22, 2011 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and TMG Technologie und Engineering GmbH today announced the availability of the jointly-developed Remote-IO toolbox. The toolbox contains a set of hardware and software modules that together build a base for complete remote-IO products ready to be certified for PROFINET, and to pass Ethernet/IP plugfests and vendor declaration for IO-Link.

The hardware part of the toolbox includes an uplink controller based on Renesas’ microcontroller ( … Read More → "Renesas Electronics Europe and Technologie Management Gruppe GmbH Announce Availability of a Remote-IO Toolbox for IO-Link, PROFINET and Ethernet/IP"

IAR Systems delivers complete starter kit for high-performance STM32F407ZG microcontroller

November 22, 2011

Uppsala, Sweden—November 22, 2011—IAR Systems® today announces a new 32-bit kit for STMicroelectronics’ first ARM Cortex-M4 based microcontroller series—STM32 F4. IAR KickStart Kit™ for STM32F407ZG includes an evaluation board featuring an STM32F407ZG microcontroller, an IAR J-Link Lite debug probe for ST’s Cortex-M devices providing JTAG and SWD connections to the board, and a CD with software tools, example projects, and board support packages for different RTOSes.

The STM32 F4 series is the highest-performance ARM Cortex-M processor-based microcontroller range in the … Read More → "IAR Systems delivers complete starter kit for high-performance STM32F407ZG microcontroller"

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