News – Page 2134 – EEJournal

6WIND Announces Low-Latency Packet Processing Software for High-Frequency Trading Equipment

November 14, 2011

PARIS, France, November 14, 2011 — 6WIND, the industry standard for commercial multicore packet processing software, today announced the availability of a low-latency network layer as part of its 6WINDGate™ software solution. Optimized for high-frequency trading (HFT) applications, 6WINDGate provides low-latency protocols such as TCP Proxy (Termination and Retransmission), IP Forwarding and firewall. Along with 6WINDGate’s high-performance routing capabilities, these enhancements allow HFT Networking Equipment manufacturers to provide solutions without difficult-to-maintain, custom hardware technologies based on FPGAs or ASICs.

On GE’s WANic 56512 IP packet processor board, configured with a 750MHz Cavium OCTEON … Read More → "6WIND Announces Low-Latency Packet Processing Software for High-Frequency Trading Equipment"

Renesas Electronics and Renesas Mobile to License Imagination Technologies’ PowerVR Series6 Graphics Technologies

November 14, 2011

LONDON, UK and TOKYO, Japan, November 14, 2011–Imagination Technologies Group plc (LSE: IMG; “Imagination”), a leader in System-on-Chip Intellectual Property (“SoC IP”), Renesas Electronics Corporation (TSE: 6723; “Renesas”), a premier provider of advanced semiconductor solutions, and Renesas Mobile Corporation (“Renesas Mobile”), a wholly owned subsidiary of Renesas Electronics and an innovative supplier of advanced cellular semiconductor solutions and platforms, today announced that Imagination and Renesas Electronics signed a multiuse license agreement for IP from Imagination’s PowerVR Series6 ‘Rogue’ graphics family.

Renesas Mobile will initially deploy Imagination’s technologies in its … Read More → "Renesas Electronics and Renesas Mobile to License Imagination Technologies’ PowerVR Series6 Graphics Technologies"

Lamachan2 Extreme I/O Solution

November 14, 2011

Using a Xilinx™ Spartan™-6 FPGA to support a high performance PCI Express interface and large I/O count Lamachan2 offers an extreme I/O solution for High Performance Computing (HPC) systems. It is also capable of forming the basis of a low cost processing accelerator or even a combined I/O / accelerator processing solution.

Lamachan2 supports I/O solutions up to and including 266 I/O. Plugging in standard DIL modules, available directly from Enterpoint, allows the rapid construction of a wide range of I/O, communications, and … Read More → "Lamachan2 Extreme I/O Solution"

High-Voltage and Lowest Noise, Autozero Op Amp Extends System Uptime and Improves Sensor Performance

November 14, 2011

SUNNYVALE, CA—November 14, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX44251 a 20V, ultra-precise, low-noise dual op amp that extends maintenance system uptime and maximizes sensor performance. Proprietary autozero technology enables continuous self-calibration which, in turn, ensures system accuracy over time, temperature, and power-supply variations. The precision (< 6µV initial offset) over the wide 2.7V to 20V operating range is unmatched by the competition. This excellent precision improves system accuracy and minimizes errors during signal conditioning. The accuracy over the extended voltage range also makes the op amp more flexible for … Read More → "High-Voltage and Lowest Noise, Autozero Op Amp Extends System Uptime and Improves Sensor Performance"

Cadence Wins TSMC EDA Partner Award for 3D-IC Technology

November 14, 2011

SAN JOSE, CA–(Marketwire – November 14, 2011) – Cadence was cited for helping implement an interposer test vehicle using Cadence standard 3D-IC solutions that employed through-silicon vias (TSV). The project involved a system-on-chip (SoC) and eDRAM integrated on a silicon interposer.Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has recognized Cadence with a TSMC EDA Partner Award for its 3D-IC technology. The award underscores the R&D investment from Cadence for this emerging technology, which … Read More → "Cadence Wins TSMC EDA Partner Award for 3D-IC Technology"

Dual Output Synchronous Step-Down Controller Produces 1.5VOUT From Up To 24VIN at 2MHz

November 14, 2011

MILPITAS, CA – November 14, 2011 – Linear Technology Corporation introduces the LTC3838, a high frequency controlled on-time dual output synchronous step-down DC/DC controller with differential output voltage sensing and clock synchronization. The controlled on-time, valley current-mode architecture enables a very fast transient response by increasing its operating frequency during a transient event, enabling the LTC3838 to recover from a large load … Read More → "Dual Output Synchronous Step-Down Controller Produces 1.5VOUT From Up To 24VIN at 2MHz"

eSilicon uses Magma to Tape Out 28-nm 1.5GHz Microprocessor Cluster for Embedded Platforms

November 11, 2011

SAN JOSE, Calif., Nov. 10, 2011 – Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), used Magma software to tape out a three-way microprocessor cluster based on MIPS’ leading-edge MIPS32® 1074Kf™ Coherent Processing System (CPS). Typical performance of the cluster is expected to be approximately 1.5GHz with worst-case performance of 1GHz. By leveraging Magma’s Talus® IC implementation platform and the Talus-Flow-Manager-Based Reference Flow for GLOBALFOUNDRIES’ 28nm-SLP process technology, eSilicon was able to achieve an impressive performance … Read More → "eSilicon uses Magma to Tape Out 28-nm 1.5GHz Microprocessor Cluster for Embedded Platforms"

Adapteva Uses Magma’s RTL-to-GDSII Flow to Tape Out a 28-nm 64-Core Microprocessor Chip

November 11, 2011

SAN JOSE, Calif., Nov. 10, 2011 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that Adapteva used Magma software to tape out the Epiphany-IV 64-core microprocessor array IC targeted to GLOBALFOUNDRIES’ 28-nm SLP process. By leveraging Magma’s Talus®, Hydra™ and Titan™ leveraging Magma’s Talus®, Hydra™ and Titan™ digital and analog IC design solutions and the Quartz™ DRC/LVS physical verification tool with newly qualified runsets for the 28-nm SLP process, Adapteva was able to deliver the highest energy efficiency of … Read More → "Adapteva Uses Magma’s RTL-to-GDSII Flow to Tape Out a 28-nm 64-Core Microprocessor Chip"

VIA Releases VIA VE-900 Mini-ITX Mainboard for Digital Home Media Enthusiasts

November 11, 2011

Taipei, Taiwan, November 11, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VE-900 Mini-ITX Mainboard, immediatelyavailable worldwide at incredibly competitive pricing. The VIA VE-900 Mini-ITX provides the ideal platform for DIY enthusiasts to custom build stylish home desktop and media center PCs.

Featuring a high-performance 1.4GHz VIA Nano™ X2 dual core processor and the VIA VX900 unified all-in-one media system processor, the VIA VE-900 Mini-ITX Mainboard delivers a highly optimized platform that boasts stunning HD video performance of the most … Read More → "VIA Releases VIA VE-900 Mini-ITX Mainboard for Digital Home Media Enthusiasts"

Cambridge Wireless creates a focal point for wireless companies at NEW:UK 2012

November 11, 2011

November 11th 2011 – Cambridge Wireless has joined forces with National Electronics Week (NEW) in order to promote wireless technology at the NEC Birmingham 18-19 April 2012.

Cambridge Wireless, a vibrant membership organisation with over 300 members, is working with the event organisers of NEW to create a wireless showcase at the 2012 show. The aim is to collaborate with companies from across the sector to establish a focal point for visitors interested in wireless technology.</ … Read More → "Cambridge Wireless creates a focal point for wireless companies at NEW:UK 2012"

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