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SpringSoft Targets Chip Finishing Applications With New Laker Blitz

HSINCHU, Taiwan, November 29, 2011 – SpringSoft, Inc., a global supplier of specialized IC design software, today announced immediate availability of the Laker Blitz chip-level layout editor, a new software product targeting chip finishing applications and the latest addition to its popular family of Laker custom IC design and layout automation solutions. The Laker Blitz product enables high-speed viewing and editing of chip-level layouts to streamline tapeout-to-manufacturing operations. It is ideally suited for designs with massive data sets, such as advanced-node system-on-chip (SoC) implementations and large memory chips that are widely used in consumer& … Read More → "SpringSoft Targets Chip Finishing Applications With New Laker Blitz"

Movea’s GestureBuilder advances State of the Art for Gesture Control in Consumer Electronics

Grenoble, France – November 30, 2011 – Movea, the leader in motion sensing and motion-enabled control technologies, announced today that it is making State of the Art gesture recognition and gesture database design capabilities available to Consumer Electronic OEMs and Systems Integrators though its ground breaking GestureBuilder software.  Part of Movea’s SmartMotion® portfolio and a component of the MoveTV platform, GestureBuilder enables Touchless Gestures™ for control of Smartphones, Tablets, TV’s, Set-Top-Boxes, and Media Center PC’s running Linux, Android, and Windows 7.  Windows 8 support is also planned.

Read More → "Movea’s GestureBuilder advances State of the Art for Gesture Control in Consumer Electronics"

Interdigitated back-contact silicon solar cells above 23% efficiency

Leuven, Belgium – December 1, 2011 – Imec together with its silicon photovoltaic industrial affiliation program partners Schott Solar, Total, Photovoltech, GDF-SUEZ, Solland Solar, Kaneka and Dow Corning, have demonstrated an excellent conversion efficiency of 23.3% on interdigitated back-contact (IBC) silicon solar cells. 

Interdigitated back contacts are introduced to increase the conversion efficiency of crystalline silicon solar cells and allow for further reduction of the cell thickness, simplification of module fabrication and improved aesthetics of the final solar cell modules. Imec has developed a high-efficiency baseline process for small-area IBC cells within its multi-partner silicon solar cells … Read More → "Interdigitated back-contact silicon solar cells above 23% efficiency"

Analog Bits Announces 28nm IP Availability

Mountain View, Calif., November 29, 2011 – Analog Bits, the Integrated Clocking and Interface IP leader, today announced availability of its major product lines on 28nm process technologies.

The company revealed for the first time that it has long had working silicon at the 32nm process nodes, and has delivered numerous 28nm IP based on a high performance (HP) and low power (LP) processes. It is now actively porting production-proven IP to multiple 28nm nodes, including the new 28nm HPM process. 

The Analog Bits 28nm product lines include PLL, DLL, … Read More → "Analog Bits Announces 28nm IP Availability"

Laird Technologies Releases New High Power LT1110 900 MHz Wireless Module

St. Louis, Missouri, USA – November 30, 2011 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new High Power LT1110 900 MHz wireless module.

The new High Power LT1110 900 MHz wireless module sets yet another standard for industrial RF communication. Based on proprietary FlexRF™ technology, this module offers more than forty times the output power of the current low power LT1110. Embedded with Laird Technologies’ robust server-client protocol, the LT1110 family permits an unlimited number of … Read More → "Laird Technologies Releases New High Power LT1110 900 MHz Wireless Module"

Magma Acquisition by Synopsys to Provide Customers with State-of-the-Art Mixed-Signal, Digital and Analog Design Solutions that Enable More Profitable Silicon

SAN JOSE, Calif., Nov. 30, 2011 – Magma Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, today announced the company has entered into a definitive agreement to be acquired by Synopsys (Nasdaq:SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems headquartered in Mountain View, Calif. The combination of the two companies’ technologies, development capabilities, support teams and sales channels will provide chip designers with greater access to state-of-the art electronic design automation (EDA) solutions … Read More → "Magma Acquisition by Synopsys to Provide Customers with State-of-the-Art Mixed-Signal, Digital and Analog Design Solutions that Enable More Profitable Silicon"

Kistler Introduces DynoWare USB-Based Data Acquisition and Analysis Software for Stationary and Rotary Force Measurement Systems

November 30, 2011, Novi, Michigan, USA – Kistler (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced the USB-based Type 2825A DynoWare universal data acquisition and analysis software, designed for direct compatibility with Kistler stationary and rotary measuring systems, including single- and multi-component dynamometers and other force sensors.

The simple operation of Kistler Type 2825A DynoWare allows for full configuration and control of up to 28 force measurement channels via USB, RS-232C or IEEE-488. For … Read More → "Kistler Introduces DynoWare USB-Based Data Acquisition and Analysis Software for Stationary and Rotary Force Measurement Systems"

Synopsys to Acquire Magma Design Automation

MOUNTAIN VIEW, Calif., Nov. 30, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq:SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, has signed a definitive agreement to acquire Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software headquartered in San Jose, California. Bringing together complementary technology, development and support capabilities will enable the combined company to more rapidly meet customer requirements linked to chip designs at both leading-edge and mature process nodes. 

Under the terms of the merger agreement, Synopsys will acquire Magma for $7.35 per … Read More → "Synopsys to Acquire Magma Design Automation"

Quad-Channel DDR3 RDIMMs at 1600MHz from Super Talent

San Jose, California – November 28, 2011 – Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announces a new line of high speed, quad-channel Registered DDR3 RDIMM modules for servers running at 1600MHz.

Super Talent is committed to bringing our customers the very the latest in technology. Today’s new motherboards that support the new 16 core processors, now require a new type of RDIMMs, quad-channel DDR3. Super Talent is pleased to announce that theses new modules have passed extensive qualification testing and can support full speed at full … Read More → "Quad-Channel DDR3 RDIMMs at 1600MHz from Super Talent"

Cavium’s OCTEON(R) II Achieves World’s Highest CoreMark Benchmark Score for an Integrated Communications Processor

Cavium, Inc. (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications, and the digital home, today announced that its flagship 32 Core OCTEON® II MIPS64 CN6880 processor had achieved a score of over 150,000 on the industry standard Embedded Microprocessor Benchmark Consortium (EEMBC) benchmark in a single chip. This new world leading CoreMark Score of 153,477 is unmatched by any other general purpose communication processor chip with an integrated high performance I/O subsystem capable of delivering over 40Gbps feature-rich, … Read More → "Cavium’s OCTEON(R) II Achieves World’s Highest CoreMark Benchmark Score for an Integrated Communications Processor"

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