News – Page 2096 – EEJournal

Tektronix Expands, Enhances Bench Oscilloscope Family

February 27, 2012

BEAVERTON, Ore., February 28, 2012 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes,today announced a series of new models, options and enhancements to its popular MSO/DPO4000B andMSO/DPO3000 mixed signal oscilloscope series, helping to address a broader range of embedded system test and debug needs at more aggressive price points.

With the new models and enhancements to its bench oscilloscope family, … Read More → "Tektronix Expands, Enhances Bench Oscilloscope Family"

Atmel’s maXTouch Controllers Enable Touch Capabilities for In-Car Control Systems

February 27, 2012

San Jose, CA, February, 27, 2012 – Atmel^® Corporation (NASDAQ: ATML), a leader in microcontroller and touch technology solutions, today announced the availability of its maXTouch^® family for 5″ to 10″ automotive touchscreens and touchpads used in center stack displays, navigation systems, radio human-machine interfaces (HMIs) and rear-seat entertainment systems. With these new automotive-qualified maXTouch devices, Atmel strengthens its position as a market-leading touch supplier and extends its range of supported maXTouch applications from consumer and industrial into automotive.

The new automotive-qualified devices include the maXTouch mXT768E and the maXTouch … Read More → "Atmel’s maXTouch Controllers Enable Touch Capabilities for In-Car Control Systems"

First 28nm ARM Cortex-A9 Processor Optimization Pack now Available for GLOBALFOUNDRIES 28nm-SLP HKMG Process

February 24, 2012

Cambridge, UK – 23^rd February 2012 – ARM today announced the availability of the ARM® Cortex™-A9 MPCore™ Processor Optimization Pack (POP) for GLOBALFOUNDRIES’ 28nm-SLP High-K Metal Gate process technology. Optimized for mobile, networking and enterprise applications, the energy-efficient ARM POP 28nm-SLP for Cortex-A9 processors delivers a performance range from 1GHz to 1.6GHz for worst case conditions, with up to 2GHz in typical conditions. This provides a wide range of flexibility for System-on-Chip (SoC) designers to optimize performance and energy-efficiency using the ARM Artisan® Physical IP Platform and Cortex-A9 POP.

“As consumer demand for high-performance, energy-efficient mobile devices … Read More → "First 28nm ARM Cortex-A9 Processor Optimization Pack now Available for GLOBALFOUNDRIES 28nm-SLP HKMG Process"

European project reaches milestone bidirectional communication for thin-film RFIDs, enabling item-level RFID tags

February 24, 2012

San Francisco, Calif., – February 22, 2012 – Imec, Holst Centre and their partners in the EU FP7 project ORICLA have fabricated the world’s first RFID (radio frequency identification) circuit made in low-temperature thin-film technology that allows reader-talks-first communication. The technology behind this prototype is indispensable to create RFID tags that are cheap enough and have enough performance to be used as intelligent item-level tags on the packaging of retail consumer goods. Such tags can be used to provide buyers with information on e.g. price, characteristics, or freshness, or to allow vendors to implement automated billing and … Read More → "European project reaches milestone bidirectional communication for thin-film RFIDs, enabling item-level RFID tags"

6WIND and BroadWeb Announce Integrated Software Solution for Intrusion Prevention Systems

February 24, 2012

PARIS, France and HSINCHU, Taiwan, February 24, 2012 — 6WIND, the gold standard for software-defined networks and BroadWeb, a market leader in network content security technology, today announced a partnership to provide pre-integrated software solutions for Intrusion Prevention Systems (IPS), accelerating OEMs’ time-to-market while delivering industry-leading performance. 6WIND and BroadWeb will feature these solutions at the RSA Conference in San Francisco from February 27th through March 2nd (6WIND: booth 242, BroadWeb: booth 2133).

The proliferation of network applications such as gaming and peer-to-peer file sharing has created business-critical challenges for network administrators and service providers. Networks must be constantly … Read More → "6WIND and BroadWeb Announce Integrated Software Solution for Intrusion Prevention Systems"

High-end hybrid-cooled embedded system, also for environments subject to dust

February 24, 2012

Munich, February 2012 – DSM Computer presents at the embedded world in Hall 1, Booth 254, the first member of its new ARCTIS™ IPC family the A1-QM67 which, despite its extremely high computing and graphic power, is designed for operation in dusty environments. This is achieved with an innovative hybrid cooling concept that avoids the need for air exchange from the exterior to the interior of the device.

To ensure the optimum cooling of the system, two heat pipes conduct the heat generated by the CPU with integrated graphic directly to two large heat sinks … Read More → "High-end hybrid-cooled embedded system, also for environments subject to dust"

VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

February 24, 2012

Taipei, Taiwan–February 24, 2012 -VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announcedthe latest VIA COMe-8X90 module, featuring a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate … Read More → "VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90"

Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers

February 24, 2012

Leuven, Belgium and Tokyo, Japan, February 22, 2012 – At this week’s International Solid-State Circuit Conference (ISSCC2012), imec and Renesas Electronics Corporation (TSE: 6723) report an innovative SAR (successive-approximation register) ADC (analog to digital converter) with a spectacular improvement in power efficiency and speed, targeting wireless receivers for next-generation high-bandwidth standards such as LTE-advanced and the emerging generation of Wi-Fi (IEEE802.11ac).

SAR ADCs provide high power efficiencies as well as a small form factor, making this architecture attractive for a wide variety of wireless applications. SAR ADCs are frequently the preferred architecture for applications … Read More → "Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers"

Synopsys Completes Acquisition of Magma Design Automation

February 23, 2012

MOUNTAIN VIEW, Calif., Feb. 22, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, has completed its acquisition of Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software headquartered in San Jose, California. The combination of Synopsys and Magma will enable the company to more rapidly meet the needs of leading-edge semiconductor designers for ever more sophisticated design tools.

The value of the transaction is approximately $523 million net of cash acquired, or $7.35 per Magma share in cash, which … Read More → "Synopsys Completes Acquisition of Magma Design Automation"

TI establishes new benchmark for evaluating high-speed data converters with industry’s highest-performance, lowest-cost evaluation boards

February 23, 2012

DALLAS (Feb. 23, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s highest-performance and lowest-cost evaluation boards for evaluating high-speed data converters. The TSW1400EVM data capture and pattern generation board evaluates up to 16-bit analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). It costs 75-percent less than the previous generation, while providing twice the memory. Additionally, the TSW1405EVM for pattern capture and the TSW1406EVM for pattern generation are the lowest-cost solutions of their kind by up to 80 percent, providing simple and ultra-low cost platforms for quick evaluation of TI data converters. For … Read More → "TI establishes new benchmark for evaluating high-speed data converters with industry’s highest-performance, lowest-cost evaluation boards"

featured blogs

Human Artifacts Discovered on Mars!

Apr 24, 2026

A thought experiment in curiosity, confusion, and cosmic consequences....