News – Page 2095 – EEJournal

EMA Automates the Creation and Setup of OrCAD Capture CIS Component Databases

February 1, 2012

Rochester, NY (February 1, 2012) – EMA Design Automation™ (www.ema-eda.com), a full-service provider of mechanical and electrical CAD tools, today announced the release of the CIS QuickStart app, giving OrCAD Capture CIS customers a way to realize the full power of their software investment with an automated way to implement a component database.
“A centralized component information system has numerous proven advantages; however, the time, effort, and expertise required to setup these … Read More → "EMA Automates the Creation and Setup of OrCAD Capture CIS Component Databases"

Libelium announces e-Learning Platform for ZigBee sensor networks

February 1, 2012

Zaragoza, Spain – February 1st, 2012 – Libelium, a technology leader in wireless sensor solutions for Smart Cities, announces its e-Learning platform. The new training and support capability provides a highly interactive service for system integrators who need to develop and deploy wireless sensor networks in a short timeframe. The platform enables Libelium to efficiently deliver training and support services to their growing worldwide customer base.

With wireless sensor network integrators facing intense time to market pressure, it is important that the adoption of latest … Read More → "Libelium announces e-Learning Platform for ZigBee sensor networks"

Cortus and SST to Jointly Exhibit Low Power IP Solutions for System on Chip (SoC) Design at Embedded World 2012

February 1, 2012

Montpellier, France and Sunnyvale, California, 31st January 2012. Cortus S.A., and Silicon Storage Technology (SST), Inc. will be showing their low power IP products for embedded system on chip (SoC) designs at Embedded World 2012 in Nuremberg, Germany. The exhibit will combine Cortus’ silicon efficient, ultra low power 32 bit microcontroller cores with SST’s low power, ultra high endurance embedded flash non-volatile memory (NVM) technology.

Today’s embedded SoC applications such as SIM cards, Near Field Communications (NFC), Bluetooth LE, automotive sensors and smart meters all … Read More → "Cortus and SST to Jointly Exhibit Low Power IP Solutions for System on Chip (SoC) Design at Embedded World 2012"

Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones

February 1, 2012

Dublin, Ireland and Duesseldorf, Germany, 1 February 2012 – Movidius, the mobile multimedia processor company, today announced it has partnered with Toshiba Electronics Europe to develop a complete 3D system solution for the smartphone market.

Movidius’ MA1178 has been combined with Toshiba’s 8 Megapixel EDOF (extended depth of field) cameras to enable 3D camera module manufacturers to deliver a compelling 3D imaging solution, ideally suited to top of the range smartphones. EDOF cameras offer distinct advantages over traditional autofocus in terms of 3D synchronisation.

The Movidius MA1178 Dual ISP and video processor chip … Read More → "Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones"

Maxim’s Hi-Speed USB Protectors Deliver Automotive-Grade Protection for Mobile Connectivity

February 1, 2012

Sunnyvale, CA–February 1, 2012–Maxim Integrated Products Inc. (NASDAQ: MXIM) introduces the MAX16919/MAX16969, Hi-Speed USB 2.0 automotive-grade protectors with iPod®/iPhone® fast-charge detection and USB host-charger detection for all USB gadgets. The protectors’ fast-charge detection supports both Hi-Speed USB (480Mbps) and full-speed USB (12Mbps) operation, which conveniently lets consumers recharge their USB devices while driving. Additionally, the … Read More → "Maxim’s Hi-Speed USB Protectors Deliver Automotive-Grade Protection for Mobile Connectivity"

Express Logic Brings High Performance to Cortex-M4 with ThreadX® RTOS and NetX Duo™ TCP/IP Stack

February 1, 2012

San Diego, CA, February 1, 2012 – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that it has ported its popular ThreadX RTOSand NetX TCP/IP stack to support a wide range of processors based … Read More → "Express Logic Brings High Performance to Cortex-M4 with ThreadX® RTOS and NetX Duo™ TCP/IP Stack"

Ericsson Power Modules Takes Significant Step Forward with New Digital-Power Technology to Reduce Power Consumption

January 31, 2012

FRIDA II DC/DC platform will enable to reduce power consumption, CO2 emissions and cost of ownership
Second DC/DC digital-power platform for ICT and AdvancedTCA applications designed for fast response time
FRIDA II platform integrates new hardware and firmware, in conjunction with ultra-fast algorithms, to deliver tightly regulated voltage output and high reliability

Ericsson has unveiled its second digital-power Advanced Bus Converter platform for use with board-mounted DC/DC power modules in telecom and datacom applications. The company’s new FRIDA II platform integrates an unprecedented number of … Read More → "Ericsson Power Modules Takes Significant Step Forward with New Digital-Power Technology to Reduce Power Consumption"

LDRA Tool Suite Directly Integrates with Altera’s Nios® II Embedded Design Suite

January 31, 2012

Monks Ferry, Wirral, UK – January 31, 2012. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, has extended the LDRA tool suite to support direct integration with Altera’s Embedded Design Suite (EDS) for Read More → "LDRA Tool Suite Directly Integrates with Altera’s Nios® II Embedded Design Suite"

congatec presents COM Express Type 6 module with low-power Intel® processors

January 31, 2012

Deggendorf, Germany, 31 January 2012 * * * congatec AG, a leading manufacturer of embedded computer modules, announces the conga-TS67, a new low-power module for advanced designs. It supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, super low-power Intel® processors soldered on in a BGA package, the module is suitable for vibration-resistant applications.

The module is available in four second generation low-power Intel® Core™ processor versions, from the Intel® Celeron® 807UE processor (1M Cache, 1.0 GHz) with just 10 Watt TDP … Read More → "congatec presents COM Express Type 6 module with low-power Intel® processors"

Texas Instruments unveils world’s smallest half duplex (HDX) RFID mini-transponders for animal and asset tracking

January 31, 2012

Dallas, TX (January 31, 2012) – Raising the standard in half duplex (HDX) transponder technology, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the world’s smallest half-duplex radio frequency identification (RFID) mini-transponders that enable customers to embed tags into smaller objects across a broader range of applications. The 12mm TRPGR30TGC andTRPGP40TGC glass encapsulated mini-transponders are ready-to-use and 100 percent backwards compatible with … Read More → "Texas Instruments unveils world’s smallest half duplex (HDX) RFID mini-transponders for animal and asset tracking"