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DSM presents a high-performance rail-mounted PC: power for the electrical-equipment cabinet

February 6, 2012

Munich, January 2012 – DSM Computer has extended its compact H1-A rail-mounted PC family with a higher performance variant that incorporates an energy-saving Intel® Atom™ processor Z530 (1.6 GHz). The standardized installation capabilities allow the computer that is 90 mm high and only 41 mm (55 mm with cooling fins) deep to be installed very quickly in electrical-equipment or switchgear cabinets. With a width of 122 mm (7 U), the IPC – in a robust, high-quality aluminum housing – can be installed under the rail-mounting standard cover. 

In addition to the processor, the Qseven™ module of MSC … Read More → "DSM presents a high-performance rail-mounted PC: power for the electrical-equipment cabinet"

Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design

February 6, 2012

SAN JOSE, CA — (Marketwire – February 06, 2012) – The unique Cadence in-design approach to Silicon Realization moves traditional DFM steps into the implementation stage of digital and custom chip design. This approach is aimed at boosting productivity, predictability and profitability while reducing risk. The DFM flows developed at Samsung Foundry leverage multiple groundbreaking technologies, including Cadence Pattern Classification and Search, Cadence CMP Predictor, Cadence Litho Physical Analyzer and Cadence Yield Analyzer and Optimizer. … Read More → "Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design"

CMX7861 ‘FirmCODEC’ – Full Featured Analogue Front End For DSP/FPGA/Microcontroller Based Systems

February 3, 2012

The CMX7861 ‘FirmCODEC’ is a full featured analogue front end for DSP/FPGA/Microcontroller based systems. The device is a combination of codec, embedded signal processing and auxiliary system support functions, allowing simple interfacing between analogue and digital systems that together improve overall system performance, reduce development time and overall system cost.

Modern-day electronic systems, notably communication, control and monitoring are increasingly migrating to digital operations, an area dominated by DSP/FPGA/Microcontroller signal processing. However, the real world is essentially analogue, making analogue to digital and digital to analogue … Read More → "CMX7861 ‘FirmCODEC’ – Full Featured Analogue Front End For DSP/FPGA/Microcontroller Based Systems"

Mercury Computer Systems to Deliver Integrated ATCA®-based Signal Processing Subsystem to Support Satellite Telecommunications System

February 3, 2012

CHELMSFORD, Mass. – February 2, 2012 – Mercury Computer Systems, Inc. (NASDAQ: MRCY, www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, confirmed that it had been previously awarded a contract from a leading telecommunications provider to deliver an integrated signal processing subsystem based on the ATCA® standard. The high performance subsystem, a ground-based gateway, will enable vital terrestrial-satellite communications for a next-generation mobile satellite system to be used for national security, civilian and humanitarian efforts.</ … Read More → "Mercury Computer Systems to Deliver Integrated ATCA®-based Signal Processing Subsystem to Support Satellite Telecommunications System"

X-FAB Uses Silicon Frontline’s Post-Layout Extraction Software to Enhance its Advanced Mixed-Signal Process Design Kit (PDK)

February 3, 2012

Campbell, Calif.– February 2, 2012 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that X-FAB Silicon Foundries has used SFT’s R3D (Resistive 3D) software for X-FAB’s 0.18 micrometer high-voltage process (XH018), providing improvements in reliability and efficiency. X-FAB is the world’s leading foundry group for More-than-Moore semiconductor applications.Read More → "X-FAB Uses Silicon Frontline’s Post-Layout Extraction Software to Enhance its Advanced Mixed-Signal Process Design Kit (PDK)"

CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems

February 2, 2012

MOUNTAIN VIEW, Calif., February 01, 2012 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture. The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance. This level of performance facilitates the design of software-based modems and associated application software, for multiple … Read More → "CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems"

Teseq Holding AG Acquires MILMEGA to Expand RF Power Amplifier Capabilities

February 2, 2012

Zug, Switzerland, February 2012 – Teseq Holding AG , a leading developer and provider of instrumentation and systems for EMC emission and immunity testing, has acquired UK-based MILMEGA, Ltd., a leading specialist in the design and manufacture of solid state, high-power microwave and RF amplifiers.  The acquisition strengthens Teseq capabilities in commercial, industrial, automotive, military and communications applications, further positioning the company as a global leader in immunity testing. 

Johannes Schmid, President of Teseq, said, & … Read More → "Teseq Holding AG Acquires MILMEGA to Expand RF Power Amplifier Capabilities"

Vector Fabrics joins forces with consortium led by Thales to ease parallel software development and increase battery life

February 2, 2012

Eindhoven, The Netherlands, January 31st, 2012  — Vector Fabrics today announced it is joining forces with Thales to alleviate the issues involved in developing software for today’s increasingly parallel architectures, while reducing power consumption. Over the last few years, electronic devices have greatly expanded their functionality. Rich graphical user interfaces, high-speed internet access, high-quality photo and video cameras and 3D gaming are all integrated into one device that easily fits in the palm of your hands. However, the underlying parallel hardware architectures that enable this functionality have introduced two new complications that will be addressed in this … Read More → "Vector Fabrics joins forces with consortium led by Thales to ease parallel software development and increase battery life"

SiSoft and IBM Present Paper on Advanced IBIS-AMI Modeling Techniques

February 2, 2012

Santa Clara, CA – February 2, 2012 – Signal Integrity Software, Inc. (SiSoft™) will present a paper with IBM at the IBIS Summit meeting today.  The paper is entitled “IBM IBIS-AMI 15G Chip to Chip Cu032 model using Dependency Tables” and discusses extensions to the IBIS-AMI specification that reduce the size and complexity of IBIS-AMI models to simplify the system designer’s task of running design simulations.  In one of the examples presented, dependency tables reduce the number of different models needed from 192 down to 1 … Read More → "SiSoft and IBM Present Paper on Advanced IBIS-AMI Modeling Techniques"

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