News – Page 2090 – EEJournal

Agilent Technologies Enhances Software for Interactive Functional Test Automation, Expands Network Operators’ Compliance Test Plans

March 1, 2012

SANTA CLARA, Calif., Feb. 27, 2012 – Agilent Technologies Inc. (NYSE: A) today enhanced its portfolio of products for testing 2G, 3G and LTE devices with the introduction of N5972A Interactive Functional Test software. The company also made available new IFT automation scripts based on network operator compliance test plans, including inter-RAT handover, simultaneous voice and data, data throughput and battery drain.

These solutions enable developers and operators to quickly and repeatedly generate measurement reports in accordance with operators’ compliance test plans.

Smartphones and data cards are complex devices with multiple radios … Read More → "Agilent Technologies Enhances Software for Interactive Functional Test Automation, Expands Network Operators’ Compliance Test Plans"

congatec presents first quad-core ARM module on Qseven form factor

March 1, 2012

San Diego, California *** February 28, 2012 *** congatec Inc, a leading manufacturer of embedded computer modules, unveils a new ARM module generation with the introduction of the conga-QMX6 Qseven module. The Qseven standard Revision 1.2, which was published back in September 2010, already prepared the ground for the early optimization of Qseven for dedicated ARM support by adding the I/O interfaces UART and CAN.

The conga-QMX6 Computer-On-Module (COM) is equipped with the Freescale i.MX6 ARM Cortex A9 processor family which is scalable from 1 to 4 ARM cores and sports a sophisticated high-end, 3D-ready HD graphics interface. The Qseven module … Read More → "congatec presents first quad-core ARM module on Qseven form factor"

Xilinx Releases First 28nm FPGAs to Production

March 1, 2012

SAN JOSE, Calif., March 1, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it has reached another industry milestone with its limited production release of the industry’s first 28nm FPGAs. Having shipped thousands of sample units of its latest 7 series families, the release of the lead Kintex™-7 FPGA into production is the latest step in executing the industry’s fastest PLD rollout in history. This achievement enables Xilinx& … Read More → "Xilinx Releases First 28nm FPGAs to Production"

Kilopass First to Demonstrate Antifuse Reliability Data in 28nm HKMG

March 1, 2012

Santa Clara, Calif. – February 29, 2012 – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that it is the first non-volatile memory (NVM) IP provider to demonstrate antifuse reliability in 28nm High-K Metal Gate (HKMG). Kilopass has successfully completed 500 hours of High Temperature Operating Life (HTOL) and 500 hours of High Temperature Storage life (HTSL) per JEDEC 47 standard qualification with no failures. The remaining 500 hours will be completed by end of March 2012.

“We are extremely pleased with the reliability results on 2T antifuse silicon … Read More → "Kilopass First to Demonstrate Antifuse Reliability Data in 28nm HKMG"

Docea Power Unveils Thermal Modeling Solution for Early Architecture Exploration and Optimization, First Demonstrations at DATE 2012

March 1, 2012

Grenoble, France and San Jose, CA – February 29 , 2012 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced the release of its AceThermalModeler™ (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.

Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power … Read More → "Docea Power Unveils Thermal Modeling Solution for Early Architecture Exploration and Optimization, First Demonstrations at DATE 2012"

FTDI Introduces X-Chip Series of Next Generation USB Interface ICs

March 1, 2012

February 29th 2012 – USB solutions specialist Future Technology Devices International Limited (FTDI) has supplemented its portfolio of USB to serial interface products with the release of its new X-Chip series. Made up of devices in 13 different package options, X-Chip complements the company’s existing FT-R and FT-H offerings. The series supports a broad selection of interface types, such as basic UART, full UART, FIFO and I2C, as well as FTDI’s proprietary FT1248 I/O (including provision for enhanced SPI).

Through X-Chip, engineers are … Read More → "FTDI Introduces X-Chip Series of Next Generation USB Interface ICs"

Samsung DFM Ready for 20 nm Based on Mentor Graphics Calibre Platform

March 1, 2012

WILSONVILLE, Ore., March 1, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced that Samsung Electronics and Mentor® have successfully delivered a complete design-for-manufacturing (DFM) sign-off reference solution for Samsung’s foundry customers based on the Calibre® platform. The DFM sign-off solution is available for world class consumer and telecommunications designs targeting advanced process nodes. Samsung has already released the Calibre kits to their customers for 32 nm and 28 nm, and has completed evaluation for 20 nm.

“We have been working closely with Mentor to provide a comprehensive and consistent ecosystem for our customers,& … Read More → "Samsung DFM Ready for 20 nm Based on Mentor Graphics Calibre Platform"

ST-Ericsson announces new highly integrated LTE NovaThor platform

March 1, 2012

Barcelona, February 28, 2012 – ST-Ericsson, a world leader in wireless platforms and semiconductors, announced today the latest addition to its integrated smartphone and tablet platform portfolio. The NovaThor(TM) L8540 is an LTE/HSPA+/TD-HSPA-enabled integrated smartphone platform with the powerful application processor and modem integrated on a single die.

“By adding the new NovaThor L8540 platform to our portfolio of highly integrated smartphone and tablet solutions, the L8540 takes integration of LTE platforms to the next level,” said Marc Cetto, senior vice president of smartphone … Read More → "ST-Ericsson announces new highly integrated LTE NovaThor platform"

LDRA and MathWorks Tool Integration Moves Unit Testing Upstream to the Model

March 1, 2012

Embedded World, Nürnberg, Germany, March 1, 2012. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, and MathWorks, the leading developer of mathematical computing software, have extended the integration of the LDRA tool suite with … Read More → "LDRA and MathWorks Tool Integration Moves Unit Testing Upstream to the Model"

Telit Wireless Solutions Announces High-Performance GPS/GLONASS Module For Navigation Devices

March 1, 2012

Raleigh, NC – Feb. 29, 2012 – Telit Wireless Solutions (AIM: TCM), a global leader in machine-to-machine (M2M) wireless technology, today announced a new dual GPS/GLONASS module that dramatically improves navigation performance by providing access to both the Russian GLONASS global navigation satellite system and U.S. GPS.

Telit Location Solutions’ new Read More → "Telit Wireless Solutions Announces High-Performance GPS/GLONASS Module For Navigation Devices"