News – Page 2088 – EEJournal

Imec releases industry’s first 14nm process development kit

March 6, 2012

Leuven – March 6, 2012 – Imec today announces that it has released an early-version PDK (process development kit) for 14nm logic chips. This PDK is the industry’s first to address the 14nm technology node. It targets the introduction of a number of new key technologies, such as FinFET technology and EUV lithography. The PDK is made available to imec’s partners, and will be followed by incremental updates. Imec and its partners are developing a 14nm test chip to be released in the 2nd half of 2012 using this PDK.

With this PDK … Read More → "Imec releases industry’s first 14nm process development kit"

eSOL Expands eCROS Real-Time OS-Based Software Platform to Support x86 CPU Architecture

March 6, 2012

Tokyo, Japan. March 6, 2012 – eSOL, a leading developer of real-time embedded software solutions, announced today that its eCROS real-time OS-based software platform will now support the x86 CPU architecture. eCROS for x86 is scheduled to be released in the second quarter of 2012. By adopting eCROS for software development on x86 CPUs, including IntelR Atom? processors, developers will be able to incorporate the real-time capabilities and high reliability of the eT-Kernel real-time OS?the heart of eCROS. eT-Kernel also enables developers to reuse existing Linux software assets so that they can reduce costs and shorten development time. x86 processors and … Read More → "eSOL Expands eCROS Real-Time OS-Based Software Platform to Support x86 CPU Architecture"

Mouser Delivers Texas Instruments’ SimpleLink™ Wi-Fi CC3000 FRAM Evaluation Module Kit

March 6, 2012

March 6, 2012 – Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced that it is stocking the SimpleLink™ Wi-Fi Read More → "Mouser Delivers Texas Instruments’ SimpleLink™ Wi-Fi CC3000 FRAM Evaluation Module Kit"

Xilinx Announces Industry’s First Dual 100 Gbps Gearbox Solution for Interfacing CFP2 Optical Modules to Virtex-7 HT FPGAs

March 5, 2012

SAN JOSE, Calif., March 5, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced the industry’s first dual 100 Gbps Gearbox solution for connecting 100G interfaces with the newest generation of high-density, 100 Gbps CFP2 optical modules. Incorporating a single 28nm Virtex®-7 HT FPGA and Xilinx Gearbox intellectual property (IP) cores, the solution overcomes the initial hurdles of leveraging the new CFP2 optics supporting 100GE, OTU4 and 10x 10 MSA specifications. This allows higher density 100G line cards and transmission equipment while lowering overall system power … Read More → "Xilinx Announces Industry’s First Dual 100 Gbps Gearbox Solution for Interfacing CFP2 Optical Modules to Virtex-7 HT FPGAs"

Springsoft Delivers Breakthrough Productivity With Third Generation Chip Debug Platform

March 5, 2012

HSINCHU, Taiwan, March 5, 2012 — SpringSoft, Inc., a global supplier of specialized IC design software, today unveiled the third generation of its market-leading debug automation software. The new Verdi^3™ product is an open platform that introduces user personalization, customization, and enhanced interoperability to create a powerful debug cockpit, and is built on a next-generation software architecture for significant performance and capacity gains.

In order to keep pace with the increasing complexity and size of digital ICs, as well as the … Read More → "Springsoft Delivers Breakthrough Productivity With Third Generation Chip Debug Platform"

GainSpan Provides Low Power Wi-Fi Connectivity for Embedded Systems Based on Renesas MCUs

March 5, 2012

SAN JOSE, Calif., March 5, 2012 /PRNewswire/ — GainSpan^® Corporation today announced wireless connectivity solutions that make it quick and easy to add ultra-low power Wi-Fi to embedded systems that use any Renesas 8/16/32-bit microcontrollers. The solutions ease the design of new devices and upgrading of existing products, enabling fast development of connected devices to support the growing demand for Smartphone monitored and controlled devices, and “Internet of Things” applications.</ … Read More → "GainSpan Provides Low Power Wi-Fi Connectivity for Embedded Systems Based on Renesas MCUs"

Cadence Accelerates High-Performance, Giga-scale, 20nm Design with Next-generation Encounter RTL-to-GDSII Flow

March 5, 2012

SAN JOSE, Calif., March 5, 2012—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the latest release of Cadence® Encounter® RTL-to-GDSII flow for high-performance and giga-scale designs, including those at the latest technology node, 20 nanometers. Developed in close collaboration with leading IP and foundry partners and customers, the new RTL-to-GDSII design, implementation and signoff flow enables more efficient development of SoCs, meeting and exceeding the power, performance and area demands of today’s market requirements.

The new RTL-to-GDSII flow builds on Read More → "Cadence Accelerates High-Performance, Giga-scale, 20nm Design with Next-generation Encounter RTL-to-GDSII Flow"

Sigrity Awarded U.S. Patent for Unique Voltage-Management Optimization

March 5, 2012

CAMPBELL, Calif. – Mar. 5, 2012 – Sigrity, Inc., the market leader in signal and power integrity solutions, today announced it has been awarded U.S. Patent No. 8,080,897 for the company’s automated optimal sense location capability. The unique Sigrity technology pinpoints the best possible position to place a remote voltage regulator module (VRM) sense line on a printed circuit board or package. This single design optimization can increase the ability to meet target voltage thresholds and significantly improve overall voltage margin efficiency by 10-to-30 percent compared to seemingly … Read More → "Sigrity Awarded U.S. Patent for Unique Voltage-Management Optimization"

Fast JPEG Encoder Core from CAST Used in Fastec TS3 High-Speed Camera

March 5, 2012

Woodcliff Lake, NJ, March 6, 2012 — Fastec Imaging Corporation has incorporated a JPEG Encoder IP Core from CAST, Inc. in its groundbreaking TS3™ line of handheld, high-speed digital cameras.

Sourced from long-time CAST partner Alma Technologies SA, the JPEG-E Encoder Core is one of the fastest-available baseline JPEG compression cores. This enables extremely competitive functionality for Fastec’s TS3 high-speed digital cameras, including capture of 1280 x 1024 pixel … Read More → "Fast JPEG Encoder Core from CAST Used in Fastec TS3 High-Speed Camera"

congatec presents first quad-core ARM module on Qseven form factor

March 2, 2012

Nuremberg, Embedded World, 28 February 2012 * * * congatec AG, a leading manufacturer of embedded computer modules, unveils a new ARM module generation with the introduction of the conga-QMX6 Qseven module. The Qseven standard Revision 1.2, which was published back in September 2010, already prepared the ground for the early optimization of Qseven for dedicated ARM support by adding the I/O interfaces UART and CAN.

The conga-QMX6 Computer-On-Module (COM) is equipped with the Freescale i.MX6 ARM Cortex A9 processor family which is scalable from 1 to 4 ARM cores and sports a sophisticated high-end, 3D-ready HD graphics interface. The Qseven … Read More → "congatec presents first quad-core ARM module on Qseven form factor"