News – Page 2086 – EEJournal

WizYa and CommAgility reduce time to market with LTE eNodeB implementation

February 15, 2012

CommAgility announced today that WizYa Technologies has demonstrated a complete LTE eNodeB system for advanced wireless networks, running on its AMC-2C6670 and AMC-RF2x2 AdvancedMC modules. By integrating the proven system or its components into their LTE designs, wireless equipment manufacturers will be able to cut time to market … Read More → "WizYa and CommAgility reduce time to market with LTE eNodeB implementation"

Introducing TI’s WiLink™ 8.0 family: Five-in-one wireless connectivity solutions for next-generation mobile experiences

February 15, 2012

DALLAS (February 13, 2012) – Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes … Read More → "Introducing TI’s WiLink™ 8.0 family: Five-in-one wireless connectivity solutions for next-generation mobile experiences"

Altium and Atmel collaborate to deliver component content online

February 15, 2012

Karlsruhe, Germany – 15 February 2012 – Altium <http://www.live.altium.com/> , developer of next-generation electronics design software and services, announces that a new range of online component libraries for Atmel® devices, including its AVR® and ARM® microcontrollers, is now available through the AltiumLive <http://www.live.altium.com/> online content system. AltiumLive delivers board-level component models and corresponding supply chain information, such as real-time price and availability data from distributors and vendors including … Read More → "Altium and Atmel collaborate to deliver component content online"

Agilent Technologies Announces 42-Mbps DC-HSDPA IP Data Throughput Solution for the 8960 Wireless Test Set

February 15, 2012

SANTA CLARA, Calif., Feb. 14, 2012 –Agilent Technologies Inc. (NYSE: A) today announced the new E6703H W-CDMA/HSPA lab application that includes support for 42-Mbps DC-HSDPA test modes and IP data connections. The application uses the recently introduced high-performance E5515E 8960 Series 10 wireless communications test set.

Agilent’s DC-HSDPA solution will be demonstrated at Read More → "Agilent Technologies Announces 42-Mbps DC-HSDPA IP Data Throughput Solution for the 8960 Wireless Test Set"

Synopsys and Arteris Enable Earlier Multicore SoC Architecture Optimization with Faster Turnaround Times

February 15, 2012

MOUNTAIN VIEW, Calif., Feb. 15, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, and Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced a collaboration that enables models of Arteris’ FlexNoC® interconnect IP to be used with Synopsys’ Platform Architect™ environment, offering system designers the ability to simulate … Read More → "Synopsys and Arteris Enable Earlier Multicore SoC Architecture Optimization with Faster Turnaround Times"

Microsemi Participates in European Funded Program to Further Electrify Next-generation Aircraft

February 15, 2012

ALISO VIEJO, Calif.—Feb. 15, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its participation in a multi-disciplinary consortium funded by the European Union (Seventh Framework Programme, FP7) tasked with developing standardized Electro Mechanical Actuators (EMA) for aerospace applications to eliminate hydraulic circuits, pumps and reservoirs. This improves the overall actuator lifecycle cost including higher reliability, lower cost and reduced aircraft weight. The integrated project spans three years and comprises more than 50 partners representing the European stakeholders of the actuation and airframe industry from 12 countries.</ … Read More → "Microsemi Participates in European Funded Program to Further Electrify Next-generation Aircraft"

Saelig Debuts Unique Circuit Track Current Probe

February 15, 2012

Pittsford, NY, USA: Saelig Company, Inc. announces the Aim-TTi I-Prober 520, a unique, compact hand-held current probe for use with any oscilloscope, unlike any other current measurement device available. The current flowing in a pcb track can be observed and measured, allowing measurements by merely placing the insulated tip of the probe on to the track.

Calibrated measurement of current flow normally requires current to be passed through a closed magnetic loop using some form of split clamp device. While this is suitable for individual wires, it is of no use for measuring current in pcb … Read More → "Saelig Debuts Unique Circuit Track Current Probe"

Magma and MunEDA Significantly Boost Designer Productivity for Leading-Edge Analog and Digital Circuit Designs

February 15, 2012

SAN JOSE, Calif. and SUNNYVALE, Calif. – Feb. 15, 2012 – Magma® Design Automation Inc. (Nasdaq:LAVA) and MunEDA Inc. announced today the completion of a collaborative effort to integrate Magma’s FineSim™ SPICE simulator and MunEDA’s WiCkeD™ tools suite. The joint solution enhances and speeds the analysis, modeling and optimization of full-custom analog and digital circuit designs – especially in leading-edge 28-nanometer (nm) and 20-nm process technologies. Mutual customers now can invoke Magma’s FineSim SPICE from within MunEDA’s WiCkeD. The new solution, available now, is already in active … Read More → "Magma and MunEDA Significantly Boost Designer Productivity for Leading-Edge Analog and Digital Circuit Designs"

Lattice Features Latest Mobile FPGA Platforms At Mobile World Congress

February 15, 2012

HILLSBORO, OR – FEBRUARY 15, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will exhibit at Mobile World Congress, Feb 27^th – March 1^stat Fira de Barcelona in Barcelona, Spain. Lattice will be located in Hall 2.1, Stand 2.1A56, and will be featuring the company’s mobileFPGA™ platforms including the new iCE40™ and MachXO2™ FPGAs and ispMACH® 4000ZE CPLDs.

More than 20 mobile products, where Lattice mobileFPGA devices enabled product designers to rapidly add differentiating features to their products, will be displayed. The company will … Read More → "Lattice Features Latest Mobile FPGA Platforms At Mobile World Congress"

Tektronix Donates Electronics Test Equipment to Washington State University Vancouver

February 14, 2012

BEAVERTON, Ore., Feb. 10, 2012 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that it has made a substantial donation of test and measurement equipment to Washington State University Vancouver. The equipment, including arbitrary/function generations, a real-time spectrum analyzer, digital phosphor and mixed signal oscilloscopes, Keithley’s semiconductor parameter analyzers, and Fluke’s True-rms multimeters will be used to outfit laboratories and classrooms in a new $43.5 million Engineering and Computer Science building on WSU’s campus in Vancouver, Wash.

As part of the donation package, which included the purchase of … Read More → "Tektronix Donates Electronics Test Equipment to Washington State University Vancouver"