News – Page 2085 – EEJournal

ADLINK Builds PXI Express Family of Products with Industry-Leading Devices for High-Bandwidth Application

March 8, 2012

SAN JOSE, California – March 5, 2012 – ADLINK Technology, a leading global provider of trusted testing and measurement products, today announced a new family of high-performance PXI and PXI Express (PXIe) products for applications requiring fast data throughput, such as audio and image test.

The three new products include:

PXES-2590, the industry’s first all-hybrid, 9-slot PXIe chassis that provides up to 8 GB/s throughput
PXI-9527, a dynamic signal acquisition (DSA) module that offers 24-bit resolution and IEPE … Read More → "ADLINK Builds PXI Express Family of Products with Industry-Leading Devices for High-Bandwidth Application"

Appro Announces Availability for Server Platforms based on the New Intel® Xeon® Processor E5-2600 product family

March 8, 2012

Milpitas, CA – March 6, 2012 – Appro (http://www.appro.com), a leading provider of supercomputing solutions, announced today the general availability and support for the next generation Appro GreenBlade™ and rackmount server platforms based on the new Intel® Xeon® processor E5-2600 product family to deliver improved floating point performance, operational efficiency and higher peak performance at the same power level as previous generations.

The new Appro server … Read More → "Appro Announces Availability for Server Platforms based on the New Intel® Xeon® Processor E5-2600 product family"

Carbon and Arteris Partner to Deliver Interconnect Models to SoC Designers

March 8, 2012

ACTON, MASS. –– March 8, 2011 –– Carbon Design Systems and Arteris, Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect intellectual property (IP</ … Read More → "Carbon and Arteris Partner to Deliver Interconnect Models to SoC Designers"

TI introduces world’s first configurable NDIR gas sensing and pH sensing AFEs

March 8, 2012

DALLAS (March 7, 2012) –Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two configurable analog front ends (AFE) that provide an easy-to-use, modular solution for bridging the gap between the microprocessor and sensor. Design engineers can dramatically reduce their development time by using a single AFE across multiple nondispersive infrared (NDIR) gas sensor and pH sensor platforms instead of designing several complex discrete solutions. The AFEs team with TI’s WEBENCH® Sensor AFE Designer software and bench-top development system. These tools allow engineers to select a sensor, design and configure the solution and download configuration data to … Read More → "TI introduces world’s first configurable NDIR gas sensing and pH sensing AFEs"

Silicon Designs Introduces Low-Cost Triaxial MEMS Capacitive Accelerometer Module Family

March 8, 2012

March 7, 2012, Issaquah, Washington, USA – Silicon Designs, Inc. (www.SiliconDesigns.com), a global industry leader in the design and manufacture of industrial-grade MEMS capacitive accelerometer chips and modules, has announced the global market introduction of its new model 2445 series, a family of single-ended low-noise analog MEMS capacitive accelerometer modules, designed to support a variety of low-to-medium frequency triaxial measurement requirements.

The rugged design of the model 2445 features three orthogonally mounted low-noise MEMS capacitive sensing elements, packaged in a nitrogen-damped, epoxy sealed lightweight aluminum housing, finished … Read More → "Silicon Designs Introduces Low-Cost Triaxial MEMS Capacitive Accelerometer Module Family"

Calibre Flow Developed with Mentor Graphics Consulting Boosts GLOBALFOUNDRIES Silicon Yield

March 8, 2012

WILSONVILLE, Ore., March 8, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced that a new flow developed for GLOBALFOUNDRIES by the Mentor® Consulting Division (MCD) using the Calibre® suite of tools has demonstrated the ability to improve incoming design yield. A silicon experiment performed by GLOBALFOUNDRIES and Mentor resulted in a significant yield increase on a test chip after the integrated flow made automatic design-for-manufacturing (DFM) improvements using multiple Calibre tools for analysis and direct modification to the GDS layout database. The flow, which is available to GLOBALFOUNDRIES customers for 45/40 and 32/28 nm processes, features rapid turnaround time for full-chip designs, … Read More → "Calibre Flow Developed with Mentor Graphics Consulting Boosts GLOBALFOUNDRIES Silicon Yield"

Hoffmann + Krippner announces channel partnership with Cyntech Components, UK

March 8, 2012

March 8th 2012 – Hoffmann + Krippner, global leader in the design and development of high-quality and innovative membrane input solutions, has announced a UK-wide partnership agreement with electromechanical specialist distributor Cyntech Components, UK.

Representing the first UK distribution deal for the company, the agreement with Cyntech covers Hoffmann+Krippner’sflexx-IPC® industrial touch screen panel PC brand, Sensofoil® customisable membrane potentiometers and SENSOTOUCH® resistive sensor controller technology. The partnership agreement will allow Hoffmann + Krippner to gain greater presence … Read More → "Hoffmann + Krippner announces channel partnership with Cyntech Components, UK"

Arasan Chip Systems first to market with MIPI® D-PHY Rev 1.1 compliant PHY IP

March 8, 2012

San Jose, California – March 8, 2012 – Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today the availability of their upgraded MIPI D-PHY IP Core, the latest addition to its prominent PHY portfolio. On December 16, 2011 the MIPI Alliance® board approved version 1.1 of the … Read More → "Arasan Chip Systems first to market with MIPI® D-PHY Rev 1.1 compliant PHY IP"

Introducing GainSpan’s SDK-Builder: Low Cost Tool to Create Custom Wi-Fi Solutions for the Internet of Things

March 7, 2012

SAN JOSE, Calif., March 7, 2012 /PRNewswire/ — GainSpan® Corporation, a leader in low power Wi-Fi and Wi-Fi connectivity for the Internet of Things, today introduced SDK-Builder, a web-based tool that enables developers to select Wi-Fi features and build custom binary for their embedded devices, with no IDE tool chain. SDK-Builder, the first such tool for the embedded Wi-Fi market, reduces development cost for companies designing connected devices based on GainSpan’s Wi-Fi … Read More → "Introducing GainSpan’s SDK-Builder: Low Cost Tool to Create Custom Wi-Fi Solutions for the Internet of Things"

ECT’s World’s first 3D chip, supporting MIPI interface technology, employs five MIPI products from Mixel

March 7, 2012

Seoul, Korea, and San Jose, CA — March 7, 2012—Mixel®, the leader in mobile mixed-signal intellectual property (IP), announced today that Enhanced Chip Technology(ECT), a leader in < … Read More → "ECT’s World’s first 3D chip, supporting MIPI interface technology, employs five MIPI products from Mixel"