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Movea Launches MotionCore™ at MWC 2012: The Industry’s First Motion Processing IP Cores Designed for Mobile Devices

Grenoble, France – 23 February, 2012 – Movea, a world leader in motion-processing and data fusion technology, announced today its new MotionCore product line: a family of motion processing IP Cores designed for mobile devices. MotionCore architectures are optimized for motion sensing and data fusion applications and run implementations of Movea’s proprietary SmartMotion®algorithms. For sensor-enabled mobile devices, MotionCore delivers increased performance with dramatically reduced power consumption at a significantly lower cost than software only solutions.

The combined market for MEMS accelerometers, gyroscopes and magnetometers and pressure sensors in mobile devices has demonstrated dramatic growth in recent years … Read More → "Movea Launches MotionCore™ at MWC 2012: The Industry’s First Motion Processing IP Cores Designed for Mobile Devices"

SPIRIT DSP Takes Cross-platform, Multi-point HD Video Calling to Mobile World Congress 2012

MOSCOW, Russia – February 22, 2012 –  SPIRIT DSP, the world’s top voice and video over IP engines provider, has announced today its plans to demonstrate live multi-point, cross platform mobile HD VVoIP (Voice&Video Over IP) calling at Mobile World Congress 2012 in Barcelona, Feb. 27-March 1.

In booth #2H11 (Hall 2), SPIRIT will demonstrate the following award-winning software solutions:

LSI Expands Axxia Platform to Deliver Power-Efficient Mobile Networks

MILPITAS, Calif., February 23, 2012 – LSI Corporation (NYSE: LSI) today announced a significant enhancement of its proven Axxia® platform that dramatically accelerates performance for next-generation wireless infrastructure. LSI will bring ARM® processors, long the standard for power efficiency in mobile devices like smartphones and tablets, to mobile networks. The new wireless platform will be the first to combine the latest cores from ARM with hardware accelerators, resulting in a system on a chip uniquely suited to building intelligent, heterogeneous networks.

The new Axxia wireless platform … Read More → "LSI Expands Axxia Platform to Deliver Power-Efficient Mobile Networks"

Renesas Electronics Launches RL78/I1A DC/DC LED Control Demonstration Kit to Facilitate Digital LED Driver Design

Dusseldorf, February 23, 2012  –  Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced its new DC/DC LED control demonstration kit based on the RL78/I1A microcontroller (MCU). The RL78/I1A MCU series of five application-specific standard products (ASSP) are designed for lighting applications. The RL78/I1A DC/DC LED control demonstration kit enables system designers to experience the benefits of MCU-based solutions for LED driver development. They can also learn about LED constant current control and various methods of dimming using … Read More → "Renesas Electronics Launches RL78/I1A DC/DC LED Control Demonstration Kit to Facilitate Digital LED Driver Design"

Nordic Semiconductor launches the µBlue™ nRF8002 – a low cost, ultra-low power, uniquely easy to design-in single chip solution for Bluetooth Smart tags and accessories

Sampling to customers now, the nRF8002 extends Nordic Semiconductor’s Bluetooth low energy offering with a cost-optimized, ultra-low power, and uniquely easy to design-in single chip solution for Bluetooth Smart (as Bluetooth low energy will now be marketed to consumers) tags and accessories. Nordic Semiconductor will showcase demos of nRF8002-based designs working with both iPhone® 4S and Android™ based smartphones at the upcoming Mobile World Congress in Spain from February 27 through March 1, 2012

Oslo, Norway – February 22, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA ( … Read More → "Nordic Semiconductor launches the µBlue™ nRF8002 – a low cost, ultra-low power, uniquely easy to design-in single chip solution for Bluetooth Smart tags and accessories"

TI pushes speed threshold with industry’s fastest 16-bit digital-to-analog converter at 1.5 GSPS

DALLAS (February 23, 2012) – Continuing to push the limits of data converter performance, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s fastest 16-bit digital-to-analog converter (DAC). The quad DAC34SH84 is 50-percent faster and uses 50-percent less power than the closest 16-bit DAC alternative, clocking in at 1.5 GSPS and consuming just 362 mW per channel. The DAC34SH84 provides an easy, pin-compatible upgrade from the 1.25-GSPS DAC34H84 for customers wanting to maximize speed in 3G, LTE, GSM and WiMAX wireless base stations and repeaters; microwave point-to-point radio; software defined radio; and waveform generation systems. For … Read More → "TI pushes speed threshold with industry’s fastest 16-bit digital-to-analog converter at 1.5 GSPS"

New record low-power multi-standard transceiver for sensor networks

San Francisco, Calif., February 22, 2012 – Imec and Holst Centre announce a 2.3/2.4GHz transmitter for wireless sensor applications compliant with 4 wireless standards (IEEE802.15.6/4/4g and Bluetooth Low Energy). The transmitter has been fabricated in a 90nm CMOS process, and consumes only 5.4mW from a 1.2V supply (2.7nJ/bit) at 0dBm output. This is 3 to 5 times more power-efficient than the current state-of-the-art Bluetooth-LE solutions. These results have been obtained in collaboration with Panasonic, within imec and Holst Centre’s program for ultralow-power wireless communication. 

Applications for wireless sensor networks, personal healthcare, … Read More → "New record low-power multi-standard transceiver for sensor networks"

LAPIS Semiconductor starts mass-production of ultra-compact microcontrollers that take integrated control of various sensors installed on smart phones with low power consumption

For the smart phone market, LAPIS Semiconductor, a ROHM Group company, has developed “ML610Q792,” one of the world’s smallest class of low power microcontrollers. This microcontroller can take integrated control of various sensors with low power consumption. Recently, the ratio of smart phones to mobile phones has been increasing steadily. On the other hand, load on the battery of a smart phone has also been increasing because of installation of more sensors for provision of new applications and services. Paying attention to this fact, LAPIS Semiconductor has separated sensors required to be driven all the time from … Read More → "LAPIS Semiconductor starts mass-production of ultra-compact microcontrollers that take integrated control of various sensors installed on smart phones with low power consumption"

Sidense 1T-OTP Helps Calibrate Aptina’s Advanced Imaging Products

Ottawa, Canada – (February 21, 2012) – Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, announced that Aptina, a leading provider of CMOS image sensors and camera modules, is using Sidense’s field-programmable 1T-OTP memory macros for several image sensor and camera module products for the mobile, consumer, automotive and surveillance markets. Developed for use at TSMC’s 65nm low-power (LP) process node, the 1T-OTP macros provide a reliable and flexible memory solution in a small footprint to support calibration and optimization of image sensors in a chip, … Read More → "Sidense 1T-OTP Helps Calibrate Aptina’s Advanced Imaging Products"

Digital signal control capabilities on TI’s Stellaris® ARM® Cortex™-M4F core based microcontrollers highlighted by software interface standard

Austin, TX (February 22, 2012) – Enabling developers to streamline the design process, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced its Stellaris® Cortex-M4F-core based microcontrollers (MCUs) now support ARM’s® latest Cortex Microcontroller Software Interface Standard (CMSIS). In addition to TI’s StellarisWare® software suite, ARM’s CMSIS libraries help developers realize the industry-leading benefits of Stellaris LM4F microcontrollers by simplifying the implementation of floating point, single instruction … Read More → "Digital signal control capabilities on TI’s Stellaris® ARM® Cortex™-M4F core based microcontrollers highlighted by software interface standard"

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