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Synopsys and Applied Materials Collaborate on TCAD Models for Next-Generation Logic and Memory Technologies

March 15, 2012

MOUNTAIN VIEW, Calif. and SANTA CLARA, Calif., March 15, 2012 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) and Applied Materials, Inc. (NASDAQ: AMAT) today announced a collaboration to develop technology computer-aided design (TCAD) models for next-generation semiconductor devices. The models derived from this TCAD collaboration will enable customers to speed up process development for 14-nanometer (nm) and 11-nm logic and new memory chip technologies, allowing them to lower cost and reduce time-to-market.

The continued scaling of logic transistors and memory cells to smaller and smaller dimensions requires new materials and architectures, which increase chip complexity and extend process development time for … Read More → "Synopsys and Applied Materials Collaborate on TCAD Models for Next-Generation Logic and Memory Technologies"

Maxim Advances the Performance of GNSS Systems with Introduction of its Automotive Grade Universal Receiver and Front End Amplifier

March 15, 2012

Sunnyvale, CA–March 14, 2012–Maxim Integrated Products Inc. (NASDAQ: MXIM) introduces the MAX2769B and MAX2670,next-generation high performance solutions specifically designed to address Global Navigation Satellite System (GNSS) applications. These flexible receiver solutions are capable of operating over the navigation standards, GPS, GLONASS, Galileo, and Compass and have completed PPAP and AEC-Q100 approval.

The MAX2670 is a dual stage low noise amplifier … Read More → "Maxim Advances the Performance of GNSS Systems with Introduction of its Automotive Grade Universal Receiver and Front End Amplifier"

HiWave’s HiAS2001 mono audio amplifier IC for Hi-Fi speakers gives 13W burst output and 10x efficiency gains

March 15, 2012

Cambridge, UK, March 15th, 2012: HiWave Technologies (LSE:HIW), the provider of electronic and transducer solutions for audio and haptic touch, has launched a single channel audio power amplifier for the consumer and Hi-Fi market. The HiAS2001-QNC-010 delivers 13W burst and 3W continuous power output and is over 10 times more efficient at typical listening levels than comparable Class D amplifiers. The HiAS2001 uses HiWave’s proprietary Audium technology to create the highly power efficient switching audio power amplifier, optimised to operate directly from a low voltage (0.8 – 1.8V) battery source.

For … Read More → "HiWave’s HiAS2001 mono audio amplifier IC for Hi-Fi speakers gives 13W burst output and 10x efficiency gains"

36V, 5A µModule Regulator Protects Input Supplies from Overcurrent Conditions & Supports Asymmetric Power Sharing

March 15, 2012

MILPITAS, CA – March 15, 2012 Linear Technology announces the LTM8026, a 36V input, 5A step-down µModule® regulator with an adjustable and precise (+/-10%) accurate current limit. The current limit enables designers to set the maximum amount of power drawn from the supply, preventing input voltage droop caused by overcurrent conditions. When multiple LTM8026 are configured with the … Read More → "36V, 5A µModule Regulator Protects Input Supplies from Overcurrent Conditions & Supports Asymmetric Power Sharing"

Advantech deploys New Dual Processor ATCA Blades and Network Appliances with Intel® Xeon® Processor E5-2600 Series

March 14, 2012

Irvine, California, March 13, 2012 – Advantech, a global manufacturer of network computing blades, and multicore processor platforms, announced it is now shipping ATCA blades and network appliances employing the Intel® Xeon® processor E5-2600 family, formerly codenamed Romley-EP, to leading network equipment providers and telecom equipment manufacturers for deployment in their next generation platforms. The new platforms feature increased performance, faster and adaptable I/O along with greater memory capacity – all requirements at the core of applications using Deep Packet Inspection (DPI) technology such as policy enforcement, quality-of-service, mobile and video … Read More → "Advantech deploys New Dual Processor ATCA Blades and Network Appliances with Intel® Xeon® Processor E5-2600 Series"

EEMBC Brings Order to the Chaos of Android™ Benchmarking

March 14, 2012

EL DORADO HILLS, Calif. — March 14, 2012 — The Embedded Microprocessor Benchmark Consortium (EEMBC) today launched its standardized, industry-approved method of evaluating Android-enabled devices. The EEMBC benchmark, named AndEBench, is available for download on Android Market, now part of Google Play, and at the Amazon Appstore for Android. While of great value to processor, system, and software vendors, the easy-to-run AndEBench tool also empowers end-users to validate and compare operations on their phones or tablets, many of which vary considerably in performance.

Ultimately, AndEBench will comprise a battery of performance tests … Read More → "EEMBC Brings Order to the Chaos of Android™ Benchmarking"

Aldec Takes FPGA & ASIC Debugging to the Next Level

March 14, 2012

DRESDEN, Germany–(BUSINESS WIRE)–Aldec, Inc. has launched the latest version of its high-performance, mixed-language verification tool, Riviera-PRO™. Unveiled at the Design, Automation and Test in Europe (DATE) conference, Riviera-PRO release version 2012.02 supports a number of advanced verification methodologies which are set to greatly benefit the designers of complex FPGAs and those migrating to ASIC.

New to version 2012.02 of Riviera-PRO are support for the verification environments constructed with the Universal Verification Methodology (UVM) class library and new SystemVerilog IEEE 1800-2009 and VHDL IEEE 1076-2008 constructs. … Read More → "Aldec Takes FPGA & ASIC Debugging to the Next Level"

Xilinx to Deliver Talks at SEMICON China 2012 on 2.5/3-D IC and High-Bandwidth IC Design Through Manufacturing

March 14, 2012

SAN JOSE, Calif., March 14, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at SEMICON China 2012 taking place in Shanghai, China fromMarch 20 through 22.

What: SEMICON China 2012
Where: Shanghai New International Expo Centre, Shanghai, China
When: March 20 – 22, 2012

< … Read More → "Xilinx to Deliver Talks at SEMICON China 2012 on 2.5/3-D IC and High-Bandwidth IC Design Through Manufacturing"

15W I²C Power Manager Charges LiFePO4 Cells at 3.5A for High Power Density Portable & Battery Back-up Systems

March 14, 2012

MILPITAS, CA – March 14, 2012 – Linear Technology Corporation introduces the LTC4156, a high power, I²C controlled, high efficiency PowerPath™ manager, ideal diode controller and Lithium Iron Phosphate (LiFePO4) battery charger for single-cell devices such as portable medical and industrial devices, backup devices and other high power density battery-powered applications. The IC is designed to efficiently transfer … Read More → "15W I²C Power Manager Charges LiFePO4 Cells at 3.5A for High Power Density Portable & Battery Back-up Systems"

Teklatech Accelerates SoC Power Integrity Closure with FloorDirector 3.2 Rail-Aware Optimization

March 14, 2012

COPENHAGEN, Denmark, March 14th, 2012 – Teklatech®, an industry leader in EDA solutions for achieving faster power integrity and noise closure in System-on-Chip (SoC) designs, today announced the release of version 3.2 of its FloorDirector® tool. FloorDirector 3.2 combines high-performance power rail analysis with its signature Dynamic Power Shaping™ capabilities, to enable a powerful Rail-Aware Optimization™ (RAO) solution.

The RAO-enabled design flow allows backend designers of SoC devices to perform advanced, cell-based power rail analysis, and integrates this tightly into FloorDirector’s dynamic power optimization engine. The existing engine is used by design teams today … Read More → "Teklatech Accelerates SoC Power Integrity Closure with FloorDirector 3.2 Rail-Aware Optimization"

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