News – Page 2074 – EEJournal

Kilopass First to Demonstrate Antifuse Reliability Data in 28nm HKMG

March 1, 2012

Santa Clara, Calif. – February 29, 2012 – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that it is the first non-volatile memory (NVM) IP provider to demonstrate antifuse reliability in 28nm High-K Metal Gate (HKMG). Kilopass has successfully completed 500 hours of High Temperature Operating Life (HTOL) and 500 hours of High Temperature Storage life (HTSL) per JEDEC 47 standard qualification with no failures. The remaining 500 hours will be completed by end of March 2012.

“We are extremely pleased with the reliability results on 2T antifuse silicon … Read More → "Kilopass First to Demonstrate Antifuse Reliability Data in 28nm HKMG"

Docea Power Unveils Thermal Modeling Solution for Early Architecture Exploration and Optimization, First Demonstrations at DATE 2012

March 1, 2012

Grenoble, France and San Jose, CA – February 29 , 2012 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced the release of its AceThermalModeler™ (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.

Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power … Read More → "Docea Power Unveils Thermal Modeling Solution for Early Architecture Exploration and Optimization, First Demonstrations at DATE 2012"

FTDI Introduces X-Chip Series of Next Generation USB Interface ICs

March 1, 2012

February 29th 2012 – USB solutions specialist Future Technology Devices International Limited (FTDI) has supplemented its portfolio of USB to serial interface products with the release of its new X-Chip series. Made up of devices in 13 different package options, X-Chip complements the company’s existing FT-R and FT-H offerings. The series supports a broad selection of interface types, such as basic UART, full UART, FIFO and I2C, as well as FTDI’s proprietary FT1248 I/O (including provision for enhanced SPI).

Through X-Chip, engineers are … Read More → "FTDI Introduces X-Chip Series of Next Generation USB Interface ICs"

Samsung DFM Ready for 20 nm Based on Mentor Graphics Calibre Platform

March 1, 2012

WILSONVILLE, Ore., March 1, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced that Samsung Electronics and Mentor® have successfully delivered a complete design-for-manufacturing (DFM) sign-off reference solution for Samsung’s foundry customers based on the Calibre® platform. The DFM sign-off solution is available for world class consumer and telecommunications designs targeting advanced process nodes. Samsung has already released the Calibre kits to their customers for 32 nm and 28 nm, and has completed evaluation for 20 nm.

“We have been working closely with Mentor to provide a comprehensive and consistent ecosystem for our customers,& … Read More → "Samsung DFM Ready for 20 nm Based on Mentor Graphics Calibre Platform"

ST-Ericsson announces new highly integrated LTE NovaThor platform

March 1, 2012

Barcelona, February 28, 2012 – ST-Ericsson, a world leader in wireless platforms and semiconductors, announced today the latest addition to its integrated smartphone and tablet platform portfolio. The NovaThor(TM) L8540 is an LTE/HSPA+/TD-HSPA-enabled integrated smartphone platform with the powerful application processor and modem integrated on a single die.

“By adding the new NovaThor L8540 platform to our portfolio of highly integrated smartphone and tablet solutions, the L8540 takes integration of LTE platforms to the next level,” said Marc Cetto, senior vice president of smartphone … Read More → "ST-Ericsson announces new highly integrated LTE NovaThor platform"

LDRA and MathWorks Tool Integration Moves Unit Testing Upstream to the Model

March 1, 2012

Embedded World, Nürnberg, Germany, March 1, 2012. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, and MathWorks, the leading developer of mathematical computing software, have extended the integration of the LDRA tool suite with … Read More → "LDRA and MathWorks Tool Integration Moves Unit Testing Upstream to the Model"

Telit Wireless Solutions Announces High-Performance GPS/GLONASS Module For Navigation Devices

March 1, 2012

Raleigh, NC – Feb. 29, 2012 – Telit Wireless Solutions (AIM: TCM), a global leader in machine-to-machine (M2M) wireless technology, today announced a new dual GPS/GLONASS module that dramatically improves navigation performance by providing access to both the Russian GLONASS global navigation satellite system and U.S. GPS.

Telit Location Solutions’ new Read More → "Telit Wireless Solutions Announces High-Performance GPS/GLONASS Module For Navigation Devices"

AdaCore Releases GNAT Pro 7.0

February 29, 2012

NEW YORK, PARIS and NUREMBERG, Germany, February 28, 2012 – Embedded World Conference – AdaCore today announced the availability of GNAT Pro 7.0, a major new version of the company’s flagship development environment product. This latest annual release completely implements the upcoming Ada 2012 language revision, offers a range of improvements (many based on user suggestions), supports several new platforms, includes an important new testing tool (GNATtest), and enhances several existing tools. As with all AdaCore products, GNAT … Read More → "AdaCore Releases GNAT Pro 7.0"

Agnisys offers free Register Generator for UVM

February 29, 2012

San Jose, CA, Feb 28th 2012 – Agnisys today announced a free version of its Hardware Specification tool –IDesignSpec™. It enables users to capture hardware specification that is automatically converted into implementation code. The free version of IDesignSpec™ is capable of generating complete UVM based register models that can be easily used to verify registers.

“Attending the first day at the DVCon conference and meeting UVM users, it is clear that the user community is asking for a Register Generator that will enable them to quickly use the UVM based verification … Read More → "Agnisys offers free Register Generator for UVM"

Eurotech Announces CPU-111-10, the New 6U OpenVPX SBC With Quad-Core Intel Xeon CPU and 10 Gigabit Ethernet Switch

February 29, 2012

Nuremberg (Germany), February, 29th, 2011 – Eurotech announces the CPU-111-10, a rugged, high-performance 6U VPX (VITA 46) Single Board Computer (SBC) featuring a quad-core Intel L5408 Xeon processor and integrated 10 Gigabit Ethernet switch to support full-mesh backplane data layer interconnectivity for up to eight SBCs integrated into a single chassis. Available in air cooled or conduction cooled formats, the CPU-111-10 conforms to the OpenVPX (VITA 65) payload module profile MOD6-PAY-4F2T-12.2.2.4 with four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T).

Providing unparalleled data processing capabilities in a single-slot 6U VPX form factor … Read More → "Eurotech Announces CPU-111-10, the New 6U OpenVPX SBC With Quad-Core Intel Xeon CPU and 10 Gigabit Ethernet Switch"