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Carbon Extends IP Exchange to Include Virtual Reference Platforms

ACTON, MASS. –– January 17, 2012 –– Carbon Design Systems™, the leading supplier of virtual platform and secure model solutions, today announced immediate availability of virtual reference platforms on its Carbon IP Exchange Web Portal, found at www.carbonipexchange.com.

“Carbon’s virtual reference platforms have been used successfully by multiple designers to quickly get up and running,” remarks Bill Neifert, chief technology officer at Carbon. 

Read More → "Carbon Extends IP Exchange to Include Virtual Reference Platforms"

SuVolta Expands Commitment to Magma’s FineSim SPICE

SAN JOSE, Calif., January 17, 2012 — Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today that SuVolta, Inc., a developer of scalable low-power CMOS technologies in Los Gatos, Calif., has expanded its business relationship with Magma by entering into a licensing agreement to use the FineSim™ SPICE multi-CPU circuit simulator. 

SuVolta’s PowerShrink™ low-power platform reduces the power consumed by integrated circuits (ICs) by 50 percent or more while maintaining the same performance levels by minimizing the electrical variation of the millions of transistors on a chip. … Read More → "SuVolta Expands Commitment to Magma’s FineSim SPICE"

Green Hills Software to Exhibit at the DistribuTECH Conference 2012 in San Antonio, TX

SANTA BARBARA, CA — January 17, 2012 — Green Hills Software, the largest independent vendor of embedded software solutions, will demonstrate its latest technology at DistribuTECH Conference, January 24 – 26, 2012, at the Henry B. Gonzalez Convention Center, San Antonio, Texas, booth #1745.
The company will be demonstrating its Platform for Smart Energy, a comprehensive, scalable solution for the design, construction, and deployment of secure, resilient, Smart Energy devices from small-footprint, high-performance devices to robust and secure utility applications.  On display:

EMA Automates PCB Footprint Generation With New App for Allegro PCB Design

Rochester, NY (January 17, 2012) – EMA Design Automation™ (www.ema-eda.com), a full-service provider of mechanical and electrical CAD tools, today announced the release of FootprintGen – an app which accurately automates the generation of complex PCB footprint (land pattern) models in a fraction of the time compared to typical manual methods. Both user-defined and the IPC-7351 standard settings are fully supported across a broad range of component families.

“Footprint creation is a constant challenge for PCB designers,” said Manny Marcano, president and CEO of … Read More → "EMA Automates PCB Footprint Generation With New App for Allegro PCB Design"

Holst Centre and imec launch research program on flexible OLED displays

Eindhoven (NL) and Leuven (B) – January 17, 2012 – Holst Centre and imec launch a new research program on next-generation flexible OLED (organic light emitting diode) displays. It builds on their proven technology track record and solid base of existing research partners in related fields such as Organic and Oxide Transistors and Flexible OLED Lighting. The primary objective of the new program is to develop an economically scalable route to high-volume manufacturing of flexible active-matrix OLED displays. The shared program will bring together partners from across the value chain to tackle challenges such as high resolution, low power consumption, large … Read More → "Holst Centre and imec launch research program on flexible OLED displays"

Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs

SAN JOSE, CA–(Marketwire – January 17, 2012) – “With the march toward greater design complexity showing no sign of abating, comprehensive verification is essential for a company to achieve its profitability goals,” said Hao Fang, IP design manager at LSI. “‘Advanced Verification Topics’ will be an important reference book for teams responsible for verifying complex mixed-signal IP and SoCs that utilize low-power, verification IP (VIP), transaction-level models (TLM), acceleration, and similar techniques to reduce risk while getting end products into working silicon faster.”Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs"

MoSys, Inc. Earns ISO 9001:2008 Certification

SANTA CLARA, Calif., January 17, 2011 – MoSys (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, today announced that it has earned ISO 9001:2008 certification from TUV America.

The ISO 9000 series standards are internationally recognized quality management system requirements developed by the International Organization for Standardization (ISO). ISO 9001, the most comprehensive standard in the ISO 9000 series, covers design, development … Read More → "MoSys, Inc. Earns ISO 9001:2008 Certification"

Synchronous Step-Down DC/DC Controller Delivers Up to 95% Efficiency with 2MHz Operating Frequency

MILPITAS, CA – January 17, 2012 – Linear Technology Corporation introduces the LTC3839, a high frequency controlled on-time single output dual phase synchronous step-down DC/DC controller that can achieve up to 95% efficiency with a 25A output when operating at 2MHz. The operating frequency is selectable from 200kHz to 2MHz or can be synchronized to an external clock. … Read More → "Synchronous Step-Down DC/DC Controller Delivers Up to 95% Efficiency with 2MHz Operating Frequency"

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