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Touchstone Introduces First Bidirectional, Symmetrical 1µA Current-Sense Amplifiers

MILPITAS, CALIF. – March 26, 2012 – Touchstone Semiconductor, Inc., a developer of high-performance analog integrated circuit solutions, today announced the TS1101, the first bidirectional, symmetrical, high-side current-sense amplifiers (CSA).  The TS1101 consumes only 1µA, a 30 times reduction over the closest competing product.

The TS1101’s symmetrical architecture eliminates the “dead band” when switching from measuring battery discharge to measuring battery charge.  This breakthrough significantly simplifies customer designs while, at the same time, reducing power, saving board space and improving system accuracy. 

The TS1101 further improves … Read More → "Touchstone Introduces First Bidirectional, Symmetrical 1µA Current-Sense Amplifiers"

Renesas Electronics Packs RX Punch into a Smaller Package to Support Cost-Sensitive Industrial and Consumer Applications

SANTA CLARA, Calif, March 23, 2012 — Renesas Electronics America, a leading provider of advanced semiconductor solutions, today announced the availability of 12 new microcontrollers (MCUs) in the high-performance RX631 Group. The new devices bring the outstanding 1.65 Dhrystone MIPS (DMips) performance and advanced connectivity features of the RX631 MCUs in smaller 64- and 48-pin packages with smaller flash memory footprints of 256KB, 384KB and 512KB to serve cost and space constrained applications.

Pin-to-pin and software compatible with others in the RX631 MCU Group, the new devices provide true single-chip solutions for demanding industrial applications such as building and factory … Read More → "Renesas Electronics Packs RX Punch into a Smaller Package to Support Cost-Sensitive Industrial and Consumer Applications"

Synopsys Unveils 3D-IC Initiative

MOUNTAIN VIEW, Calif., March 26, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today unveiled its initiative to accelerate the design of stacked multiple-die silicon systems using 3D-IC integration to meet the requirements of faster and smaller electronic products that consume less power. As part of its 3D-IC initiative, Synopsys is working closely with leading IC design and manufacturing companies to deliver a comprehensive EDA solution, including enhanced versions of its IC implementation and circuit simulation products.

3D-IC technology complements conventional transistor scaling to enable designers to achieve … Read More → "Synopsys Unveils 3D-IC Initiative"

Wind River Announces Software Support for Xilinx Zynq-7000 EPP at DESIGN West 2012

  • Wind River provides VxWorks and multi-core tools support for the Xilinx Zynq-7000 extensible processing platform.
  • The combination of Wind River software and tools with Zynq-7000 devices delivers the sophistication, high performance and flexibility that meet the demands of multiple vertical markets.
  • Wind River is also showcasing its latest developments at DESIGN West 2012 at booth #1623.

DESIGN WEST 2012, SAN JOSE, Calif. – March 26, 2012 – Wind River, a world … Read More → "Wind River Announces Software Support for Xilinx Zynq-7000 EPP at DESIGN West 2012"

Express Logic’s ThreadX RTOS Solves Multicore SMP and AMP Programming Challenges

Design West, ESC Summit, San Jose, CA, March 23, 2012 – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that the ThreadX® RTOS now is available for multicore systems in both Symmetric Multiprocessing (SMP) or Asymmetric Multiprocessing (AMP) modes. With multicore processors becoming more and more common in consumer, medical, and industrial applications, Express … Read More → "Express Logic’s ThreadX RTOS Solves Multicore SMP and AMP Programming Challenges"

Cadence Announces Support for New Interface Verification IP for Development of Cloud Infrastructure

SAN JOSE, Calif., March 26, 2012 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the company is adding support for two popular protocol standards used in cloud computing applications, 12Gb/s SAS and NVM Express, to the Cadence Verification IP (VIP) Catalog <http://www.cadence.com/products/fv/verification_ip/pages/default.aspx> .  The expanding VIP Catalog is helping leaders in the networking market, like AppliedMicro, to deliver the systems and SoCs … Read More → "Cadence Announces Support for New Interface Verification IP for Development of Cloud Infrastructure"

Avnet Express’ Drive for Innovation Exclusive Sponsor of the DESIGN West University Grant Program A

The Drive for Innovation – a year-long, cross-country road trip created to celebrate electronics innovation, is making a stop at DESIGN West and bringing 20 students along for the ride. The University Grant Program, sponsored by Avnet Express, the e-Commerce engine of Avnet, Inc. (NYSE: AVT) and UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, will cover the attendance cost for students from San Jose State University’s College of Engineering Mechatronics to attend DESIGN West, March 26-29, 2012 at the McEnery Convention Center in San Jose, CA.

DESIGN … Read More → "Avnet Express’ Drive for Innovation Exclusive Sponsor of the DESIGN West University Grant Program A"

LDRA Integrates Leading Requirements Engineering Tool IRQA into LDRA Tool Suite

DESIGN West, San Jose, March 26, 2012. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, announced the integration of Visure Solutions’ IRQA requirements engineering tools with TBmanager, a test management and traceability component within the& … Read More → "LDRA Integrates Leading Requirements Engineering Tool IRQA into LDRA Tool Suite"

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