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congatec Introduces New COM Express Type 6 Module With Quad Core, 3rd Generation Intel® Core™ Processors

San Diego, California * * * April 23rd, 2012  * * *  congatec Inc., a leading manufacturer of embedded computer modules, has just introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency. The crucial innovations in the 3rd generation Intel® Core™ processors relate to the construction, with 3D Tri-Gate transistors and 22 nanometer technology, plus a more powerful integrated graphics core. The type 6 pinout and 3x digital display interfaces provide better display options and increased bandwidths with extra PCI Express lanes.

The COM Express module is fitted with the new quad cores, 3rd generation … Read More → "congatec Introduces New COM Express Type 6 Module With Quad Core, 3rd Generation Intel® Core™ Processors"

Xilinx to Deliver Keynotes at SEMICON Singapore 2012

SAN JOSE, Calif., April 22, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at SEMICON Singapore 2012 taking place at Marina Bay Sands Expo & Convention Center in Singapore from April 24 – 26, 2012.

What: SEMICON Singapore 2012 
Where: Marina Bay Sands (MBS) Expo & Convention Center, Singapore 
When: April 24 – 26, 2012

Vincent Tong, Xilinx senior vice president of worldwide quality and new … Read More → "Xilinx to Deliver Keynotes at SEMICON Singapore 2012"

Tensilica Reaches Audio DSP Milestones: 300 Million HiFi Audio/Voice DSPs, Over 100 Software Packages, More Than 30 Partners

Santa Clara, CA USA – April 23, 2012 – Tensilica®, Inc. today announced that it has reached several important milestones for its leading HiFi Audio/Voice DSPs (digital signal processors), the most widely-used audio/voice DSP IP cores on the market. Tensilica’s customers have shipped over 300 million of its audio/voice DSP cores for use in digital televisions, smartphones, Blu-ray Disc players, automotive, audio/video receivers, portable digital radio and other consumer electronics equipment. Tensilica and its network of 30 plus partners have ported and optimized over 100 audio/voice encoders and decoders, audio enhancement software and pre-processing packages.

“ … Read More → "Tensilica Reaches Audio DSP Milestones: 300 Million HiFi Audio/Voice DSPs, Over 100 Software Packages, More Than 30 Partners"

IAR Systems delivers even faster code for Renesas RL78 applications

Uppsala, Sweden—April 23, 2012—Today, IAR Systems® introduces version 1.20 of the high-performing development toolsuite IAR Embedded Workbench® for RL78. The new version brings highly efficient speed optimizations.

IAR Embedded Workbench is a full set of development tools for building and debugging embedded applications. It includes a project manager, editor, compiler, assembler, linker, debugger, and library tools in a user-friendly integrated development environment.

Thanks to the longstanding and solid relationship between IAR Systems and Renesas Electronics, IAR Embedded Workbench for RL78 was the first set of development tools to be made available … Read More → "IAR Systems delivers even faster code for Renesas RL78 applications"

IQD to Support ONE-NET Open-Source Wireless Control Standard

IQD Frequency Products have announced that they have joined the ONE-NET open-source wireless networking allianceThe ONENET wireless standard is the world’s foremost multi-vendor, open source wireless control protocol. ONENET was specifically designed for optimized home control applications and includes important features such as integrated peer-to-peer operation. It also features a high level of security, excellent range and low power consumption. ONE</ … Read More → "IQD to Support ONE-NET Open-Source Wireless Control Standard"

4th Asia Symposium on Quality Electronic Design (ASQED) Announces Extended Call for Papers; Convenes July 10-11, Penang, Malaysia

SAN JOSE, CA and PENANG, Malaysia –

Who/What

The fourth Asia Symposium on Quality Electronic Design (ASQED), a leading international conference focused on electronic design, semiconductor, and manufacturing, has extended its 2012 call for papers to April 23, 2012. The event takes place July 10-11, 2012 in Penang, Malaysia. The  program includes keynotes by industry leaders and university experts, tutorials by experts, over 60 technical presentations, and informal networking meetings. ASQED 2012 proceedings are published by the IEEE on the Read More → "4th Asia Symposium on Quality Electronic Design (ASQED) Announces Extended Call for Papers; Convenes July 10-11, Penang, Malaysia"

Introducing 8-pole Brad® Micro-Change® M12 Circular Hybrid Technology (CHT) Connectors

LISLE, IL –April 19, 2012 –  Molex Incorporated expands its innovative Brad® Micro-Change® M12 Circular Hybrid Technology (CHT) Connector System with the addition of a new 8-pole (4+4) connector featuring two Cat5e twisted-pair data lines and four power lines capable of carrying up to 6.0 Amps.  Combining power and data lines into one connector, the Brad … Read More → "Introducing 8-pole Brad® Micro-Change® M12 Circular Hybrid Technology (CHT) Connectors"

Atmel Launches Low-Power, Secure AES-128-based Transponder for Car Key Fob Applications

Heilbronn, Germany, April 18, 2012— Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, today announced the availability of a new secure, ultra-low-power micromodule transponder based on an Atmel AVR® microcontroller (MCU). Used for remote keyless entry systems in vehicles, the ATA5580 transponder includes the Atmel open immobilizer protocol stack with a built-in, high-performance AES-128 hardware cryptographic unit, a low-frequency (LF) immobilizer interface for power supply and bi-directional communication, and an LF antenna. The ATA5580 standalone immobilizer transponder is intended to be over-molded in simple mechanical keys which are usually accompanying full featured remote keyless … Read More → "Atmel Launches Low-Power, Secure AES-128-based Transponder for Car Key Fob Applications"

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