News – Page 2050 – EEJournal

Cree Technology Breakthrough Enables 50 Amp Silicon Carbide Power Devices, Bringing Efficiency and Cost Savings to a Broader Range of High-Power Applications

May 3, 2012

DURHAM, N.C.–(BUSINESS WIRE)– In a breakthrough that redefines performance and energy efficiency in high-power applications, Cree, Inc. (Nasdaq: CREE) announces a new family of 50A Silicon Carbide (SiC) devices, including the industry’s first 1700V Z-FETT SiC MOSFET. These new 50A SiC devices, which also include a 1200V Z-FET SiC MOSFET and three Z-RecR SiC Schottky diodes, will enable a new generation of power systems with record-setting energy efficiency and lower cost of ownership than with conventional technologies.

Energy Efficient “Green Transformers” Now Available from Transonics

May 3, 2012

Transonics plc the London based leading supplier of electronic components and logistics solutions, announces the availability of the Thai Lin EI30 encapsulated power transformer range which meets the requirements of the forthcoming EU legislation for Energy Related Products (ERP).

From 2013 all small power products for use in the European Union will need to meet these new energy saving regulations which require stand-by power to be 0.5W or lower. The Thai Lin EI30 encapsulated power transformer range is available now for designers to ensure their next generation products meet the new legislative requirements.

All products which … Read More → "Energy Efficient “Green Transformers” Now Available from Transonics"

CUI Introduces Medical External Power Supplies

May 3, 2012

TUALATIN, Ore. – May 1, 2012 – CUI Inc announced a release of its first high efficiency medical external power supplies. Offerings include both multi-blade wall adapters and desktop adapters. All units meet Level V efficiencies and come with UL/cUL and TUV 60601-1 safety certifications.

The flexible EMMA multi-blade adapter series is designed for global use and comes standard with interchangeable blades for operation in North America, Europe, the United Kingdom, and Australia. It is offered in Read More → "CUI Introduces Medical External Power Supplies"

VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91

May 3, 2012

Taipei, Taiwan, May 3, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84mm x 55mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA EdenTM X2 dual core processor and … Read More → "VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91"

Imec demonstrates a low-power 7Gbps 60GHz transceiver for the wireless consumer market

May 3, 2012

Leuven (Belgium) – May 2, 2012 – Imec, in collaboration with Panasonic, has developed a prototype of a 60GHz radio transceiver allowing to reach data rates of 7Gbps over short distances at very low power consumption. The chip achieves this performance over the 4 channels specified by the IEEE802.11ad standard. Imec’s low-power 60GHz solution is an important step towards adoption of 60GHz technology in low-cost battery-operated consumer products such as smart phones and tablets.

Today’s wireless consumer electronic products increasingly include data-intensive applications, while applications below 10GHz such as WLAN face spectrum scarcity. This drives wireless system designers to … Read More → "Imec demonstrates a low-power 7Gbps 60GHz transceiver for the wireless consumer market"

eASIC Enables 3X Increase In Energy Efficiency For Astrophysical Simulation Supercomputer

May 3, 2012

SANTA CLARA, CA, – May 2nd, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations. By leveraging eASIC’s low power Nextreme-2 NEW ASIC devices, Tokyo Institute of Technology was able to achieve an energy efficiency ratio of 6.5 GFLOPS/Watt for its GRAPE-8 super computer.

The key component in achieving the highest energy efficiency ratio for the GRAPE-8 system is the use of eASIC’s Nextreme-2 NEW ASIC devices, … Read More → "eASIC Enables 3X Increase In Energy Efficiency For Astrophysical Simulation Supercomputer"

Tektronix Enhances Optical Modulation Analysis Solution

May 2, 2012

BEAVERTON, Ore. – April 30, 2012 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that its OM4000 Series Optical Modulation Analyzer can now drive the DSA8300 Digital Sampling Oscilloscope to perform analysis on PM-QPSK, QAM, and other complex-modulation signals with higher vertical resolution than real-time based solutions at lower total system cost.

With this enhancement to the OM4000, Tektronix is giving optical networking designers and manufacturers the flexibility to choose between real-time and equivalent-time acquisition … Read More → "Tektronix Enhances Optical Modulation Analysis Solution"

Agilent Technologies Introduces 6-GHz Signal Generators with Industry-Best Performance

May 2, 2012

SANTA CLARA, Calif., May 1, 2012 – Agilent Technologies Inc. (NYSE: A) today announced four new X-Series signal generators that provide unmatched performance in phase noise, output power, ACPR, EVM and bandwidth. With these capabilities, Agilent’s new MXG and EXG products (available in analog and vector models) support the development of components and receivers that meet the complex challenges of mitigating interference, speeding data throughput and increasing signal quality in applications such as radar, military communications and consumer wireless.

Today’s aerospace/defense environment requires enhanced radar … Read More → "Agilent Technologies Introduces 6-GHz Signal Generators with Industry-Best Performance"

Opto-Isolated Digital I/O Signal Conditioning Boards for Small Form Factor Embedded Computer Systems

May 2, 2012

May 1, 2012, Arlington, TX – WinSystems introduces today two new optically isolated signal conditioning and termination boards for OEM embedded computer system designers. These boards are needed in applications requiring signal isolation between a computer and its monitoring points. Isolation creates a barrier which will eliminate common mode voltage and also prevents ground loops on digital signals plus provides safety for industrial applications. The ISM-TRM-ISO-IN provides 24 lines of optically isolated and digitally debounced inputs to provide easy connections and signal conditioning from field wiring. The ISM-TRM-ISO-OUT provides 24 lines of optically isolated outputs. … Read More → "Opto-Isolated Digital I/O Signal Conditioning Boards for Small Form Factor Embedded Computer Systems"

RF Micro Devices® Unveils rGaN-HV™ Process Technology For Power Device Products And Foundry Customers

May 2, 2012

GREENSBORO, N.C., April 26, 2012 — RF Micro Devices, Inc. (Nasdaq GS:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the extension of RFMD’s industry-leading GaN process technology portfolio to include a new technology optimized for high voltage power devices in power conversion applications.

RFMD’s newest GaN process technology – rGaN-HV™ — enables substantial system cost and energy savings in power conversion applications ranging from 1 to 50 KW. RFMD’s rGaN-HV delivers device breakdown voltages up to 900 volts, high peak current capability, and ultra-fast switching times for GaN … Read More → "RF Micro Devices® Unveils rGaN-HV™ Process Technology For Power Device Products And Foundry Customers"

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