News – Page 2045 – EEJournal

Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion® cSoCs

April 11, 2012

ALISO VIEJO, Calif.—April 11, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its SmartFusion® customizable system-on-chip (cSoC) devices are now fully screened to meet stringent military operating temperatures ranging from -55 degrees C to 125 degrees C. The devices feature an integrated ARM® Cortex™-M3-based processor and are fully tested for operation at military temperature ranges, targeting applications where ensuring high-reliability performance is critical. These include avionics systems and missiles, as well as unmanned and weaponry systems which must continuously and reliably … Read More → "Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion® cSoCs"

Increased Security and Reliability Needed to Grow Wireless Sensor Network Market, Despite Energy Harvesting Breakthroughs

April 11, 2012

NEW YORK (GBI Research), 11 April 2012 – Maintaining the security and reliability of Wireless Sensor Networks (WSNs) will be crucial to the success of these technologies in high-risk fields such as medical devices, defense and natural disaster monitoring, despite new breakthroughs in energy harvesting techniques, a new report by semiconductor expert GBI Research has found.

The new report* found that while new energy harvesting technologies have encouraged the adoption of WSNs due to the attainment of greatly improved energy sources, manufacturers must continue to make improvements to enhance security and reduce the risk … Read More → "Increased Security and Reliability Needed to Grow Wireless Sensor Network Market, Despite Energy Harvesting Breakthroughs"

Registration Opens for Microchip’s 16th Annual Worldwide MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers

April 11, 2012

CHANDLER, Ariz., April 11, 2012 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions,today announced it is accepting registrations for its 16th annual Worldwide MASTERs Conference at the JW Marriott Desert Ridge Resort in Phoenix, Arizona, with the Main Conference taking place from August 8 – 11, and a Pre-Conference on August 6 and 7, 2012. Online registration and information is available at http://www.microchip. … Read More → "Registration Opens for Microchip’s 16th Annual Worldwide MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers"

Agilent Technologies Announces Industry’s Most Cost-Effective PCI Express® 3.0 Flying Lead Probe

April 10, 2012

SANTA CLARA, Calif., April 5, 2012 – Agilent Technologies Inc. (NYSE: A) today announced a new flying lead solder-down probe for PCI Express 3.0 protocol analysis. The new U4324A probe, for use with Agilent’s U4301A protocol analyzer module, is the industry’s most cost-effective solder-down probing solution.

“The PCI Express flying lead probe is designed for simplicity, flexibility and low cost,” said Rob Vezina, a PCI Express product marketing engineer at Agilent. “It cleanly captures 8.0 GT/s traces from the device under test while it eliminates the … Read More → "Agilent Technologies Announces Industry’s Most Cost-Effective PCI Express® 3.0 Flying Lead Probe"

Engineers and electronics buyers to benefit from major website improvements at Newark element14

April 10, 2012

CHICAGO – April 10, 2012 – Newark element14, a business of Premier Farnell (LSE:pfl) and the leading distributor of electronic components and engineering solutions in the Americas, announced today a rollout of key search improvements as part of a major initiative to provide engineering and procurement professionals with an industry-leading online experience.

Some of the highlights of the website … Read More → "Engineers and electronics buyers to benefit from major website improvements at Newark element14"

Oasys Design Systems Closes Series B Funding With Investments From Intel Capital, Xilinx

April 10, 2012

SANTA CLARA, CALIF. –– April 10, 2012 — Oasys Design Systems, a provider of chip design software, today announced it has closed Series B Funding with investments from Intel Capital, Intel’s global investment organization, and& … Read More → "Oasys Design Systems Closes Series B Funding With Investments From Intel Capital, Xilinx"

Molex Modular NeoScaleTM Mezzanine Interconnect Delivers Optimal Signal Integrity at 28+ Gbps

April 10, 2012

LISLE, IL –April 10, 2012 – Molex Incorporated has launched a new modular NeoScale^TM mezzanine interconnect system capable of achieving optimal signal integrity at data rates of 28+ Gbps. Designed for printed circuit board (PCB) mezzanine applications in enterprise networking towers and telecommunication hubs and servers, in addition to industrial controllers and medical and military high data-rate scanning equipment, the NeoScale mezzanine interconnect features a patent-pending triad wafer configuration that … Read More → "Molex Modular NeoScaleTM Mezzanine Interconnect Delivers Optimal Signal Integrity at 28+ Gbps"

Renesas Electronics Introduces Low-Loss, Ultra Miniature Power MOSFETs for Improved Power Efficiency, Smaller Form Factor in Portable Devices

April 10, 2012

Dusseldorf, April 10, 2012 – Renesas Electronics , a premier provider of advanced semiconductor solutions, today announced the availability of eight new low-loss P- and N-channel power metal-oxide-semiconductor field-effect-transistor (MOSFET) products optimized for use in portable electronics including smartphones and tablets. Featuring industry-leading low loss (low on-resistance), the new devices include the 20 V (VDSS) µPA2600 and the 30 V µPA2601, equipped in ultra compact 2 mm × 2 mm packages to deliver increased power efficiency and miniaturization within smaller mobile device form factors.

With the increasing … Read More → "Renesas Electronics Introduces Low-Loss, Ultra Miniature Power MOSFETs for Improved Power Efficiency, Smaller Form Factor in Portable Devices"

Imec’s resistive RAM research shows momentum in 2012 VLSI Technology Symposium papers

April 10, 2012

Leuven (Belgium) – April 10, 2012 – At this year’s Symposia on VLSI Technology and VLSI Circuits (June 12-15, 2012 – Honolulu, USA,), imec and its partners will present 10 papers on memory and logic scaling technology and circuits. With 4 RRAM (resistive RAM) papers accepted, the VLSI reviewing committee endorses the value of imec’s R&D program on emerging memory devices. And 5 papers will address logic device scaling and characterization for next-generation CMOS technologies. This confirms imec’s leading global position as R&D center in CMOS scaling technologies. Besides, imec and its partners will also … Read More → "Imec’s resistive RAM research shows momentum in 2012 VLSI Technology Symposium papers"

Cadence Low-Power, Advanced-Node Digital Technology Incorporated Into SMIC 40nm Reference Flow

April 10, 2012

SAN JOSE, CA–(Marketwire – April 10, 2012) – The SMIC-Cadence flow automates designs with advanced power management features. This production-proven methodology is fully incorporated across the complete and integrated Cadence RTL to GDSII flow, which includes Encounter RTL Compiler, Encounter Conformal Low Power, Encounter Digital Implementation System, Encounter Timing System, Encounter Power System, Cadence QRC, Cadence CMP Predictor and Cadence Physical Verification System.Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Low-Power, Advanced-Node Digital Technology Incorporated Into SMIC 40nm Reference Flow"