News – Page 2037 – EEJournal

Mouser Electronics Takes Lead in Environmental Sustainability and Distribution of Green Technologies

April 25, 2012

April 23, 2012 – Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today underscores its commitment to responsible environmental practices. Mouser stocks an expansive inventory of the industry’s latest green technologies, including leading-edge solar, thermal and RF-based energy harvesting products and ultra-low power MCUs.

The design-fulfillment distributor won the prestigious “Contribution to Sustainability” e-Legacy Award, thanks to anenvironmental … Read More → "Mouser Electronics Takes Lead in Environmental Sustainability and Distribution of Green Technologies"

Xilinx Unveils the Vivado Design Suite for the Next Decade Of ‘All Programmable’ Devices

April 25, 2012

SAN JOSE, Calif., April 24, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced the Vivado™ Design Suite, a new IP and system-centric design environment built from the ground up to accelerate design productivity for the next decade of ‘All Programmable’ Devices. Vivado tools not only speed the design of programmable logic and I/O, but accelerate programmable systems integration and implementation into devices incorporating 3D stacked silicon interconnect technology, ARM® processing systems, Analog Mixed Signal (AMS), and a significant percentage of semiconductor intellectual property (IP) cores. With up to a 4X productivity advantage over competing development environments, the Vivado … Read More → "Xilinx Unveils the Vivado Design Suite for the Next Decade Of ‘All Programmable’ Devices"

GainSpan Reference Design Code for TI MSP430™ Offers Easy Wi-Fi Connectivity and Access to Extended Capabilities

April 25, 2012

SAN JOSE, Calif., April 25, 2012 /PRNewswire/ — GainSpan® Corporation, a leader in low power embedded Wi-Fi and Wi-Fi connectivity for the Internet of Things, today introduced reference design code for Texas Instruments’ MSP430 that significantly reduces the development time to add Wi-Fi connectivity to embedded systems based upon this microcontroller (MCU). This new code makes it possible for designers to rapidly develop their application on the MSP430 and easily communicate with a GainSpan Wi-Fi … Read More → "GainSpan Reference Design Code for TI MSP430™ Offers Easy Wi-Fi Connectivity and Access to Extended Capabilities"

Synopsys Extends HAPS Debug Visibility by 100X

April 25, 2012

MOUNTAIN VIEW, Calif., April 25, 2012 —

Highlights

Combination of new Synopsys HAPS hardware and Identify software enables greater visibility of internal signals in FPGA-based prototypes to accelerate SoC design debug
New release provides approximately 100X more storage capacity for signal traces with sample speeds up to 60 MHz
Utilization of FPGA memory resources significantly reduced to better accommodate complex SoC prototyping projects

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today … Read More → "Synopsys Extends HAPS Debug Visibility by 100X"

Achronix New Speedster22i FPGAs Hit The Target!

April 23, 2012

SANTA CLARA, Calif., April 24, 2012 /PRNewswire/ — Achronix Semiconductor Corp. today announced the details of the Speedster22i HD and HP product families, the first FPGAs to be built on the Intel 22nm technology process. Speedster22i FPGAs are the industry’s only application targeted, high-end FPGAs and consume half the power at half the cost of 28nm, high-end FPGAs.

Speedster22i devices are the first FPGAs to include integrated end-to-end, hard IP protocol functions targeted for communications and test applications. The Speedster22i hard IP includes the entire I/O protocol stack for 10/40/100 Gigabit Ethernet, Interlaken, PCI Express … Read More → "Achronix New Speedster22i FPGAs Hit The Target!"

Mercury Computer Systems Launches High Performance, Low Power OpenVPX Products Based on 3rd Generation Intel® Core™ Processor for Defense and Aerospace Applications

April 23, 2012

CHELMSFORD, Mass. ? April 23, 2012 ? Mercury Computer Systems Inc. (NASDAQ: MRCY, www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, announced the Ensemble® Series 6U OpenVPX™ LDS6524 and the 3U OpenVPX SBC3512 modules based on the 22 nanometer 3rd generation Intel® Core™ processor family (formerly codenamed “Ivy Bridge”). Utilizing the quad-core Intel® Core™ i7-3615QE processor for the LDS6524 and the quad-core Intel® Core™ i7-3612QE processor for the SBC3512, the new OpenVPX modules deliver greatly improved performance per watt, a key … Read More → "Mercury Computer Systems Launches High Performance, Low Power OpenVPX Products Based on 3rd Generation Intel® Core™ Processor for Defense and Aerospace Applications"

LSI Expands Axxia Communication Processor Portfolio to Accelerate Enterprise and Cloud Datacenter Networks

April 23, 2012

MILPITAS, Calif., April 23, 2012 – LSI Corporation (NYSE: LSI) today introduced the AXE2502 Axxia^®communication processor, designed to accelerate networking in enterprise and cloud datacenters. The AXE2502 processor offloads complex networking tasks from servers and networking equipment, improving performance and reducing power consumption.

The growth in cloud services driven by demand for mobile broadband and dynamic, flexible enterprise IT is straining the ability of datacenter networking equipment to keep up. Designed for enterprise networking equipment such as switching and routing line cards, … Read More → "LSI Expands Axxia Communication Processor Portfolio to Accelerate Enterprise and Cloud Datacenter Networks"

Mouser Brings the Future In Touch with Launch of New Touch Technology PKC Training Site

April 23, 2012

April 23, 2012 – Mouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, has unveiled its new Read More → "Mouser Brings the Future In Touch with Launch of New Touch Technology PKC Training Site"

KLA-Tencor Announces New CIRCLTM Suite

April 23, 2012

MILPITAS, Calif., April 23, 2012 – Today KLA-Tencor Corporation (NASDAQ: KLAC), announced a new, high-throughput defect inspection / metrology / review system for leading-edge chip manufacturers: the CIRCL^TM suite. Designed for operation in lithography, outgoing quality control (OQC) and other process modules, this new cluster tool monitors the front side, back side and edge of the wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity and macro overlay error. Data collection is governed by DirectedSampling^TM, an innovative approach … Read More → "KLA-Tencor Announces New CIRCLTM Suite"

Tensilica Adds Support for Dynamic Resolution Adaptation Audio Standard to HiFi Audio DSP Library

April 23, 2012

Santa Clara, CA USA – April 23, 2012 – Tensilica®, Inc. today announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its library of over 100 audio encoders, decoders and sound enhancement packages for its popular HiFi Audio DSP (digital signal processor) family. Now all products that include the HiFi Audio DSPs can be used to support the standard approved by the People’s Republic of China as the National Audio Standard (GB/T 22726-2008) for multi-channel audio decoding. Tensilica has delivered the HiFi DRA decoder to a number of Tier 1 system OEMs and semiconductor companies.

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