News – Page 2036 – EEJournal

ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges

May 30, 2012

ANSYS (NASDAQ: ANSS) subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics at the Design Automation Conference (DAC).

Where: Design Automation Conference, Moscone Convention Center, San Francisco, CA, Booth #1813

When: Monday, June 3 through Wednesday, June 6, from 9:00 a.m. to 6:00 p.m.

What: Meet with Apache, its customers, and partners at DAC to hear leading companies … Read More → "ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges"

Atmel First to Achieve Certification for ZigBee Light Link, Golden Units for Lighting Reference Implementation

May 30, 2012

San Jose, CA, May 30, 2012 – Atmel® Corporation (Nasdaq: ATML), a leader in microcontroller (MCU) and touch solutions, today announced it is one of the first companies to achieve ZigBee® Certified product status using ZigBee Light Link™ Certification, a new industry standard to accelerate the design of easy-to-use consumer lighting and control products that will give consumers the ability to wirelessly control their LED fixtures, light bulbs, timers, remotes and switches within their homes.

With this reference implementation for ZigBee Light Link, Atmel has achieved ‘golden unit’ status, making it the benchmark against which future ZigBee … Read More → "Atmel First to Achieve Certification for ZigBee Light Link, Golden Units for Lighting Reference Implementation"

65V, 500mA Synchronous Buck Converter Delivers 90% Efficiency & Requires Only 12µA Quiescent Current

May 30, 2012

MILPITAS, CA – May 30, 2012 – Linear Technology announces the LTC3630, a 65V input-capable synchronous buck converter, which delivers up to 500mA of continuous output current from a 16-lead thermally enhanced 3mm x 5mm DFN or MSOP package. Its internal synchronous rectification topology delivers efficiencies as high as 90% and its Burst Mode® operation requires only 12µA of quiescent current (at no load), maximizing battery run time. The LTC3630 operates … Read More → "65V, 500mA Synchronous Buck Converter Delivers 90% Efficiency & Requires Only 12µA Quiescent Current"

Eurotech Simplifies the Internet of Things (IoT), Connecting Devices and Managing Data with Everyware Cloud(tm) 2.0

May 30, 2012

Columbia, MD – May 30, 2012 – Eurotech, a leading supplier of embedded technologies, products and systems, today announces the launch of the Everyware Cloud 2.0 platform providing a foundation to deliver and manage M2M data within the business enterprise. The Everyware Cloud offers proven cloud, M2M and Internet of Things (IoT) technologies to enable clients in the transportation, logistics, and industrial markets to reach their business goals.

“The intersection of three disciplines, device development tools, cloud services, and network infrastructure, creates an … Read More → "Eurotech Simplifies the Internet of Things (IoT), Connecting Devices and Managing Data with Everyware Cloud(tm) 2.0"

Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements

May 30, 2012

WILSONVILLE, Ore., May 30, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced TSMC will use the Calibre® SmartFill solution to achieve TSMC’s fill requirements for its 20nm manufacturing processes. SmartFill analysis and automatic filling capabilities in the Calibre YieldEnhancer product address new 20nm fill requirements that cannot be achieved with traditional dummy fill approaches. The Calibre SmartFill solution delivers smaller post-fill GDS database size and faster runtimes, allowing designers to meet IC fill constraints in a single pass without manual customization or modification, and with minimal impact on circuit performance.

New Capabilities for Advanced Fill … Read More → "Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements"

XP Power release 15 Watt DIP24 DC-DC Converters with either 2:1 or 4:1 input ranges

May 30, 2012

XP Power today announced two new families to their line-up of ultra compact metal cased 15 Watt DC-DC converters. Available in an industry standard 24 pin DIP measuring just 1.25 x 0.8 x 0.4 inches (31.75 x 20.32 x 10.16 mm), the JCG15 and JTF15 series offer a power density of up to 37.5 Watts per cubic inch with an efficiency of up to 91%. Their compact size conserves board space, and the highly efficient design results in less wasted heat, assisting in the thermal management of the end system.

Providing the popular nominal inputs of + 12, + 24 or +48 VDC, the JCG15 series accommodates wide 2:1 input … Read More → "XP Power release 15 Watt DIP24 DC-DC Converters with either 2:1 or 4:1 input ranges"

Avnet Abacus partners with Cymbet to showcase new energy harvesting applications at first Elektronik Energy Harvesting Congress

May 30, 2012

Poing, Germany 30 May, 2012: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors, will be showcasing a variety of innovative energy harvesting technologies at the inaugural Elektronik Energy Harvesting Congress, which is to be held in Munich, Germany, on 4th and 5th July, 2012.

The distributor will be hosting a series of demonstrations based on Cymbet EnerChip™ energy harvesting (EH) evaluation kits, which have been developed for a wide range of applications. The demonstrations will highlight technologies such as flexible photovoltaic cells; vibration-based energy harvesting using a piezoelectric transducer; and a real-time-clock … Read More → "Avnet Abacus partners with Cymbet to showcase new energy harvesting applications at first Elektronik Energy Harvesting Congress"

Crystal Instruments Spider-81 Vibration Control System Offers Industry Exclusive 130 dB Dynamic Range and Wi-Fi enabled PDA or iPad Operation

May 30, 2012

May 29, 2012, Santa Clara, California, USA – Crystal Instruments Corporation (CI) (www.go-ci.com) a global leader in the design, manufacture and supply of high-reliability instrumentation and software for sound and vibration test, measurement, and control, has introduced its Spider-81, a highly modular, distributed, scalable vibration control system with centralized DSP architecture and simple operation via PC, Wi-Fi enabled PDA or iPad.

Unlike traditional controllers that rely heavily on an external PC for real-time operation, Spider-81 is the first controller to directly integrate time-synchronized Ethernet connectivity with an embedded DSP centralized architecture. Its patented dual A/D … Read More → "Crystal Instruments Spider-81 Vibration Control System Offers Industry Exclusive 130 dB Dynamic Range and Wi-Fi enabled PDA or iPad Operation"

Vincotech introduce the flyerIPM – P520 for Decentralized Motor Drive Applications

May 30, 2012

May 30th 2012 – The increasing demand for decentralized motor drives in factory automation makes the new requirements for the implemented inverters in general and for the power section in particular more and more evident. The article will illuminate the reasons for the shift towards decentralized motor drives in factory automation, the special requisitions this implicates for the drive as well as its power section. It shows on a real example how to achieve these additional demands with a highly integrated intelligent power module from Vincotech.

The growing trend … Read More → "Vincotech introduce the flyerIPM – P520 for Decentralized Motor Drive Applications"

Maxim’s High-Density QAM Modulator Chipset Enables the Next-Generation Connected Home Experience

May 30, 2012

Sunnyvale, CA–May 29, 2012–Maxim Integrated Products, Inc. (NASDAQ: MXIM) announces a new high-density, wideband, scalable QAM modulator chipset: the MAX5880 digital upconverter (DUC) andMAX5882 RF digital-to-analog converter (RF DAC).

The MAX5880/MAX5882 delivers up to 32 times more broadband cable capacity per RF port compared to a conventional analog upconverter, and saves up to 93% in power dissipation per QAM (quadrature amplitude modulation) channel. The QAM modulator chipset performance exceeds Cable Labs® DOCSIS® 3.0 RF specifications.

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