News – Page 2031 – EEJournal

Premier Farnell extends its ARM relationship with the launch of two ARM Cortex-M processor-based STM32 series Development Kits

June 7, 2012

6^th June 2012 – London, Premier Farnell [LON:PFL], a leader in global electronics distribution and design solutions, has today announced it is to extend its relationship withARM through the launch of the latest series of ARM Cortex^™-M3 and Cortex–M4 processor-based STM32F2xx and STM32F4xx Development Kits across its distribution footprint in EMEA, … Read More → "Premier Farnell extends its ARM relationship with the launch of two ARM Cortex-M processor-based STM32 series Development Kits"

Lattice Ships First Samples Of Low Cost, Low Power LatticeECP4 FPGAs

June 6, 2012

HILLSBORO, OR – JUNE 6, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that it has begun shipping the highest density member of its next generation LatticeECP4™ FPGA family to select customers. The new LatticeECP4 FPGA family offers the richest portfolio of low cost, low power mid-range devices under 200K LUTs, with high performance innovations such as 6G SERDES in low cost packages, powerful DSP blocks and built-in hard IP-based communication blocks. The highest density device in the family, the LatticeECP4-190, features 183K LUTs, 480 double data rate DSP multipliers (18×18), 5.8 Mbits … Read More → "Lattice Ships First Samples Of Low Cost, Low Power LatticeECP4 FPGAs"

LPRS to launch new Connect2 Development Kit for eRA Wireless Modules at Fortronic UK Wireless Forum

June 6, 2012

LPRS, Europe’s leading supplier of short-range radio devices, is using their appearance at the 2012 Fortronic UK Wireless Forum to launch theConnect2 development kit for their market leading eRA (easyRadioAdvanced) short range wireless modules.

The Fortronic RF & Wireless Design one day conference is the UK’s only technically focused forum specifically dedicated to w</ … Read More → "LPRS to launch new Connect2 Development Kit for eRA Wireless Modules at Fortronic UK Wireless Forum"

RFHA1006 225MHz to 1215MHz, 9W GaN Wideband Power Amplifier

June 6, 2012

RFMD’s new RFHA1006 is a wideband Power Amplifier designed for CW and pulsed applications such as wireless infrastructure, RADAR, two-way radios and general purpose amplification. Using an advanced high power density Gallium Nitride (GaN) semiconductor process, these high-performance amplifiers achieve high efficiency, flat gain, and large instantaneous bandwidth in a single amplifier design. This input-matched GaN transistor is packaged in an air cavity ceramic package for excellent thermal stability through the use of advanced heat sink and power dissipation technologies. Ease of integration is accomplished through the incorporation of optimized input matching network within the package that … Read More → "RFHA1006 225MHz to 1215MHz, 9W GaN Wideband Power Amplifier"

DSM Computer integrates the Intel® AIM Suite in its industrial displays

June 6, 2012

Munich, April 2012 – In close cooperation with Intel, DSM Computer has integrated the Intel® AIM Suite Web-based software in its large-area industrial displays. The Intel® AIM Suite is used for the anonymized detection and analysis of the screen observer’s eye contact. An industrial display system with 140 cm (55 inch) diagonal, integrated camera and a built-in PC platform with the Intel® QM67 chipset and the Intel® Core™ i5-2710QE processor specially … Read More → "DSM Computer integrates the Intel® AIM Suite in its industrial displays"

IAR Systems provides outstanding performance and feature enhancements for Renesas RX

June 6, 2012

Uppsala, Sweden—June 5, 2012—Today, IAR Systems® announces a new version of its high-performing development tool suite for Renesas RX microcontrollers. IAR Embedded Workbench® for RX version 2.40 brings highly improved optimizations and also introduces a new text editor and source browser.

Thanks to its best-in-class optimizations and user-friendly features, IAR Embedded Workbench has proven to be the tool suite of choice for many Renesas RX developers. This release further strengthens this offer by delivering even higher performance and ease-of-use. The IAR C/C++ Compiler™ for RX has been tuned to produce even better optimized … Read More → "IAR Systems provides outstanding performance and feature enhancements for Renesas RX"

Synopsys and Samsung Deliver a Complete Solution for 20-Nanometer Node

June 5, 2012

MOUNTAIN VIEW, Calif., June 4, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq:SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems today announced the availability of a complete solution to enable engineers to develop state-of-the-art System-on-Chip (SoC) designs at Samsung’s advanced 20-nanometer (nm) process geometry. The delivery of the solution is built on many years of close collaboration between Samsung Electronics and Synopsys R&D teams, including the tapeout of the first 20-nm chip based on Samsung’s High-k metal gate process technology. The double-patterning enabled solution includes Synopsys’ IC … Read More → "Synopsys and Samsung Deliver a Complete Solution for 20-Nanometer Node"

ams’ analog/mixed-signal foundry extends its customized IC test solution service

June 5, 2012

Unterpremstaetten, Austria (June 5, 2012), The Full Service Foundry business unit of ams (SIX: AMS) today announced an extension of its dedicated test solutions for its customers. This move is an extension of the company’s ”More Than Silicon” initiative, under which ams provides a package of intellectual property, cell libraries, consultancy and testing services to help customers successfully develop advanced analog and mixed-signal circuit designs based on its specialty technologies.

Foundry customers using ams’ IC test solution service will receive KGD (known good dies) and instantly gain the benefit of zero yield risk, as their complex analog/mixed-signal … Read More → "ams’ analog/mixed-signal foundry extends its customized IC test solution service"

Samsung and Cadence Deliver 20nm Digital Design Methodology

June 5, 2012

DAC Booth # 1930 — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Samsung Electronics and Cadence have collaborated to deliver a 20-nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration between Cadence and Samsung brings new process advances for mobile consumer electronics, enabling design at 20 nanometers and future process nodes.

“With our focus on mobile consumer electronics, we needed a more efficient way to … Read More → "Samsung and Cadence Deliver 20nm Digital Design Methodology"

Parasoft Extends C and C++ Embedded Testing Support for Green Hills Software MULTI IDE

June 5, 2012

MONROVIA, CA and SANTA BARBARA, CA — June 5, 2012 — Parasoft Corporation, leader in helping organizations define and deliver defect-free software efficiently, and Green Hills Software, the worldwide leader in high assurance operating systems, announced today that Parasoft C/C++test, the industry’s most comprehensive testing solution for C and C++ development, now supports additional Green Hills Software MULTI® environments.

The latest release extends C/C++test’s integrated testing capabilities to embedded software engineers working with Green Hills MULTI compilers for V800, V850, and Linux x86 native. Green Hills MULTI users gain easy access to … Read More → "Parasoft Extends C and C++ Embedded Testing Support for Green Hills Software MULTI IDE"