News – Page 2021 – EEJournal

MOSIS to offer highly efficient Cortus APS3R microcontroller core to System on Chip (SoC) designers

May 24, 2012

Montpellier, France and Marina del Rey, California, 24th May 2012. Cortus, a technology leader in ultra low power, silicon efficient 32-bit processor IP and MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, announced the signing of a sales representative agreement. Under the agreement, MOSIS will offer the Cortus APS3R and associated peripherals to their customers. The deal will support the licensing of Cortus IP from design through prototyping to volume production with MOSIS.

Today’s embedded SoC applications such as short range wireless communication, video processing, touchscreen displays, … Read More → "MOSIS to offer highly efficient Cortus APS3R microcontroller core to System on Chip (SoC) designers"

Uniquify Launches ideas2silicon Design Services Platform

May 24, 2012

SANTA CLARA, CALIF. –– May 24, 2012 –– Uniquify (www.uniquify.com) today launched ideas2silicon™, a new and comprehensive design services platform that spans chip specification and design through volume delivery of packaged and tested parts.

ideas2silicon turns the model upside down by offering faster turnaround, lower costs and a transparent business model that gives project teams complete visibility into the cost structure. “The traditional ‘turnkey’ model is not working and we’re doing something about it,” says Josh … Read More → "Uniquify Launches ideas2silicon Design Services Platform"

Mentor DFM Analysis Service Delivers Calibre Litho Checks for TSMC 40nm and 28nm Customers

May 24, 2012

WILSONVILLE, Ore., May 24, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of a new DFM Analysis Service based on the Calibre® platform for TSMC 40nm and 28nm foundry customers. The service analyzes the customer’s design database in accordance with TSMC’s lithography process checking (LPC) flow. It then delivers a results database with hotspot locations and fixing hints that routers can use to perform corrections. This DFM approach is an attractive alternative for designers taping out relatively few advanced node devices per year.

“LPC checking identifies hotspots before designers commit to tape-out,” … Read More → "Mentor DFM Analysis Service Delivers Calibre Litho Checks for TSMC 40nm and 28nm Customers"

Renesas Electronics Expands Low-Power 32-Bit RX200 Microcontroller Series Offering Scalable Lineup for Portable Consumer and Industrial Devices

May 24, 2012

Dusseldorf, May 24, 2012 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today expanded its RX200 Series of low-power mid-range microcontrollers (MCUs), introducing the RX220 Group of 11 entry-level devices to provide greater scalability for embedded designers moving from 8- and 16-bit to 32-bit applications. Based on the RX CPU core, the new RX220 general-purpose MCUs offer a combination of high performance and low power consumption for cost-conscious consumer and industrial applications, including electric household appliances, smartphones and digital cameras, industrial equipment, and measuring devices.

Xilinx Returns to DAC Asking – Why ASIC When You Can Go All Programmable?

May 23, 2012

SAN JOSE, Calif., May 23, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at the Design Automation Conference (DAC) in San Francisco from June 3 – 7, 2012, including its first booth exhibition in 11-years where the new Vivado™ Design Suite will be showcased. As the costs and risks associated with application-specific devices can only be justified for a short list of ultra-high volume commodity products, programmable platforms have become the only viable means for meeting increasingly stringent product requirements – cost, power, performance, and … Read More → "Xilinx Returns to DAC Asking – Why ASIC When You Can Go All Programmable?"

TI speeds data rates in highly-loaded CAN networks with new transceivers

May 23, 2012

DALLAS (May 23, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a family of turbo CAN transceivers designed for data rates in excess of 1 Mbps, meeting the growing demand for more nodes and greater data transmission length in today’s industrial CAN networks. The SN65HVD255 and SN65HVD256 devices offer short propagation delay and fast loop times to support higher data rates and deliver more timing margin in these systems. These devices continue TI’s CAN innovation and provide a next-generation design path from the SN65HVD251 and SN65HVD1050 transceivers.

The SN65HVD255 and SN65HVD256 … Read More → "TI speeds data rates in highly-loaded CAN networks with new transceivers"

Avnet Abacus expands battery power and interconnection range

May 23, 2012

Poing, Germany, 23rd May, 2012: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors, has expanded its offering of accessories for lithium coin cells. To complement its existing range of Varta and Panasonic coin cells the company has added a new range of coin cell battery holders from Harwin.

The new Harwin S82xxR and S84xxR battery holders are highly reliable receptacles suitable for use with any 12.0mm and 20.0mm coin cell battery. With horizontal and vertical insertion options, they combine secure cell retention with quick and easy insertion and … Read More → "Avnet Abacus expands battery power and interconnection range"

Pulsic to Introduce Place and Route Implementation Solution for Analog and Custom Digital Design at DAC 2012

May 23, 2012

SAN JOSE, CALIF., May 22, 2012 — Following up on the Pulsic Planning Solution™ products introduced last year at DAC, Pulsic, the premier provider of physical design tools for precision design automation, will introduce a place-and-route implementation solution at DAC 2012 in San Francisco. The Pulsic Implementation Solution™ builds on the work of the planning tools, providing designers with easy-to-use, guided flows to automatically implement precise, hand-crafted quality design layouts with the highest routing completion and accuracy on the market..

The products of the Pulsic Implementation Solution — Unity™ Analog Router, Unity™ Custom Digital Router, and Unity™ Custom Digital Placer – provide automation … Read More → "Pulsic to Introduce Place and Route Implementation Solution for Analog and Custom Digital Design at DAC 2012"

Become an ultra-low-power expert and achieve ultimate power optimization with TI’s new ULP AdvisorTM software code analysis tool for MSP430TM microcontrollers

May 23, 2012

DALLAS (May 22, 2012) – Today, Texas Instruments Incorporated (TI) (NASDAQ: TXN) announced another ultra-low-power industry first with the ULP Advisor software code analysis tool, teaching developers how to create the most energy-efficient, ultra-low-power applications with TI’s MSP430 microcontrollers – and helping make the world greener one design at a time. Created by MSP430 microcontroller experts, the ULP Advisor tool is the first, true software-based, power-optimization teaching tool for microcontrollers that brings together decades of MSP430 microcontroller and ultra-low-power development experience. The ULP Advisor tool provides a static code analyzer that … Read More → "Become an ultra-low-power expert and achieve ultimate power optimization with TI’s new ULP AdvisorTM software code analysis tool for MSP430TM microcontrollers"

High Power PolyPhase® Synchronous Boost Controller Features -55°C to 150°C Operating Junction Temperature Range

May 23, 2012

MILPITAS, CA – May 23, 2012 – Linear Technology Corporation announces the H- and MP-grade versions of theLTC3787. This high power two-phase single output synchronous step-up DC/DC controller replaces the boost diodes with high efficiency N-channel MOSFETs, eliminating the heat sink typically required in medium to high power boost converters. The LTC3787 can produce a 24V at 10A output from a 12V input at up to 97% efficiency. … Read More → "High Power PolyPhase® Synchronous Boost Controller Features -55°C to 150°C Operating Junction Temperature Range"

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