News – Page 2017 – EEJournal

Meshlium Xtreme gives 3G connectivity to ZigBee, Wifi and Bluetooth Sensors

May 31, 2012

May 30th 2012 – The new multiprotocol router by Libelium allows the connection of any sensor or actuator to the Cloud via high speed 3G networks, opening a wide range of possibilities for the Internet of Things development.

Meshlium Xtreme is the new multiprotocol router for wireless sensor networks designed to connect ZigBee, Wifi and Bluetooth sensors to the Internet through 3G connectivity. The new line launched today allows the sending of information gathered by hundreds of sensor nodes at the same time, as it counts with an unprecedented “ … Read More → "Meshlium Xtreme gives 3G connectivity to ZigBee, Wifi and Bluetooth Sensors"

Xilinx Joins Semiconductor Industry Leaders at ConFab 2012: “Managing the New Economics of Semiconductor Manufacturing”

May 31, 2012

SAN JOSE, Calif., May 31, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at The ConFab 2012 Conference at The Encore at The Wynn in Las Vegas from June 3 – 6, 2012.

Xin Wu, Xilinx senior director of silicon technology, and Sandeep Bharathi, Xilinx vice president of engineering, and will join semiconductor fabrication industry leaders and decision makers from around the world to share perspectives on managing the new economics of semiconductor manufacturing.

What: The ConFab 2012 … Read More → "Xilinx Joins Semiconductor Industry Leaders at ConFab 2012: “Managing the New Economics of Semiconductor Manufacturing”"

Calypto Leverages Core Technology to Expand Product Portfolio, Announces Catapult Low-Power High-Level Synthesis

May 30, 2012

SANTA CLARA, Calif., – May 29, 2012 – Calypto® Design Systems, Inc., a leader in Electronic System Level (ESL) hardware design and Register Transfer Level (RTL) low power optimization, today announced Catapult^®Low-Power (LP), the industry’s first production quality, high-level synthesis (HLS) tool that adds power as an optimization goal. By leveraging Calypto’s existing best in class power analysis and optimization technology, Catapult LP provides a closed loop optimization across power, performance and area (PPA) to address the challenges of power-aware design.

Catapult LP takes advantage of Calypto’ … Read More → "Calypto Leverages Core Technology to Expand Product Portfolio, Announces Catapult Low-Power High-Level Synthesis"

Xilinx Ships World’s First Heterogeneous 3D FPGA

May 30, 2012

SAN JOSE, Calif. May 30, 2012 – Xilinx Inc., (NASDAQ: XLNX) today announced initial shipments of the Virtex®-7 H580T FPGA, the world’s first 3D heterogeneous all programmable product. Virtex-7 HT devices use Xilinx’s stacked silicon interconnect (SSI) technology to deliver the industry’s highest bandwidth FPGAs, featuring up to sixteen 28 Gbps and seventy-two 13.1 Gbps transceivers, making them the only single-chip solutions for addressing key Nx100G and 400G line card applications and functions. Combined with Xilinx’s leading 100 … Read More → "Xilinx Ships World’s First Heterogeneous 3D FPGA"

ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges

May 30, 2012

ANSYS (NASDAQ: ANSS) subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics at the Design Automation Conference (DAC).

Where: Design Automation Conference, Moscone Convention Center, San Francisco, CA, Booth #1813

When: Monday, June 3 through Wednesday, June 6, from 9:00 a.m. to 6:00 p.m.

What: Meet with Apache, its customers, and partners at DAC to hear leading companies … Read More → "ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges"

Atmel First to Achieve Certification for ZigBee Light Link, Golden Units for Lighting Reference Implementation

May 30, 2012

San Jose, CA, May 30, 2012 – Atmel® Corporation (Nasdaq: ATML), a leader in microcontroller (MCU) and touch solutions, today announced it is one of the first companies to achieve ZigBee® Certified product status using ZigBee Light Link™ Certification, a new industry standard to accelerate the design of easy-to-use consumer lighting and control products that will give consumers the ability to wirelessly control their LED fixtures, light bulbs, timers, remotes and switches within their homes.

With this reference implementation for ZigBee Light Link, Atmel has achieved ‘golden unit’ status, making it the benchmark against which future ZigBee … Read More → "Atmel First to Achieve Certification for ZigBee Light Link, Golden Units for Lighting Reference Implementation"

65V, 500mA Synchronous Buck Converter Delivers 90% Efficiency & Requires Only 12µA Quiescent Current

May 30, 2012

MILPITAS, CA – May 30, 2012 – Linear Technology announces the LTC3630, a 65V input-capable synchronous buck converter, which delivers up to 500mA of continuous output current from a 16-lead thermally enhanced 3mm x 5mm DFN or MSOP package. Its internal synchronous rectification topology delivers efficiencies as high as 90% and its Burst Mode® operation requires only 12µA of quiescent current (at no load), maximizing battery run time. The LTC3630 operates … Read More → "65V, 500mA Synchronous Buck Converter Delivers 90% Efficiency & Requires Only 12µA Quiescent Current"

Eurotech Simplifies the Internet of Things (IoT), Connecting Devices and Managing Data with Everyware Cloud(tm) 2.0

May 30, 2012

Columbia, MD – May 30, 2012 – Eurotech, a leading supplier of embedded technologies, products and systems, today announces the launch of the Everyware Cloud 2.0 platform providing a foundation to deliver and manage M2M data within the business enterprise. The Everyware Cloud offers proven cloud, M2M and Internet of Things (IoT) technologies to enable clients in the transportation, logistics, and industrial markets to reach their business goals.

“The intersection of three disciplines, device development tools, cloud services, and network infrastructure, creates an … Read More → "Eurotech Simplifies the Internet of Things (IoT), Connecting Devices and Managing Data with Everyware Cloud(tm) 2.0"

Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements

May 30, 2012

WILSONVILLE, Ore., May 30, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced TSMC will use the Calibre® SmartFill solution to achieve TSMC’s fill requirements for its 20nm manufacturing processes. SmartFill analysis and automatic filling capabilities in the Calibre YieldEnhancer product address new 20nm fill requirements that cannot be achieved with traditional dummy fill approaches. The Calibre SmartFill solution delivers smaller post-fill GDS database size and faster runtimes, allowing designers to meet IC fill constraints in a single pass without manual customization or modification, and with minimal impact on circuit performance.

New Capabilities for Advanced Fill … Read More → "Mentor Graphics’ Calibre SmartFill Addresses TSMC 20nm Fill Requirements"

XP Power release 15 Watt DIP24 DC-DC Converters with either 2:1 or 4:1 input ranges

May 30, 2012

XP Power today announced two new families to their line-up of ultra compact metal cased 15 Watt DC-DC converters. Available in an industry standard 24 pin DIP measuring just 1.25 x 0.8 x 0.4 inches (31.75 x 20.32 x 10.16 mm), the JCG15 and JTF15 series offer a power density of up to 37.5 Watts per cubic inch with an efficiency of up to 91%. Their compact size conserves board space, and the highly efficient design results in less wasted heat, assisting in the thermal management of the end system.

Providing the popular nominal inputs of + 12, + 24 or +48 VDC, the JCG15 series accommodates wide 2:1 input … Read More → "XP Power release 15 Watt DIP24 DC-DC Converters with either 2:1 or 4:1 input ranges"

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