News – Page 2012 – EEJournal

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments

July 11, 2012

HENDERSON, Nevada – July 10, 2012 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions, worked with Agilent Technologies to deliver a new co-simulation interface between the latest version of Riviera-PRO™, Aldec’s popular design simulation and verification platform used by FPGA, ASIC, and SoC development teams, and SystemVue, Agilent’s ESL design and signal processing environment used by system architects and algorithm developers in physical layer designs of wireless, RF and DSP applications. The new solution enables users to … Read More → "Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments"

Honeywell Introduces NBP Series Basic Board Mount Pressure Sensors

July 10, 2012

MINNEAPOLIS, July 10, 2012 – Honeywell (NYSE: HON) announced today the release of its new Basic Board Mount Pressure Sensors, NBP Series, the newest offering in its board mount pressure sensor product portfolio. These are a cost-effective, basic performance, mV output, unamplified, uncompensated, high quality and high resolution solution for customers seeking high-volume, economical board mount pressure sensors.

Honeywell’s NBP Series is ideal for customers who want to do their own compensation, calibration, and amplification to make use of the maximum resolution of the bare sensor output, leveraging a custom … Read More → "Honeywell Introduces NBP Series Basic Board Mount Pressure Sensors"

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments

July 10, 2012

Assembler Optimised Software Libraries for Texas Instruments DSPs

July 10, 2012

July 2012, Northwich, Cheshire. Kane Computing Ltd (KCL) today announced the release of new versions of the well-established GDD range of hand coded libraries to support the latest multi-core processors from Texas Instruments.

This family of assembler optimised products includes a DSP Vector Library; an ECC LINPACK Library, an EISPACK Library and an ECC BLAS Level 1/2/3 Library.

The latest versions now supports TI’s KeyStone-based TMS320C66x multicore DSP generation, including the TMS320C665x and TMS320C667x DSPs, as well as the TMS320C674x single core DSPs. The software also supports Sitara< … Read More → "Assembler Optimised Software Libraries for Texas Instruments DSPs"

Ericsson Unveils New High-Density Digital Power Module for Highly Efficient Power Consumption Control

July 10, 2012

New digital power module embeds ‘Ericsson DC/DC Energy Optimizer’ to deliver industry-leading energy-saving performance
Output voltage is a tightly regulated +/-2% over the full operational range from 36V to 75V
High and very flat efficiency curve from low- to full-load operation
Very fast response loop to input voltage transients
Output power up to 300W for datacom applications

Ericsson has unveiled the second model in its 32-bit processor-based FRIDA II 3E* digital Advanced Bus Converter (ABC) family: the BMR457. Following the launch last month of its … Read More → "Ericsson Unveils New High-Density Digital Power Module for Highly Efficient Power Consumption Control"

Xilinx Sponsors NI LabVIEW FPGA Innovation Award at NIWeek 2012

July 10, 2012

SAN JOSE, Calif. July 10, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its sponsorship of a Graphical System Design Achievement Award at NIWeek 2012. The featured award titled, “The NI LabVIEW FPGA Innovation Award,” will recognize the paper that details the most innovative application using National Instruments (NI) LabVIEW graphical system design software to program the field programmable gate array (FPGA) in NI hardware including PXI-based R Series … Read More → "Xilinx Sponsors NI LabVIEW FPGA Innovation Award at NIWeek 2012"

Chipmakers Adopt Cymer’s SmartPulse™

July 10, 2012

SAN DIEGO, July 9, 2012—Cymer, Inc. (Nasdaq: CYMI), the world’s leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its SmartPulse™ data management tool for light source performance monitoring has been adopted by leading chipmakers, with installations at multiple chipmaker sites around the world since its introduction in October 2011.

SmartPulse data can be uploaded to a fab-wide fault detection and classification (FDC) system, which … Read More → "Chipmakers Adopt Cymer’s SmartPulse™"

Imec First to Demonstrate Nanophotonics Components on 300mm Silicon Photonics Wafers Using Optical Lithography

July 10, 2012

SEMICON WEST (San Francisco, USA) – July 9, 2012 – Imec today announces the world-first realization of functional sub-100nm photonics components with optical lithography on 300mm silicon photonics wafer technology. Using 193nm immersion lithography, imec achieved the lowest propagation loss ever reported in silicon wire waveguides, and succeeded in patterning simpler and more efficient fiber couplers. Imec’s achievement is an important step in bringing Si photonics technology in line with CMOS industry standards.

Imec’s industrial affiliation program on optical I/O explores the use of photonics solutions for realizing high-bandwidth I/O in high performance computing systems. The … Read More → "Imec First to Demonstrate Nanophotonics Components on 300mm Silicon Photonics Wafers Using Optical Lithography"

KLA-Tencor Announces Installation of First 450mm-Capable Surfscan® SP3 Systems

July 10, 2012

MILPITAS, Calif., July 9, 2012 – Today KLA-Tencor Corporation (NASDAQ: KLAC) announced the installation of its first process control systems capable of handling and inspecting 450mm wafers: a new configuration of the market-leading Surfscan^® SP3 platform called the Surfscan SP3 450. Fully automated, these unpatterned wafer inspection systems are designed to meet the demanding defect and surface quality characterization requirements of the 20nm node and beyond, enabling control of the manufacturing process for 450mm polished silicon and epitaxial silicon substrates. The Surfscan SP3 450 also delivers critical capability for manufacturers of 450 … Read More → "KLA-Tencor Announces Installation of First 450mm-Capable Surfscan® SP3 Systems"

Flemish Government to Support imec’s 450mm Clean Room

July 9, 2012

SEMICON WEST (San Francisco, USA), July 9, 2012 – The Flemish Minister of Innovation, Ingrid Lieten, has announced to invest in the building of imec’s 450mm clean room facilities. Imec strives to keep playing a world-leading role in research on the most advanced semiconductor processes and technologies. With the combination of a state-of-the-art 300mm clean room and the transition to 450mm, imec will be able to keep on delivering its partners topnotch research on (sub)-10nm devices enabling the future growth of the global nanoelectronics industry.

To secure the future of the semiconductor industry in Europe, Europe must … Read More → "Flemish Government to Support imec’s 450mm Clean Room"