News – Page 2004 – EEJournal

Mentor Graphics Boosts Embedded System Power Efficiency by Extending Power Management Framework with Hibernate Capability

June 20, 2012

FREESCALE TECHNOLOGY FORUM, SAN ANTONIO, June 20, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced the addition of hibernate mode to its flagship Mentor® Embedded Nucleus® real time operating system (RTOS) Power Management Framework. Using the Nucleus RTOS, embedded software developers can minimize power consumption by taking advantage of the latest power saving technology, including dynamic voltage and frequency scaling (DVFS), clock gating and standby, and hibernate states—common in today’s processors. The first in a line of industry-leading devices to be supported with hibernate capability of the Nucleus Power Management Framework is the Freescale i.MX family of … Read More → "Mentor Graphics Boosts Embedded System Power Efficiency by Extending Power Management Framework with Hibernate Capability"

Tektronix Debuts Fully Automated Thunderbolt Transmitter Compliance Testing

June 19, 2012

BEAVERTON, Ore., June 19, 2012 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced the availability of a fully automated transmitter (Tx) compliance testing solution for Thunderbolt technology that provides the industry’s fastest test execution and time to answer. Tektronix also announced availability of setups to speed up Thunderbolt receiver (Rx) testing tasks.

Thunderbolt is a transformational I/O technology that provides a leap in performance and flexibility over current I/O technologies. It provides two 10 Gbps bi-directional, channels … Read More → "Tektronix Debuts Fully Automated Thunderbolt Transmitter Compliance Testing"

GainSpan’s GS1500M Module Achieves Wi-Fi Certified Wi-Fi Direct™ Certification

June 19, 2012

SAN JOSE, Calif., June 18, 2012 /PRNewswire/ — GainSpan® Corporation, a leader in low power Wi-Fi and Wi-Fi® connectivity for the Internet of Things, announced its low power GS1500M 802.11 b/g/n Wi-Fi module has achieved Read More → "GainSpan’s GS1500M Module Achieves Wi-Fi Certified Wi-Fi Direct™ Certification"

Timesys LinuxLink Bundled with Freescale Vybrid™ Controller Solutions

June 19, 2012

PITTSBURGH, June 19, 2012 /PRNewswire/ — Timesys Corporation (http://www.timesys.com), provider of the industry’s most-easy-to-use and affordable embedded Linux products and expert professional services, today announced that Freescale Semiconductor (NYSE: FSL) is expected to offer Timesys LinuxLink PRO Edition as the default software development option … Read More → "Timesys LinuxLink Bundled with Freescale Vybrid™ Controller Solutions"

Imec presents breakthrough results in resistive-switching (R)RAM

June 19, 2012

Leuven (Belgium), Honolulu (Hawaii, USA) – June 14, 2012 – At this week’s VLSI Technology Symposium (Honolulu, Hawaii, USA), imec presents significant improvements in performance and reliability of RRAM cells by process improvements and clever stack-engineering, and imec introduces a new modeling approach increasing the fundamental understanding of RRAM process technology. These achievements pave the way towards scalability and manufacturability of RRAM technology.

RRAM is a promising concept for future non-volatile memories because of its high speed, low energy operation, superior scalability, and compatibility with CMOS technology. Its operation relies on the voltage controlled resistance change of a conductive filament … Read More → "Imec presents breakthrough results in resistive-switching (R)RAM"

Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones

June 19, 2012

Sunnyvale, CA—June 19, 2012—Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.

Maxim’s newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more … Read More → "Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones"

New Excelsys 150 and 200 Watt LED Power Supplies Offer Lowest Profile in the Industry

June 19, 2012

Excelsys Technologies, leaders in high efficiency power supply design, announces the introduction of the latest models in their market leading Xled series of LED power supplies.

The LDB 150 LED and LDB 200 power supplies provide 150 watts and 200 Watts of Constant Current/Constant Voltage power respectively in an IP67 rated, low profile, aluminium case measuring only 198 x 63 x < … Read More → "New Excelsys 150 and 200 Watt LED Power Supplies Offer Lowest Profile in the Industry"

Digi-Key Corporation and Anaren Sign Global Distribution Agreement

June 19, 2012

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest … Read More → "Digi-Key Corporation and Anaren Sign Global Distribution Agreement"

Molex FAKRA II SMB Connectors Meet High Mechanical and Environmental Requirements of the Automotive Industry

June 19, 2012

LISLE, IL – June 19, 2012 – Molex Incorporated today launched the FAKRA II SMB connectors, offering enhancements to the original high-performance FAKRA connector. Meeting both American and German FAKRA Read More → "Molex FAKRA II SMB Connectors Meet High Mechanical and Environmental Requirements of the Automotive Industry"

X-Ray Imaging Applications to Benefit from Development of Wafer-Scale CMOS Imaging Technology

June 19, 2012

Advanced sensor for medical imaging applications developed by the Science and Technology Facilities Council’s Rutherford Appleton Laboratory
Highly innovative imager enabled by advanced analog design tools from Tanner EDA and leading-edge CMOS Image Sensor manufacturing process technology from TowerJazz
Innovative three-sided ‘buttable’ high-resolution high-frame-rate sensor integrates 6.7 million pixels on 50-micron pitch for mammography applications

Harwell, UK – June 19, 2012 – A highly innovative high-resolution wafer-scale digital image sensor that targets medical imaging applications has been developed at the Science and Technology Facilities Council’s (STFC) Rutherford Appleton Laboratory (RAL). One of the key … Read More → "X-Ray Imaging Applications to Benefit from Development of Wafer-Scale CMOS Imaging Technology"